Integrated Circuits and Systems for Smart Sensory Applications

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware

Design techniques for low power mixed analog-digital circuits with application to smart wireless systems.

This dissertation presents and discusses new design techniques for mixed analog-digital circuits with emphases on low power and small area for standard low-cost CMOS VLSI technology. The application domain of the devised techniques is radio frequency identification (RFID) systems, however the presented techniques are applicable to wide range of mixed mode analog-digital applications. Hence the techniques herein apply to a range of smart wireless or mobile systems. The integration of both analog and digital circuits on a single substrate has many benefits such as reducing the system power, increasing the system reliability, reducing the system size and providing high inter-system communications speed - hence, a cost effective system implementation with increased performance. On the other hand, some difficulties arise from the fact that standard low-cost CMOS technologies are tuned toward maximising digital circuit performance and increasing transistor density per unit area. Usually these technologies have a wide spread in transistor parameters that require new design techniques that provide circuit characteristics based on relative transistor parameters rather than on the absolute value of these parameters. This research has identified new design techniques for mostly analog and some digital circuits for implementation in standard CMOS technologies with design parameters dependent on the relative values of process parameters, resulting in technology independent circuit design techniques. The techniques presented and discussed in this dissertation are (i) applied to the design of low-voltage and low-power controlled gain amplifiers, (ii) digital trimming techniques for operational amplifiers, (iii) low-power and low-voltage Schmitt trigger circuits, (iv) very low frequency to medium frequency low power oscillators, (v) low power Gray code counters, (vi) analog circuits utilising the neuron MOS transistor, (vii) high value floating resistors, and (viii) low power application specific integrated circuits (ASICs) that are particularly needed in radio frequency identification systems. The new techniques are analysed, simulated and verified experimentally via five chips fabricated through the MOSIS service.Thesis (Ph.D.) -- University of Adelaide, School of Electrical and Electronic Engineering, 200

A new optical UWB modulation technique for 250Mbps wireless link in implantable biotelemetry systems

We propose a new UWB modulation technique for wireless optical communications in transcutaneous biotelemetry. The solution, based on the generation of sub-nanoseconds laser pulses, allows for a high data rate link whilst achieving a significant power reduction (energy per bit) compared to the state-ofthe- art. These features make this particularly suitable for emerging biomedical applications such as implantable neural/biosensor systems. The relatively simple architecture consists of a transmitter and receiver that can be integrated in a standard CMOS technology in a compact Silicon footprint (lower than 1mm^2 in a 0.18μm technology). These parts, optimised for low-voltage/low-power operation, include coding and decoding digital systems, biasing and driving analogue circuits for laser pulse generation and photodiode signal conditioning. Experimental findings with prototype PCBs have validated the new paradigm showing the system capabilities to achieve a BER less than 10^-9 with data rate up to 250Mbps and estimated total power consumption lower than 5mW

Low-Power Energy Efficient Circuit Techniques for Small IoT Systems

Although the improvement in circuit speed has been limited in recent years, there has been increased focus on the internet of things (IoT) as technology scaling has decreased circuit size, power usage and cost. This trend has led to the development of many small sensor systems with affordable costs and diverse functions, offering people convenient connection with and control over their surroundings. This dissertation discusses the major challenges and their solutions in realizing small IoT systems, focusing on non-digital blocks, such as power converters and analog sensing blocks, which have difficulty in following the traditional scaling trends of digital circuits. To accommodate the limited energy storage and harvesting capacity of small IoT systems, this dissertation presents an energy harvester and voltage regulators with low quiescent power and good efficiency in ultra-low power ranges. Switched-capacitor-based converters with wide-range energy-efficient voltage-controlled oscillators assisted by power-efficient self-oscillating voltage doublers and new cascaded converter topologies for more conversion ratio configurability achieve efficient power conversion down to several nanowatts. To further improve the power efficiency of these systems, analog circuits essential to most wireless IoT systems are also discussed and improved. A capacitance-to-digital sensor interface and a clocked comparator design are improved by their digital-like implementation and operation in phase and frequency domain. Thanks to the removal of large passive elements and complex analog blocks, both designs achieve excellent area reduction while maintaining state-of-art energy efficiencies. Finally, a technique for removing dynamic voltage and temperature variations is presented as smaller circuits in advanced technologies are more vulnerable to these variations. A 2-D simultaneous feedback control using an on-chip oven control locks the supply voltage and temperature of a small on-chip domain and protects circuits in this locked domain from external voltage and temperature changes, demonstrating 0.0066 V/V and 0.013 °C/°C sensitivities to external changes. Simple digital implementation of the sensors and most parts of the control loops allows robust operation within wide voltage and temperature ranges.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/138743/1/wanyeong_1.pd

Efficient DSP and Circuit Architectures for Massive MIMO: State-of-the-Art and Future Directions

Massive MIMO is a compelling wireless access concept that relies on the use of an excess number of base-station antennas, relative to the number of active terminals. This technology is a main component of 5G New Radio (NR) and addresses all important requirements of future wireless standards: a great capacity increase, the support of many simultaneous users, and improvement in energy efficiency. Massive MIMO requires the simultaneous processing of signals from many antenna chains, and computational operations on large matrices. The complexity of the digital processing has been viewed as a fundamental obstacle to the feasibility of Massive MIMO in the past. Recent advances on system-algorithm-hardware co-design have led to extremely energy-efficient implementations. These exploit opportunities in deeply-scaled silicon technologies and perform partly distributed processing to cope with the bottlenecks encountered in the interconnection of many signals. For example, prototype ASIC implementations have demonstrated zero-forcing precoding in real time at a 55 mW power consumption (20 MHz bandwidth, 128 antennas, multiplexing of 8 terminals). Coarse and even error-prone digital processing in the antenna paths permits a reduction of consumption with a factor of 2 to 5. This article summarizes the fundamental technical contributions to efficient digital signal processing for Massive MIMO. The opportunities and constraints on operating on low-complexity RF and analog hardware chains are clarified. It illustrates how terminals can benefit from improved energy efficiency. The status of technology and real-life prototypes discussed. Open challenges and directions for future research are suggested.Comment: submitted to IEEE transactions on signal processin

Communication channel analysis and real time compressed sensing for high density neural recording devices

Next generation neural recording and Brain- Machine Interface (BMI) devices call for high density or distributed systems with more than 1000 recording sites. As the recording site density grows, the device generates data on the scale of several hundred megabits per second (Mbps). Transmitting such large amounts of data induces significant power consumption and heat dissipation for the implanted electronics. Facing these constraints, efficient on-chip compression techniques become essential to the reduction of implanted systems power consumption. This paper analyzes the communication channel constraints for high density neural recording devices. This paper then quantifies the improvement on communication channel using efficient on-chip compression methods. Finally, This paper describes a Compressed Sensing (CS) based system that can reduce the data rate by > 10x times while using power on the order of a few hundred nW per recording channel

Guest editorial for the special issue on software-defined radio transceivers and circuits for 5G wireless communications

Yichuang Sun, Baoyong Chi, and Heng Zhang, Guest Editorial for the Special Issue on Software-Defined Radio Transceivers and Circuits for 5G Wireless Communications, published in IEEEE Transactions on Circuits and Systems II: Express Briefs, Vol. 63 (1): 1-3, January 2016, doi: https://doi.org/10.1109/TCSII.2015.2506979.Peer reviewedFinal Accepted Versio

A fully integrated 24-GHz phased-array transmitter in CMOS

This paper presents the first fully integrated 24-GHz phased-array transmitter designed using 0.18-/spl mu/m CMOS transistors. The four-element array includes four on-chip CMOS power amplifiers, with outputs matched to 50 /spl Omega/, that are each capable of generating up to 14.5 dBm of output power at 24 GHz. The heterodyne transmitter has a two-step quadrature up-conversion architecture with local oscillator (LO) frequencies of 4.8 and 19.2 GHz, which are generated by an on-chip frequency synthesizer. Four-bit LO path phase shifting is implemented in each element at 19.2 GHz, and the transmitter achieves a peak-to-null ratio of 23 dB with raw beam-steering resolution of 7/spl deg/ for radiation normal to the array. The transmitter can support data rates of 500 Mb/s on each channel (with BPSK modulation) and occupies 6.8 mm /spl times/ 2.1 mm of die area

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads