Noise shaping Asynchronous SAR ADC based time to digital converter

Time-to-digital converters (TDCs) are key elements for the digitization of timing information in modern mixed-signal circuits such as digital PLLs, DLLs, ADCs, and on-chip jitter-monitoring circuits. Especially, high-resolution TDCs are increasingly employed in on-chip timing tests, such as jitter and clock skew measurements, as advanced fabrication technologies allow fine on-chip time resolutions. Its main purpose is to quantize the time interval of a pulse signal or the time interval between the rising edges of two clock signals. Similarly to ADCs, the performance of TDCs are also primarily characterized by Resolution, Sampling Rate, FOM, SNDR, Dynamic Range and DNL/INL. This work proposes and demonstrates 2nd order noise shaping Asynchronous SAR ADC based TDC architecture with highest resolution of 0.25 ps among current state of art designs with respect to post-layout simulation results. This circuit is a combination of low power/High Resolution 2nd Order Noise Shaped Asynchronous SAR ADC backend with simple Time to Amplitude converter (TAC) front-end and is implemented in 40nm CMOS technology. Additionally, special emphasis is given on the discussion on various current state of art TDC architectures.Electrical and Computer Engineerin

縦型ボディチャネルMOS Field-Effect Transistorを用いたマイクロプロセッサ向け高効率・高集積DC-DCコンバータとそのパワーマネジメントに関する研究

Tohoku University遠藤哲郎課

Novel techniques for the design and practical realization of switched-capacitor circuits in deep-submicron CMOS technologies

Dissertação apresentada para obtenção do Grau de Doutor em Engenharia Electrotécnica e de Computadores pela Universidade Nova de Lisboa, Faculdade de Ciências e TecnologiaSwitches presenting high linearity are more and more required in switched-capacitor circuits,namely in 12 to 16 bits resolution analog-to-digital converters. The CMOS technology evolves continuously towards lower supply voltages and, simultaneously, new design techniques are necessary to fulfill the realization of switches exhibiting a high dynamic range and a distortion compatible with referred resolutions. Moreover, with the continuously downing of the sizes, the physic constraints of the technology must be considered to avoid the excessive stress of the devices when relatively high voltages are applied to the gates. New switch-linearization techniques, with high reliability, must be necessarily developed and demonstrated in CMOS integrated circuits. Also, the research of new structures of circuits with switched-capacitor is permanent. Simplified and efficient structures are mandatory, adequate to the new demands emerging from the proliferation of portable equipments, necessarily with low energy consumption while assuring high performance and multiple functions. The work reported in this Thesis comprises these two areas. The behavior of the switches under these new constraints is analyzed, being a new and original solution proposed, in order to maintain the performance. Also, proposals for the application of simpler clock and control schemes are presented, and for the use of open-loop structures and amplifiers with localfeedback. The results, obtained in laboratory or by simulation, assess the feasibility of the presented proposals

Research on low power technology by AC power supply circuits

制度:新 ; 報告番号:甲3692号 ; 学位の種類:博士(工学) ; 授与年月日:2012/9/15 ; 早大学位記番号:新6060Waseda Universit

Integrated high-voltage switched-capacitor DC-DC converters

The focus of this work is on the integrated circuit (IC) level integration of high-voltage switched-capacitor (SC) converters with the goal of fully integrated power management solutions for system-on-chip (SoC) and system-in-pagage (SiP) applications. The full integration of SC converters provides a low cost and compact power supply solution for modern electronics. Currently, there are almost no fully integrated SC converters with input voltages above 5 V. The purpose of this work is to provide solutions for higher input voltages. The increasing challenges of a compact and efficient power supply on the chip are addressed. High-voltage rated components and the increased losses caused by parasitics not only reduce power density but also efficiency. Loss mechanisms in high-voltage SC converters are investigated resulting in an optimized model for high-voltage SC converters. The model developed allows an appropriate comparison of different semiconductor technologies and converter topologies. Methods and design proposals for loss reduction are presented. Control of power switches with their supporting circuits is a further challenge for high-voltage SC converters. The aim of this work is to develop fully integrated SC converters with a wide input voltage range. Different topologies and concepts are investigated. The implemented fully integrated SC converter has an input voltage range of 2 V to 13 V. This is twice the range of existing converters. This is achieved by an implemented buck and boost mode as well as 17 conversion ratios. Experimental results show a peak efficiency of 81.5%. This is the highest published peak efficiency for fully integrated SC converters with an input voltage > 5V. With the help of the model developed in this work, a three-phase SC converter topology for input voltages up to 60 V is derived and then investigated and discussed. Another focus of this work is on the power supply of sensor nodes and smart home applications with low-power consumption. Highly integrated micro power supplies that operate directly from mains voltage are particularly suitable for these applications. The micro power supply proposed in this work utilizes the high-voltage SC converter developed. The output power is 14 times higher and the power density eleven times higher than prior work. Since plenty of power switches are built into modern multi-ratio SC converters, the switch control circuits must be optimized with regard to low-power consumption and area requirements. In this work, different level shifter concepts are investigated and a low-power high-voltage level shifter for 50 V applications based on a capacitive level shifter is introduced. The level shifter developed exceeds the state of the art by a factor of more than eleven with a power consumption of 2.1pJ per transition. A propagation delay of 1.45 ns is achieved. The presented high-voltage level shifter is the first level shifter for 50 V applications with a propagation delay below 2 ns and power consumption below 20pJ per transition. Compared to the state of the art, the figure of merit is significantly improved by a factor of two. Furthermore, various charge pump concepts are investigated and evaluated within the context of this work. The charge pump, optimized in this work, improves the state of the art by a factor of 1.6 in terms of efficiency. Bidirectional switches must be implemented at certain locations within the power stage to prevent reverse conduction. The topology of a bidirectional switch developed in this work reduces the dynamic switching losses by 70% and the area consumption including the required charge pumps by up to 65% compared to the state of the art. These improvements make it possible to control the power switches in a fast and efficient way. Index terms — integrated power management, high input voltage, multi-ratio SC converter, level shifter, bidirectional switch, micro power supplyDer Schwerpunkt dieser Arbeit liegt auf der Erforschung von Switched-Capacitor (SC) Spannungswandler für höhere Eingangsspannungen. Ziel der Arbeit ist es Lösungen für ein voll auf dem Halbleiterchip integriertes Power Management anzubieten um System on Chip (SoC) und System in Package (SiP) zu ermöglichen. Die vollständige Integration von SC Spannungswandlern bietet eine kostengünstige und kompakte Spannungsversorgungslösung für moderne Elektronik. Der kontinuierliche Trend hin zu immer kompakterer Elektronik und hin zu höheren Versorgungsspannungen wird in dieser Arbeit adressiert. Aktuell gibt es sehr wenige voll integrierte SC Spannungswandler mit einer Eingangsspannung größer 5 V. Die mit steigender Spannung zunehmenden Herausforderungen an eine kompakte und effiziente Spannungsversorgung auf dem Chip werden in dieser Arbeit untersucht. Die höhere Spannungsfestigkeit der verwendeten Komponenten korreliert mit erhöhten Verlusten und erhöhtem Flächenverbrauch, welche sich negativ auf den Wirkungsgrad und die Leistungsdichte von SC Spannungswandlern auswirkt. Bestandteil dieser Arbeit ist die Untersuchung dieser Verlustmechanismen und die Entwicklung eines Modells, welches speziell für höhere Spannungen optimiert wurde. Das vorgestellte Modell ermöglicht zum einen die optimale Dimensionierung der Spannungswandler und zum anderen faire Vergleichsmöglichkeiten zwischen verschiedenen SC Spannungswandler Architekturen und Halbleitertechnologien. Demnach haben sowohl die gewählte Architektur und Halbleitertechnologie als auch die Kombination aus gewählter Architektur und Technologie erheblichen Einfluss auf die Leistungsfähigkeit der Spannungswandler. Ziel dieser Arbeit ist die Vollintegration eines SC Spannungswandlers mit einem weiten und hohen Eingangsspannungsbereich zu entwickeln. Dazu wurden verschiedene Schaltungsarchitekturen und Konzepte untersucht. Der vorgestellte vollintegrierte SC Spannungswandler weist einen Eingangsspannungsbereich von 2 V bis 13 V auf. Dies ist eine Verdopplung im Vergleich zum Stand der Technik. Dies wird durch einen implementierten Auf- und Abwärtswandler-Betriebsmodus sowie 17 Übersetzungsverhältnisse erreicht. Experimentelle Ergebnisse zeigen einen Spitzenwirkungsgrad von 81.5%. Dies ist der höchste veröffentlichte Spitzenwirkungsgrad für vollintegrierte SC Spannungswandler mit einer Eingangsspannung größer 5 V. Mit Hilfe des in dieser Arbeit entwickelten Modells wird eine dreiphasige SC Spannungswandler Architektur für Eingangsspannungen bis zu 60 V entwickelt und anschließend analysiert und diskutiert. Ein weiterer Schwerpunkt dieser Arbeit adressiert die kompakte Spannungsversorgung von Sensorknoten mit geringem Stromverbrauch, für Anwendungen wie Smart Home und Internet der Dinge (IoT). Für diese Anwendungen eignen sich besonders gut hochintegrierte Mikro-Netzteile, welche direkt mit dem 230VRMS-Hausnetz (bzw. 110VRMS) betrieben werden können. Das in dieser Arbeit vorgestellte Mikro-Netzteil nutzt einen in dieser Arbeit entwickelten SC Spannungswandler für hohe Eingangsspannungen. Die damit erzielte Ausgangsleistung ist 14-mal größer im Vergleich zum Stand der Technik. In SC Spannungswandlern für hohe Spannungen werden viele Leistungsschalter benötigt, deshalb muss bei der Schalteransteuerung besonders auf einen geringen Leistungsverbrauch und Flächenbedarf der benötigten Schaltungsblöcke geachtet werden. Gegenstand dieser Arbeit ist sowohl die Analyse verschiedener Konzepte für Pegelumsetzer, als auch die Entwicklung eines stromsparenden Pegelumsetzers für 50 V-Anwendungen. Mit einer Leistungsaufnahme von 2.1pJ pro Signalübergang reduziert der entwickelte Pegelumsetzer mit kapazitiver Kopplung um mehr als elfmal die Leistungsaufnahme im Vergleich zum Stand der Technik. Die erreichte Laufzeitverzögerung beträgt 1.45 ns. Damit erzielt der vorgestellte Hochspannungs-Pegelumsetzer als erster Pegelumsetzer für 50 V-Anwendungen eine Laufzeitverzögerung unter 2 ns und eine Leistungsaufnahme unter 20pJ pro Signalwechsel. Im Vergleich zum Stand der Technik wird die Leistungskennzahl um den Faktor zwei deutlich verbessert. Darüber hinaus werden im Rahmen dieser Arbeiten verschiedene Ladungspumpenkonzepte untersucht und bewertet. Die in dieser Arbeit optimierte Ladungspumpe verbessert den Stand der Technik um den Faktor 1.6 in Bezug auf den Wirkungsgrad. Die in dieser Arbeit entwickelte Schaltungsarchitektur eines bidirektionalen Schalters reduziert die dynamischen Schaltverluste um 70% und den benötigten Flächenbedarf inklusive der benötigten Ladungspumpe um bis zu 65% gegenüber dem Stand der Technik. Diese Verbesserungen ermöglichen es, die Leistungsschalter schnell und effizient anzusteuern. Schlagworte — Integriertes Powermanagement, hohe Eingangsspannung, Multi-Ratio SC Spannungswan- dler, Pegelumsetzer, bidirektionaler Schalter, Mikro-Netztei

CMOS indoor light energy harvesting system for wireless sensing applications

Dissertação para obtenção do Grau de Doutor em Engenharia Electrotécnica e de ComputadoresThis research thesis presents a micro-power light energy harvesting system for indoor environments. Light energy is collected by amorphous silicon photovoltaic (a-Si:H PV) cells, processed by a switched-capacitor (SC) voltage doubler circuit with maximum power point tracking (MPPT), and finally stored in a large capacitor. The MPPT Fractional Open Circuit Voltage (VOC) technique is implemented by an asynchronous state machine (ASM) that creates and, dynamically, adjusts the clock frequency of the step-up SC circuit, matching the input impedance of the SC circuit to the maximum power point (MPP) condition of the PV cells. The ASM has a separate local power supply to make it robust against load variations. In order to reduce the area occupied by the SC circuit, while maintaining an acceptable efficiency value, the SC circuit uses MOSFET capacitors with a charge reusing scheme for the bottom plate parasitic capacitors. The circuit occupies an area of 0.31 mm2 in a 130 nm CMOS technology. The system was designed in order to work under realistic indoor light intensities. Experimental results show that the proposed system, using PV cells with an area of 14 cm2, is capable of starting-up from a 0 V condition, with an irradiance of only 0.32 W/m2. After starting-up, the system requires an irradiance of only 0.18 W/m2 (18 mW/cm2) to remain in operation. The ASM circuit can operate correctly using a local power supply voltage of 453 mV, dissipating only 0.085 mW. These values are, to the best of the authors’ knowledge, the lowest reported in the literature. The maximum efficiency of the SC converter is 70.3% for an input power of 48 mW, which is comparable with reported values from circuits operating at similar power levels.Portuguese Foundation for Science and Technology (FCT/MCTES), under project PEst-OE/EEI/UI0066/2011, and to the CTS multiannual funding, through the PIDDAC Program funds. I am also very grateful for the grant SFRH/PROTEC/67683/2010, financially supported by the IPL – Instituto Politécnico de Lisboa

An Overview of Fully Integrated Switching Power Converters Based on Switched-Capacitor versus Inductive Approach and Their Advanced Control Aspects

This paper reviews and discusses the state of the art of integrated switched-capacitor and integrated inductive power converters and provides a perspective on progress towards the realization of efficient and fully integrated DC–DC power conversion. A comparative assessment has been presented to review the salient features in the utilization of transistor technology between the switched-capacitor and switched inductor converter-based approaches. First, applications that drive the need for integrated switching power converters are introduced, and further implementation issues to be addressed also are discussed. Second, different control and modulation strategies applied to integrated switched-capacitor (voltage conversion ratio control, duty cycle control, switching frequency modulation, Ron modulation, and series low drop out) and inductive converters (pulse width modulation and pulse frequency modulation) are then discussed. Finally, a complete set of integrated power converters are related in terms of their conditions and operation metrics, thereby allowing a categorization to provide the suitability of converter technologies

Highly Integrated Dc-dc Converters

A monolithically integrated smart rectifier has been presented first in this work. The smart rectifier, which integrates a power MOSFET, gate driver and control circuitry, operates in a self-synchronized fashion based on its drain-source voltage, and does not need external control input. The analysis, simulation, and design considerations are described in detail. A 5V, 5-µm CMOS process was used to fabricate the prototype. Experimental results show that the proposed rectifier functions as expected in the design. Since no dead-time control needs to be used to switch the sync-FET and ctrl-FET, it is expected that the body diode losses can be reduced substantially, compared to the conventional synchronous rectifier. The proposed self-synchronized rectifier (SSR) can be operated at high frequencies and maintains high efficiency over a wide load range. As an example of the smart rectifier\u27s application in isolated DC-DC converter, a synchronous flyback converter with SSR is analyzed, designed and tested. Experimental results show that the operating frequency could be as high as 4MHz and the efficiency could be improved by more than 10% compared to that when a hyper fast diode rectifier is used. Based on a new current-source gate driver scheme, an integrated gate driver for buck converter is also developed in this work by using a 0.35µm CMOS process with optional high voltage (50V) power MOSFET. The integrated gate driver consists both the current-source driver for high-side power MOSFET and low-power driver for low-side power iv MOSFET. Compared with the conventional gate driver circuit, the current-source gate driver can recovery some gate charging energy and reduce switching loss. So the current-source driver (CSD) can be used to improve the efficiency performance in high frequency power converters. This work also presents a new implementation of a power supply in package (PSiP) 5MHz buck converter, which is different from all the prior-of-art PSiP solutions by using a high-Q bondwire inductor. The high-Q bondwire inductor can be manufactured by applying ferrite epoxy to the common bondwire during standard IC packaging process, so the new implementation of PSiP is expected to be a cost-effective way of power supply integration

Small Form Factor Hybrid CMOS/GaN Buck Converters for 10W Point of Load Applications

abstract: Point of Load (PoL) converters are important components to the power distribution system in computer power supplies as well as automotive, space, nuclear, and medical electronics. These converters often require high output current capability, low form factor, and high conversion ratios (step-down) without sacrificing converter efficiency. This work presents hybrid silicon/gallium nitride (CMOS/GaN) power converter architectures as a solution for high-current, small form-factor PoL converters. The presented topologies use discrete GaN power devices and CMOS integrated drivers and controller loop. The presented power converters operate in the tens of MHz range to reduce the form factor by reducing the size of the off-chip passive inductor and capacitor. Higher conversion ratio is achieved through a fast control loop and the use of GaN power devices that exhibit low parasitic gate capacitance and minimize pulse swallowing. This work compares three discrete buck power converter architectures: single-stage, multi-phase with 2 phases, and stacked-interleaved, using components-off-the-shelf (COTS). Each of the implemented power converters achieves over 80% peak efficiency with switching speeds up-to 10MHz for high conversion ratio from 24V input to 5V output and maximum load current of 10A. The performance of the three architectures is compared in open loop and closed loop configurations with respect to efficiency, output voltage ripple, and power stage form factor. Additionally, this work presents an integrated CMOS gate driver solution in CMOS 0.35um technology. The CMOS integrated circuit (IC) includes the gate driver and the closed loop controller for directly driving a single-stage GaN architecture. The designed IC efficiently drives the GaN devices up to 20MHz switching speeds. The presented controller technique uses voltage mode control with an innovative cascode driver architecture to allow a 3.3V CMOS devices to effectively drive GaN devices that require 5V gate signal swing. Furthermore, the designed power converter is expected to operate under 400MRad of total dose, thus enabling its use in high-radiation environments for the large hadron collider at CERN and nuclear facilities.Dissertation/ThesisMasters Thesis Electrical Engineering 201