Robust and reliable hardware accelerator design through high-level synthesis

System-on-chip design is becoming increasingly complex as technology scaling enables more and more functionality on a chip. This scaling-driven complexity has resulted in a variety of reliability and validation challenges including logic bugs, hot spots, wear-out, and soft errors. To make matters worse, as we reach the limits of Dennard scaling, efforts to improve system performance and energy efficiency have resulted in the integration of a wide variety of complex hardware accelerators in SoCs. Thus the challenge is to design complex, custom hardware that is efficient, but also correct and reliable. High-level synthesis shows promise to address the problem of complex hardware design by providing a bridge from the high-productivity software domain to the hardware design process. Much research has been done on high-level synthesis efficiency optimizations. This dissertation shows that high-level synthesis also has the power to address validation and reliability challenges through three automated solutions targeting three key stages in the hardware design and use cycle: pre-silicon debugging, post-silicon validation, and post-deployment error detection. Our solution for rapid pre-silicon debugging of accelerator designs is hybrid tracing: comparing a datapath-level trace of hardware execution with a reference software implementation at a fine temporal and spatial granularity to detect logic bugs. An integrated backtrace process delivers source-code meaning to the hardware designer, pinpointing the location of bug activation and providing a strong hint for potential bug fixes. Experimental results show that we are able to detect and aid in localization of logic bugs from both C/C++ specifications as well as the high-level synthesis engine itself. A variation of this solution tailored for rapid post-silicon validation of accelerator designs is hybrid hashing: inserting signature generation logic in a hardware design to create a heavily compressed signature stream that captures the internal behavior of the design at a fine temporal and spatial granularity for comparison with a reference set of signatures generated by high-level simulation to detect bugs. Using hybrid hashing, we demonstrate an improvement in error detection latency (time elapsed from when a bug is activated to when it manifests as an observable failure) of two orders of magnitude and a threefold improvement in bug coverage compared to traditional post-silicon validation techniques. Hybrid hashing also uncovered previously unknown bugs in the CHStone benchmark suite, which is widely used by the HLS community. Hybrid hashing incurs less than 10% area overhead for the accelerator it validates with negligible performance impact, and we also introduce techniques to minimize any possible intrusiveness introduced by hybrid hashing. Finally, our solution for post-deployment error detection is modulo-3 shadow datapaths: performing lightweight shadow computations in modulo-3 space for each main computation. We leverage the binding and scheduling flexibility of high-level synthesis to detect control errors through diverse binding and minimize area cost through intelligent checkpoint scheduling and modulo-3 reducer sharing. We introduce logic and dataflow optimizations to further reduce cost. We evaluated our technique with 12 high-level synthesis benchmarks from the arithmetic-oriented PolyBench benchmark suite using FPGA emulated netlist-level error injection. We observe coverages of 99.1% for stuck-at faults, 99.5% for soft errors, and 99.6% for timing errors with a 25.7% area cost and negligible performance impact. Leveraging a mean error detection latency of 12.75 cycles (4150× faster than end result check) for soft errors, we also explore a rollback recovery method with an additional area cost of 28.0%, observing a 175× increase in reliability against soft errors. While the area cost of our modulo shadow datapaths is much better than traditional modular redundancy approaches, we want to maximize the applicability of our approach. To this end, we take a dive into gate-level architectural design for modulo arithmetic functional units. We introduce new low-cost gate-level architectures for all four key functional units in a shadow datapath: (1) a modulo reduction algorithm that generates architectures consisting entirely of full-adder standard cells; (2) minimum-area modulo adder and subtractor architectures; (3) an array-based modulo multiplier design; and (4) a modulo equality comparator that handles the residue encoding produced by the above. We compare our new functional units to the previous state-of-the-art approach, observing a 12.5% reduction in area and a 47.1% reduction in delay for a 32-bit mod-3 reducer; that our reducer costs, which tend to dominate shadow datapath costs, do not increase with larger modulo bases; and that for modulo-15 and above, all of our modulo functional units have better area and delay then their previous counterparts. We also demonstrate the practicality of our approach by designing a custom shadow datapath for error detection of a multiply accumulate functional unit, which has an area overhead of only 12% for a 32-bit main datapath and 2-bit modulo-3 shadow datapath. Taking our reliability solution further, we look at the bigger picture of modulo shadow datapaths combined with other solutions at different abstraction layers, looking to answer the following question: Given all of the existing reliability improvement techniques for application-specific hardware accelerators, what techniques or combinations of techniques are the most cost-effective? To answer this question, we consider a soft error fault model and empirically evaluate cross-layer combinations of ABFT, EDDI, and modulo shadow datapaths in the context of high-level synthesis; parity in logic synthesis; and flip-flop hardening techniques at the physical design level. We measure the reliability benefit and area, energy, and performance cost of each technique individually and for interesting technique combinations through FPGA emulated fault-injection and physical place-and-route. Our results show that a combination of parity and flip-flop hardening is the most cost-effective in general with an average 1.3% area cost and 5.7% energy cost for a 50× improvement in reliability. The addition of modulo-3 shadow datapaths to this combination provides some additional benefit for some applications, even without considering its combinational logic, stuck-at fault, and timing error protection benefits. We also observe new efficiency challenges for ABFT and EDDI when used for hardware accelerators

A computer-aided design for digital filter implementation

Imperial Users onl

Autonomously Reconfigurable Artificial Neural Network on a Chip

Artificial neural network (ANN), an established bio-inspired computing paradigm, has proved very effective in a variety of real-world problems and particularly useful for various emerging biomedical applications using specialized ANN hardware. Unfortunately, these ANN-based systems are increasingly vulnerable to both transient and permanent faults due to unrelenting advances in CMOS technology scaling, which sometimes can be catastrophic. The considerable resource and energy consumption and the lack of dynamic adaptability make conventional fault-tolerant techniques unsuitable for future portable medical solutions. Inspired by the self-healing and self-recovery mechanisms of human nervous system, this research seeks to address reliability issues of ANN-based hardware by proposing an Autonomously Reconfigurable Artificial Neural Network (ARANN) architectural framework. Leveraging the homogeneous structural characteristics of neural networks, ARANN is capable of adapting its structures and operations, both algorithmically and microarchitecturally, to react to unexpected neuron failures. Specifically, we propose three key techniques --- Distributed ANN, Decoupled Virtual-to-Physical Neuron Mapping, and Dual-Layer Synchronization --- to achieve cost-effective structural adaptation and ensure accurate system recovery. Moreover, an ARANN-enabled self-optimizing workflow is presented to adaptively explore a "Pareto-optimal" neural network structure for a given application, on the fly. Implemented and demonstrated on a Virtex-5 FPGA, ARANN can cover and adapt 93% chip area (neurons) with less than 1% chip overhead and O(n) reconfiguration latency. A detailed performance analysis has been completed based on various recovery scenarios

The 1991 3rd NASA Symposium on VLSI Design

Papers from the symposium are presented from the following sessions: (1) featured presentations 1; (2) very large scale integration (VLSI) circuit design; (3) VLSI architecture 1; (4) featured presentations 2; (5) neural networks; (6) VLSI architectures 2; (7) featured presentations 3; (8) verification 1; (9) analog design; (10) verification 2; (11) design innovations 1; (12) asynchronous design; and (13) design innovations 2

Space Communications: Theory and Applications. Volume 3: Information Processing and Advanced Techniques. A Bibliography, 1958 - 1963

Annotated bibliography on information processing and advanced communication techniques - theory and applications of space communication

CEPC Technical Design Report -- Accelerator (v2)

The Circular Electron Positron Collider (CEPC) is a large scientific project initiated and hosted by China, fostered through extensive collaboration with international partners. The complex comprises four accelerators: a 30 GeV Linac, a 1.1 GeV Damping Ring, a Booster capable of achieving energies up to 180 GeV, and a Collider operating at varying energy modes (Z, W, H, and ttbar). The Linac and Damping Ring are situated on the surface, while the Booster and Collider are housed in a 100 km circumference underground tunnel, strategically accommodating future expansion with provisions for a Super Proton Proton Collider (SPPC). The CEPC primarily serves as a Higgs factory. In its baseline design with synchrotron radiation (SR) power of 30 MW per beam, it can achieve a luminosity of 5e34 /cm^2/s^1, resulting in an integrated luminosity of 13 /ab for two interaction points over a decade, producing 2.6 million Higgs bosons. Increasing the SR power to 50 MW per beam expands the CEPC's capability to generate 4.3 million Higgs bosons, facilitating precise measurements of Higgs coupling at sub-percent levels, exceeding the precision expected from the HL-LHC by an order of magnitude. This Technical Design Report (TDR) follows the Preliminary Conceptual Design Report (Pre-CDR, 2015) and the Conceptual Design Report (CDR, 2018), comprehensively detailing the machine's layout and performance, physical design and analysis, technical systems design, R&D and prototyping efforts, and associated civil engineering aspects. Additionally, it includes a cost estimate and a preliminary construction timeline, establishing a framework for forthcoming engineering design phase and site selection procedures. Construction is anticipated to begin around 2027-2028, pending government approval, with an estimated duration of 8 years. The commencement of experiments could potentially initiate in the mid-2030s.Comment: 1106 page

Selected Papers from the First International Symposium on Future ICT (Future-ICT 2019) in Conjunction with 4th International Symposium on Mobile Internet Security (MobiSec 2019)

The International Symposium on Future ICT (Future-ICT 2019) in conjunction with the 4th International Symposium on Mobile Internet Security (MobiSec 2019) was held on 17–19 October 2019 in Taichung, Taiwan. The symposium provided academic and industry professionals an opportunity to discuss the latest issues and progress in advancing smart applications based on future ICT and its relative security. The symposium aimed to publish high-quality papers strictly related to the various theories and practical applications concerning advanced smart applications, future ICT, and related communications and networks. It was expected that the symposium and its publications would be a trigger for further related research and technology improvements in this field

MOCAST 2021

The 10th International Conference on Modern Circuit and System Technologies on Electronics and Communications (MOCAST 2021) will take place in Thessaloniki, Greece, from July 5th to July 7th, 2021. The MOCAST technical program includes all aspects of circuit and system technologies, from modeling to design, verification, implementation, and application. This Special Issue presents extended versions of top-ranking papers in the conference. The topics of MOCAST include:Analog/RF and mixed signal circuits;Digital circuits and systems design;Nonlinear circuits and systems;Device and circuit modeling;High-performance embedded systems;Systems and applications;Sensors and systems;Machine learning and AI applications;Communication; Network systems;Power management;Imagers, MEMS, medical, and displays;Radiation front ends (nuclear and space application);Education in circuits, systems, and communications