9 research outputs found

    Imaging the mechanical properties of nanowire arrays

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    Dimensional and contact resonance (CR) images of nanowire (NW) arrays are measured using our new-developed CR imaging (CRI) setup. Then a reference method is employed to calculate the indentation modulus of NWs (Mi,NW) representing the elasticity of NWs, by measuring NW arrays (NWAs) and reference samples at the same static probing force. Furthermore, topography is imaged in combination with CR and Mi,NW separately by software, whereby the relation between both parameters of NWAs is visualized. As typical examples, 3D imaging of topography and Mi,NW is performed with Si pillar, Cu and ZnO NWAs. The novel method allows for fast mechanical performance measurements of large-scale vertically-aligned NW arrays (NWAs) without releasing them from their substrates

    In-line measurement of the surface texture of rolls using long slender piezoresistive microprobes

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    Long slender piezoresistive silicon microprobes are a new type of sensor for measurement of surface roughness. Their advantage is the ability to measure at speeds of up to 15 mm/s, which is much faster than conventional stylus probes. The drawbacks are their small measurement range and tendency to break easily when deflected by more than the allowed range of 1 mm. In this article, previously developed microprobes were tested in the laboratory to evaluate their metrological properties, then tested under industrial conditions. There are several industrial measurement applications in which microprobes are useful. Measurement of the roughness of paper machine rolls was selected for testing in this study. The integration of a microprobe into an existing roll measurement device is presented together with the measurement results. The results are promising, indicating that measurements using a microprobe can give useful data on the grinding process

    Calibrating a high-speed contact-resonance profilometer

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    A European EMPIR project, which aims to use large-scale, 5 mm × 200 µm × 50 µm (L×W×H), piezoresistive microprobes for contact resonance applications, a well-established measurement mode of atomic force microscopes (AFMs), is being funded. As the probes used in this project are much larger in size than typical AFM probes, however, some of the simplifications and assumptions made for AFM probes are not applicable. This study presents a guide on how to systematically create a model that replicates the dynamic behavior of microprobes. The model includes variables such as air damping, nonlinear sensitivities, and frequency dependencies. The finished model is then verified by analyzing a series of measurements

    Design and Applications of Coordinate Measuring Machines

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    Coordinate measuring machines (CMMs) have been conventionally used in industry for 3-dimensional and form-error measurements of macro parts for many years. Ever since the first CMM, developed by Ferranti Co. in the late 1950s, they have been regarded as versatile measuring equipment, yet many CMMs on the market still have inherent systematic errors due to the violation of the Abbe Principle in its design. Current CMMs are only suitable for part tolerance above 10 μm. With the rapid advent of ultraprecision technology, multi-axis machining, and micro/nanotechnology over the past twenty years, new types of ultraprecision and micro/nao-CMMs are urgently needed in all aspects of society. This Special Issue accepted papers revealing novel designs and applications of CMMs, including structures, probes, miniaturization, measuring paths, accuracy enhancement, error compensation, etc. Detailed design principles in sciences, and technological applications in high-tech industries, were required for submission. Topics covered, but were not limited to, the following areas: 1. New types of CMMs, such as Abbe-free, multi-axis, cylindrical, parallel, etc. 2. New types of probes, such as touch-trigger, scanning, hybrid, non-contact, microscopic, etc. 3. New types of Micro/nano-CMMs. 4. New types of measuring path strategy, such as collision avoidance, free-form surface, aspheric surface, etc. 5. New types of error compensation strategy

    EUROSENSORS XVII : book of abstracts

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    Fundação Calouste Gulbenkien (FCG).Fundação para a Ciência e a Tecnologia (FCT)

    Development and validation of a 3D vibrating contact probe for micro-CMMs

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    The state-of-the-art in dimensional metrology in terms of accuracy and 3D measurement is the micro-co-ordinate measuring machine, or micro-CMM. Current manufacturing trends are inclined towards miniaturisation, and all developments in this area are dependent on the capabilities of dimensional metrologists. Currently, the main limiting factor in the advancement of co-ordinate metrology at the micrometre scale is the design, manufacture and resulting accuracy of contacting micro-CMM probes. With this in mind, this thesis describes the development of a novel 3D vibrating micro-CMM probe. The main contributions of this thesis are as follows. Firstly, the current state of contact probing at the micrometre scale is reviewed and a clear set of knowledge gaps are identied for developments in this area. Secondly, the concept of a novel 3D vibrating micro-CMM probe is introduced as the background knowledge for this thesis. The mechanical and electrical properties of this vibrating micro-probe are modelled, as well as its intended operation. The operational model of the vibrating microprobe focusses on the surface interaction forces that are prevalent when probing at the micrometre scale. Thirdly, the operation of the vibrating micro-probe is validated experimentally. Initially, the ability of the vibrating micro-probe to counteract the surface interaction forces is investigated. Other areas of validation are in the determination of the probing point repeatability, the linearity error, and isotropy of the probe. Finally, the intended operation of the probe is compared to current national and international specication standards and guidelines for the operation of CMM probes. This work is directly aimed at ensuring that the developed vibrating micro-probe is capable of operating in an industrial or commercial metrology environment. A detailed set of operating strategies are also developed for ecient use of the vibrating micro-probe. It is concluded that the developed vibrating micro-probe will be able to address the current needs of the micro-CMM community. It is also concluded that the vibrating micro-probe has the ability to operate in a non-contact mode, further increasing its usefulness

    Development and validation of a 3D vibrating contact probe for micro-CMMs

    Get PDF
    The state-of-the-art in dimensional metrology in terms of accuracy and 3D measurement is the micro-co-ordinate measuring machine, or micro-CMM. Current manufacturing trends are inclined towards miniaturisation, and all developments in this area are dependent on the capabilities of dimensional metrologists. Currently, the main limiting factor in the advancement of co-ordinate metrology at the micrometre scale is the design, manufacture and resulting accuracy of contacting micro-CMM probes. With this in mind, this thesis describes the development of a novel 3D vibrating micro-CMM probe. The main contributions of this thesis are as follows. Firstly, the current state of contact probing at the micrometre scale is reviewed and a clear set of knowledge gaps are identied for developments in this area. Secondly, the concept of a novel 3D vibrating micro-CMM probe is introduced as the background knowledge for this thesis. The mechanical and electrical properties of this vibrating micro-probe are modelled, as well as its intended operation. The operational model of the vibrating microprobe focusses on the surface interaction forces that are prevalent when probing at the micrometre scale. Thirdly, the operation of the vibrating micro-probe is validated experimentally. Initially, the ability of the vibrating micro-probe to counteract the surface interaction forces is investigated. Other areas of validation are in the determination of the probing point repeatability, the linearity error, and isotropy of the probe. Finally, the intended operation of the probe is compared to current national and international specication standards and guidelines for the operation of CMM probes. This work is directly aimed at ensuring that the developed vibrating micro-probe is capable of operating in an industrial or commercial metrology environment. A detailed set of operating strategies are also developed for ecient use of the vibrating micro-probe. It is concluded that the developed vibrating micro-probe will be able to address the current needs of the micro-CMM community. It is also concluded that the vibrating micro-probe has the ability to operate in a non-contact mode, further increasing its usefulness

    Long Slender Piezo-Resistive Silicon Microprobes for Fast Measurements of Roughness and Mechanical Properties inside Micro-Holes with Diameters below 100 µm

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    During the past decade, piezo-resistive cantilever type silicon microprobes for high-speed roughness measurements inside high-aspect-ratio microstructures, like injection nozzles or critical gas nozzles have been developed. This article summarizes their metrological properties for fast roughness and shape measurements including noise, damping, tip form, tip wear, and probing forces and presents the first results on the measurement of mechanical surface parameters. Due to the small mass of the cantilever microprobes, roughness measurements at very high traverse speeds up to 15 mm/s are possible. At these high scanning speeds, considerable wear of the integrated silicon tips was observed in the past. In this paper, a new tip-testing artefact with rectangular grooves of different width was used to measure this wear and to measure the tip shape, which is needed for morphological filtering of the measured profiles and, thus, for accurate form measurements. To reduce tip wear, the integrated silicon tips were replaced by low-wear spherical diamond tips of a 2 µm radius. Currently, a compact microprobe device with an integrated feed-unit is being developed for high-speed roughness measurements on manufacturing machines. First measurements on sinusoidal artefacts were carried out successfully. Moreover, the first measurements of the elastic modulus of a polymer surface applying the contact resonance measurement principle are presented, which indicates the high potential of these microprobes for simultaneous high-speed roughness and mechanical parameter measurements.EMPIR projects are co-funded by the European Union’s (EU) Horizon 2020 research and innovation programme and the EMPIR participating states
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