Impedance Matched Absorptive Thermal Blocking Filters

We have designed, fabricated and characterized absorptive thermal blocking filters for cryogenic microwave applications. The transmission line filter's input characteristic impedance is designed to match $50\,\Omega$ and its response has been validated from 0-to-50\,GHz. The observed return loss in the 0-to-20\,GHz design band is greater than $20\,$dB and shows graceful degradation with frequency. Design considerations and equations are provided that enable this approach to be scaled and modified for use in other applications

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

EMI failure analysis techniques and noise prediction for trace crossing split planes

A variety of methods exist that help locate the source, coupling path, and antenna in an electromagnetic interference (EMI) problem. No single method is the best option in all cases. A good electromagnetic compatibility (EMC) engineer should understand and have experience with a wide range of failure analysis methods and thus, be able to select the most appropriate ones for a given problem. The first three papers are from a series of articles, which explains a set of methods for the analysis of EMI failures. Each method is categorized based on two criteria: 1) the elements in an EMI problem each method tries to determine: the source, coupling path or the antenna; 2) the complexity of each method. The methods are explained to guide EMC engineers in selecting the right one by evaluating the advantages and limitations of each method. Printed circuit boards (PCBs) often have high speed data traces crossing splits in the adjacent reference planes due to space limitations and cost constraints. These split planes usually result from different power islands on nearby layers. The fourth paper quantifies the effects of the split planes and the associated stitching capacitors for various stack-up configurations --Abstract, page iv

Technical Design Report for the PANDA Solenoid and Dipole Spectrometer Magnets

This document is the Technical Design Report covering the two large spectrometer magnets of the PANDA detector set-up. It shows the conceptual design of the magnets and their anticipated performance. It precedes the tender and procurement of the magnets and, hence, is subject to possible modifications arising during this process.Comment: 10 pages, 14MB, accepted by FAIR STI in May 2009, editors: Inti Lehmann (chair), Andrea Bersani, Yuri Lobanov, Jost Luehning, Jerzy Smyrski, Technical Coordiantor: Lars Schmitt, Bernd Lewandowski (deputy), Spokespersons: Ulrich Wiedner, Paola Gianotti (deputy

Technical Design Report for the PANDA Solenoid and Dipole Spectrometer Magnets

This document is the Technical Design Report covering the two large spectrometer magnets of the PANDA detector set-up. It shows the conceptual design of the magnets and their anticipated performance. It precedes the tender and procurement of the magnets and, hence, is subject to possible modifications arising during this process

Technical Design Report for PANDA Electromagnetic Calorimeter (EMC)

This document presents the technical layout and the envisaged performance of the Electromagnetic Calorimeter (EMC) for the PANDA target spectrometer. The EMC has been designed to meet the physics goals of the PANDA experiment. The performance figures are based on extensive prototype tests and radiation hardness studies. The document shows that the EMC is ready for construction up to the front-end electronics interface

Electromagnetic Interference and Compatibility

Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials

Wideband and UWB antennas for wireless applications. A comprehensive review

A comprehensive review concerning the geometry, the manufacturing technologies, the materials, and the numerical techniques, adopted for the analysis and design of wideband and ultrawideband (UWB) antennas for wireless applications, is presented. Planar, printed, dielectric, and wearable antennas, achievable on laminate (rigid and flexible), and textile dielectric substrates are taken into account. The performances of small, low-profile, and dielectric resonator antennas are illustrated paying particular attention to the application areas concerning portable devices (mobile phones, tablets, glasses, laptops, wearable computers, etc.) and radio base stations. This information provides a guidance to the selection of the different antenna geometries in terms of bandwidth, gain, field polarization, time-domain response, dimensions, and materials useful for their realization and integration in modern communication systems

Design for Electromagnetic Compatibility--In a Nutshell

This open access book provides practicing electrical engineers and students a practical – and mathematically sound – introduction to the topic of electromagnetic compatibility (EMC). The author enables readers to understand better how to overcome commonly failed EMC tests for radiated emission, radiated immunity, and electrostatic discharge (ESD), while providing concrete EMC design guidelines. The book also presents an overview of EMC standards and regulations and how to test for a global market access

Modeling EMI Resulting from a Signal Via Transition Through Power/Ground Layers

Signal transitioning through layers on vias are very common in multi-layer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current must switch from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in noise on the power bus that can lead to signal integrity, as well as EMI problems. Numerical methods, such as the finite-difference time-domain (FDTD), Moment of Methods (MoM), and partial element equivalent circuit (PEEC) method, were employed herein to study this problem. The modeled results are supported by measurements. In addition, a common EMI mitigation approach of adding a decoupling capacitor was investigated with the FDTD method