HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS

Tohoku University堀口 進課

Integrated Circuits Parasitic Capacitance Extraction Using Machine Learning and its Application to Layout Optimization

The impact of parasitic elements on the overall circuit performance keeps increasing from one technology generation to the next. In advanced process nodes, the parasitic effects dominate the overall circuit performance. As a result, the accuracy requirements of parasitic extraction processes significantly increased, especially for parasitic capacitance extraction. Existing parasitic capacitance extraction tools face many challenges to cope with such new accuracy requirements that are set by semiconductor foundries (\u3c 5% error). Although field-solver methods can meet such requirements, they are very slow and have a limited capacity. The other alternative is the rule-based parasitic capacitance extraction methods, which are faster and have a high capacity; however, they cannot consistently provide good accuracy as they use a pre-characterized library of capacitance formulas that cover a limited number of layout patterns. On the other hand, the new parasitic extraction accuracy requirements also added more challenges on existing parasitic-aware routing optimization methods, where simplified parasitic models are used to optimize layouts. This dissertation provides new solutions for interconnect parasitic capacitance extraction and parasitic-aware routing optimization methodologies in order to cope with the new accuracy requirements of advanced process nodes as follows. First, machine learning compact models are developed in rule-based extractors to predict parasitic capacitances of cross-section layout patterns efficiently. The developed models mitigate the problems of the pre-characterized library approach, where each compact model is designed to extract parasitic capacitances of cross-sections of arbitrary distributed metal polygons that belong to a specific set of metal layers (i.e., layer combination) efficiently. Therefore, the number of covered layout patterns significantly increased. Second, machine learning compact models are developed to predict parasitic capacitances of middle-end-of-line (MEOL) layers around FINFETs and MOSFETs. Each compact model extracts parasitic capacitances of 3D MEOL patterns of a specific device type regardless of its metal polygons distribution. Therefore, the developed MEOL models can replace field-solvers in extracting MEOL patterns. Third, a novel accuracy-based hybrid parasitic capacitance extraction method is developed. The proposed hybrid flow divides a layout into windows and extracts the parasitic capacitances of each window using one of three parasitic capacitance extraction methods that include: 1) rule-based; 2) novel deep-neural-networks-based; and 3) field-solver methods. This hybrid methodology uses neural-networks classifiers to determine an appropriate extraction method for each window. Moreover, as an intermediate parasitic capacitance extraction method between rule-based and field-solver methods, a novel deep-neural-networks-based extraction method is developed. This intermediate level of accuracy and speed is needed since using only rule-based and field-solver methods (for hybrid extraction) results in using field-solver most of the time for any required high accuracy extraction. Eventually, a parasitic-aware layout routing optimization and analysis methodology is implemented based on an incremental parasitic extraction and a fast optimization methodology. Unlike existing flows that do not provide a mechanism to analyze the impact of modifying layout geometries on a circuit performance, the proposed methodology provides novel sensitivity circuit models to analyze the integrity of signals in layout routes. Such circuit models are based on an accurate matrix circuit representation, a cost function, and an accurate parasitic sensitivity extraction. The circuit models identify critical parasitic elements along with the corresponding layout geometries in a certain route, where they measure the sensitivity of a route’s performance to corresponding layout geometries very fast. Moreover, the proposed methodology uses a nonlinear programming technique to optimize problematic routes with pre-determined degrees of freedom using the proposed circuit models. Furthermore, it uses a novel incremental parasitic extraction method to extract parasitic elements of modified geometries efficiently, where the incremental extraction is used as a part of the routing optimization process to improve the optimization runtime and increase the optimization accuracy

A design flow for performance planning : new paradigms for iteration free synthesis

In conventional design, higher levels of synthesis produce a netlist, from which layout synthesis builds a mask specification for manufacturing. Timing anal ysis is built into a feedback loop to detect timing violations which are then used to update specifications to synthesis. Such iteration is undesirable, and for very high performance designs, infeasible. The problem is likely to become much worse with future generations of technology. To achieve a non-iterative design flow, early synthesis stages should use wire planning to distribute delays over the functional elements and interconnect, and layout synthesis should use its degrees of freedom to realize those delays

Custom Integrated Circuits

Contains reports on twelve research projects.Analog Devices, Inc.International Business Machines, Inc.Joint Services Electronics Program (Contract DAAL03-86-K-0002)Joint Services Electronics Program (Contract DAAL03-89-C-0001)U.S. Air Force - Office of Scientific Research (Grant AFOSR 86-0164)Rockwell International CorporationOKI Semiconductor, Inc.U.S. Navy - Office of Naval Research (Contract N00014-81-K-0742)Charles Stark Draper LaboratoryNational Science Foundation (Grant MIP 84-07285)National Science Foundation (Grant MIP 87-14969)Battelle LaboratoriesNational Science Foundation (Grant MIP 88-14612)DuPont CorporationDefense Advanced Research Projects Agency/U.S. Navy - Office of Naval Research (Contract N00014-87-K-0825)American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation (Grant MIP-88-58764

Modeling and simulation of VLSI interconnections with moments

Also issued as Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1989.Includes bibliographical references.Supported in part by the Joint Services Electronics Program. DAAL03-86-K-0002Steven Paul McCormick

Custom Integrated Circuits

Contains reports on nine research projects.Analog Devices, Inc.International Business Machines, Inc.Joint Services Electronics Program (Contract DAALO03-86-K-0002)U.S. Air Force - Office of Scientific Research (Grant AFOSR 86-0164)Rockwell International CorporationOKI SemiconductorU.S. Navy - Office of Naval Research (Contract N00014-81-K-0742)Charles Stark Draper LaboratoryDARPA/U.S. Navy - Office of Naval Research (Contract N00014-80-C-0622)DARPA/U.S. Navy - Office of Naval Research (Contract N00014-87-K-0825)National Science Foundation (Grant ECS-83-10941)AT&T Bell Laboratorie

Contributions to the design of power modules for electric and hybrid vehicles: trends, design aspects and simulation techniques

314 p.En la última década, la protección del medio ambiente y el uso alternativo de energías renovables están tomando mayor relevancia tanto en el ámbito social y político, como científico. El sector del transporte es uno de los principales causantes de los gases de efecto invernadero y la polución existente, contribuyendo con hasta el 27 % de las emisiones a nivel global. En este contexto desfavorable, la electrificación de los vehículos de carretera se convierte en un factor crucial. Para ello, la transición de la actual flota de vehículos de carretera debe ser progresiva forzando la investigación y desarrollo de nuevos conceptos a la hora de producir vehículos eléctricos (EV) y vehículos eléctricos híbridos (HEV) más eficientes, fiables, seguros y de menor coste. En consecuencia, para el desarrollo y mejora de los convertidores de potencia de los HEV/EV, este trabajo abarca los siguientes aspectos tecnológicos: - Arquitecturas de la etapa de conversión de potencia. Las principales topologías que pueden ser implementadas en el tren de potencia para HEV/EV son descritas y analizadas, teniendo en cuenta las alternativas que mejor se adaptan a los requisitos técnicos que demandan este tipo de aplicaciones. De dicha exposición se identifican los elementos constituyentes fundamentales de los convertidores de potencia que forman parte del tren de tracción para automoción.- Nuevos dispositivos semiconductores de potencia. Los nuevos objetivos y retos tecnológicos solo pueden lograrse mediante el uso de nuevos materiales. Los semiconductores Wide bandgap (WBG), especialmente los dispositivos electrónicos de potencia basados en nitruro de galio (GaN) y carburo de silicio (SiC), son las alternativas más prometedoras al silicio (Si) debido a las mejores prestaciones que poseen dichos materiales, lo que permite mejorar la conductividad térmica, aumentar las frecuencias de conmutación y reducir las pérdidas.- Análisis de técnicas de rutado, conexionado y ensamblado de módulos de potencia. Los módulos de potencia fabricados con dies en lugar de dispositivos discretos son la opción preferida por los fabricantes para lograr las especificaciones indicadas por la industria de la automoción. Teniendo en cuenta los estrictos requisitos de eficiencia, fiabilidad y coste es necesario revisar y plantear nuevos layouts de las etapas de conversión de potencia, así como esquemas y técnicas de paralelización de los circuitos, centrándose en las tecnologías disponibles.Teniendo en cuenta dichos aspectos, la presente investigación evalúa las alternativas de semiconductores de potencia que pueden ser implementadas en aplicaciones HEV/EV, así como su conexionado para la obtención de las densidades de potencia requeridas, centrándose en la técnica de paralelización de semiconductores. Debido a la falta de información tanto científica como comercial e industrial sobre dicha técnica, una de las principales contribuciones del presente trabajo ha sido la propuesta y verificación de una serie de criterios de diseño para el diseño de módulos de potencia. Finalmente, los resultados que se han extraído de los circuitos de potencia propuestos demuestran la utilidad de dichos criterios de diseño, obteniendo circuitos con bajas impedancias parásitas y equilibrados eléctrica y térmicamente. A nivel industrial, el conocimiento expuesto en la presente tesis permite reducir los tiempos de diseño a la hora de obtener prototipos de ciertas garantías, permitiendo comenzar la fase de prototipado habiéndose realizado comprobaciones eléctricas y térmicas

Fast methods for full-wave electromagnetic simulations of integrated circuit package modules

Fast methods for the electromagnetic simulation of integrated circuit (IC) package modules through model order reduction are demonstrated. The 3D integration of multiple functional IC chip/package modules on a single platform gives rise to geometrically complex structures with strong electromagnetic phenomena. This motivates our work on a fast full-wave solution for the analysis of such modules, thus contributing to the reduction in design cycle time without loss of accuracy. Traditionally, fast design approaches consider only approximate electromagnetic effects, giving rise to lumped-circuit models, and therefore may fail to accurately capture the signal integrity, power integrity, and electromagnetic interference effects. As part of this research, a second order frequency domain full-wave susceptance element equivalent circuit (SEEC) model will be extracted from a given structural layout. The model so obtained is suitably reduced using model order reduction techniques. As part of this effort, algorithms are developed to produce stable and passive reduced models of the original system, enabling fast frequency sweep analysis. Two distinct projection-based second order model reduction approaches will be considered: 1) matching moments, and 2) matching Laguerre coefficients, of the original system's transfer function. Further, the selection of multiple frequency shifts in these schemes to produce a globally representative model is also studied. Use of a second level preconditioned Krylov subspace process allows for a memory-efficient way to address large size problems.Ph.D.Committee Chair: Swaminathan Madhavan; Committee Member: Papapolymerou John; Committee Member: Chatterjee Abhijit; Committee Member: Peterson Andrew; Committee Member: Sitaraman Sures

Assessment of 50%-Propagation-Delay for Cascaded PCB Non-Linear Interconnect Lines for the High-Rate Signal Integrity Analysis

This paper presents an enlarged study about the 50-% propagation-time assessment of cascaded transmission lines (TLs). First and foremost, the accurate modeling and measurement technique of signal integrity (SI) for high-rate microelectronic interconnection is recalled. This model is based on the reduced transfer function extracted from the electromagnetic (EM) behavior of the interconnect line RLCG-parameters. So, the transfer function established takes into account both the frequency dispersion effects and the different propagation modes. In addition, the transfer function includes also the load and source impedance effects. Then, the SI analysis is proposed for high-speed digital signals through the developed model. To validate the model understudy, a prototype of microstrip interconnection with w = 500 µm and length d = 33 mm was designed, simulated, fabricated and tested. Then, comparisons between the frequency and time domain results from the model and from measurements are performed. As expected, good agreement between the S-parameters form measurements and the model proposed is obtained from DC to 8 GHz. Furthermore, a de-embedding method enabling to cancel out the connectors and the probe effects are also presented. In addition, an innovative time-domain characterization is proposed in order to validate the concept with a 2.38 Gbit/s-input data signal. Afterwards, the 50-% propagation-time assessment problem is clearly exposed. Consequently an extracting theory of this propagation-time with first order RC-circuits is presented. Finally, to show the relevance of this calculation, propagation-time simulations and an application to signal integrity issues are offered

Guaranteed passive parameterized model order reduction of the partial element equivalent circuit (PEEC) method

The decrease of IC feature size and the increase of operating frequencies require 3-D electromagnetic methods, such as the partial element equivalent circuit (PEEC) method, for the analysis and design of high-speed circuits. Very large systems of equations are often produced by 3-D electromagnetic methods. During the circuit synthesis of large-scale digital or analog applications, it is important to predict the response of the system under study as a function of design parameters, such as geometrical and substrate features, in addition to frequency (or time). Parameterized model order reduction (PMOR) methods become necessary to reduce large systems of equations with respect to frequency and other design parameters. We propose an innovative PMOR technique applicable to PEEC analysis, which combines traditional passivity-preserving model order reduction methods and positive interpolation schemes. It is able to provide parametric reduced-order models, stable, and passive by construction over a user-defined range of design parameter values. Numerical examples validate the proposed approach