Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact

Demonstration experiments for solid state physics using a table top mechanical Stirling refrigerator

Liquid free cryogenic devices are acquiring importance in basic science and engineering. But they can also lead to improvements in teaching low temperature an solid state physics to graduate students and specialists. Most of the devices are relatively expensive, but small sized equipment is slowly becoming available. Here, we have designed several simple experiments which can be performed using a small Stirling refrigerator. We discuss the measurement of the critical current and temperature of a bulk YBa2Cu3O(7-d) (YBCO) sample, the observation of the levitation of a magnet over a YBCO disk when cooled below the critical temperature and the observation of a phase transition using ac calorimetry. The equipment can be easily handled by students, and also used to teach the principles of liquid free cooling

Processing of nano-micro copper materials for the production of conductive circuits

Copper inks potentially provide a cost-effective alternative to silver for printed electronic circuits. In glass-based applications such as PV or smart glass, they can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions, and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperature of 225 °C for 60 minutes. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance. This could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles. Other samples were photonically sintered using a PulseForge 1200 laboratory photonic sintering unit where the number of pulses, pulse power, pulse frequency and the intra pulse gap could be varied. An initial optimization study identified an operational range of photonic energy profile. The best possible line conductivity obtained using these optimum conditions was around a 1/3 of that obtained by conventional thermal sintering. This relative conductivity of photonically sintered features further deviated from conventionally sintered features as the film thickness increased and as the line width reduced. Laser / NIR techniques were found ineffective to sinter the copper ink used in this study. The possibility to manually blend copper and silver paste ink was investigated and an optimum blend of 25% silver and 75% copper could be used which had maintained conductivity, cost, and adhesion benefits

Uv-liga Compatible Electroformed Nano-structured Materials For Micro Mechanical Systems

UV-LIGA is a microfabrication process realzed by material deposition through microfabricated molds. UV photolithography is conducted to pattern precise thick micro molds using UV light sensitive materials, mostly SU-8, and electroforming is performed to fabricate micro metallic structures defined by the micro molds. Therefore, UV-LIGA is a bottom-up in situ material-addition process. UV-LIGA has received broad attention recently than LIGA a micro molding fabrication process using X-ray to pattern the micro molds. LIGA is an expansive and is limited in access. In comparing to LIGA, the UV-LIGA is a cost effective process, and is widely accessible and safe. Therefore, it has been extensively used for the fabrication of metallic micro-electro-mechanical-systems (MEMS). The motivation of this research was to study micro mechanical systems fabricated with nano-structured metallic materials via UV-LIGA process. Various micro mechanical systems with high-aspect-ratio and thick metallic structures have been developed and are presented in this desertation. A novel micro mechanical valve has been developed with nano-structured nickel realized with UV-LIGA fabrication technique. Robust compact valves are crucial for space applications where payload and rubstaness are critically concerned. Two types of large flow rate robust passive micro check valve arrays have been designed, fabricated and tested for robust hydraulic actuators. The first such micro valve developed employs nanostructured nickel as the valve flap and single-crystal silicon as the substrates to house inlet and outlet channels. The Nano-structured nickel valve flap was fabricated using the UV-LIGA process developed and the microchannels were fabricated by deep reactive etching (DRIE) method. The valves were designed to operate under a high pressure (\u3e10MPa), able to operate at high frequencies (\u3e10kHz) in cooperating with the PZT actuator to produce large flow rates (\u3e10 cc/s). The fabricated microvalves weigh 0.2 gram, after packing with a novel designated valve stopper. The tested results showed that the micro valve was able to operate at up to 14kHz. This is a great difference in comparison to traditional mechanical valves whose operations are limited to 500 Hz or less. The advantages of micro machined valves attribute to the scaling laws. The second type of micro mechanical valves developed is a in situ assembled solid metallic (nickel) valves. Both the valve substrates for inlet and outlet channels and the valve flap, as well as the valve stopper were made by nickel through a UV-LIGA fabrication process developed. Continuous multiple micro molds fabrication and molding processes were performed. Final micro mechanical valves were received after removing the micro molds used to define the strutures. There is no any additional machining process, such as cutting or packaging. The alignment for laminated fabrication was realized under microscope, therefore it is a highly precise in situ fabrication process. Testing results show the valve has a forward flow rate of19 cc/s under a pressure difference of 90 psi. The backward flow rate of 0.023 cc/s, which is negligible (0.13%). Nano-structured nickel has also been used to develop laminated (sandwiched) micro cryogenic heater exchanger with the UV-LIGA process. Even though nickel is apparently not a good thermal conductor at room temperature, it is a good conductor at cryogentic temerpature since its thermal conductivity increases to 1250 W/k·m at 77K. Micro patterned SU-8 molds and electroformed nickel have been developed to realize the sandwiched heat exchanger. The SU-8 mold (200mm x 200mm x50mm) array was successfully removed after completing the nickel electroforming. The second layer of patterned SU-8 layer (200mm x 200mm x50mm, as a thermal insulating layer) was patterned and aligned on the top of the electroformed nickel structure to form the laminated (sandwiched) micro heat exchanger. The fabricated sandwiched structure can withstand cryogenic temperature (77K) without any damages (cracks or delaminations). A study on nanocomposite for micro mechanical systems using UV-LIGA compatible electroforming process has been performed. Single-walled carbon nanotubes (SWNTs) have been proven excellent mechanical properties and thermal conductive properties, such as high strength and elastic modulus, negative coefficient of thermal expansion (CTE) and a high thermal conductivity. These properties make SWNT an excellent reinforcement in nanocomposite for various applications. However, there has been a challenge of utilizing SWNTs for engineering applications due to difficulties in quality control and handling too small (1-2nm in diameter). A novel copper/SWNT nanocomposite has been developed during this dissertational research. The goal of this research was to develop a heat spreader for high power electronics (HPE). Semiconductors for HPE, such as AlGaN/GaN high electron mobility transistors grown on SiC dies have a typical CTE about 4~6x10-6/k while most metallic heat spreaders such as copper have a CTE of more than 10x10-6/k. The SWNTs were successfully dispersed in the copper matrix to form the SWNT/Cu nano composite. The tested composite density is about 7.54 g/cm3, which indicating the SWNT volumetric fraction of 18%. SEM pictures show copper univformly coated on SWNT (worm-shaped structure). The measured CTE of the nanocomposite is 4.7 x 10-6/°C, perfectly matching that of SiC die (3.8 x 10-6/°C). The thermal conductivity derived by Wiedemann-Franz law after measuring composit\u27s electrical conductivity, is 588 W/m-K, which is 40% better than that of pure copper. These properties are extremely important for the heat spreader/exchanger to remove the heat from HPE devices (SiC dies). Meanwhile, the matched CTE will reduce the resulted stress in the interface to prevent delaminations. Therefore, the naocomposite developed will be an excellent replacement material for the CuMo currently used in high power radar, and other HPE devices under developing. The mechanical performance and reliability of micro mechanical devices are critical for their application. In order to validate the design & simulation results, a direct (tensile) test method was developed to test the mechanical properties of the materials involved in this research, including nickel and SU-8. Micro machined specimens were fabricated and tested on a MTS Tytron Micro Force Tester with specially designed gripers. The tested fracture strength of nanostructured nickel is 900±70 MPa and of 50MPa for SU-8, resepctively which are much higher than published values

Implementing the general thermal-field emission equation to the high electric field nanoprotrusion model

http://www.ester.ee/record=b448539

Carbonaceous materials for their use as aircraft lightning strike protection

The main motivation behind this work, was to substitute the current technology used as lightning strike protection in the aircraft industry. This protection is composed of metallic meshes of foils, normally bronze, copper, and in some exceptional cases, for example in some fairings, aluminum in which cases, Glass Fiber Reinforced Polymer (GFRP) material will be added to avoid corrosion that direct contact between the Carbon Fiber (from the structural Carbon Fiber Reinforced Polymer material (CFRP)) and the Al might cause [1]. The bronze mesh adapts better to parts with complex geometries and is cheaper than cooper materials, however, its electrical conductivity is lower than the ones exhibited by copper meshes or foils. For those areas that need, not only Lightning Strike Protection (LSP), but also electromagnetic shielding, copper mesh or foils will be used such as Expanded Copper Foils (ECF), which is an epoxy pre-impregnated expanded copper foil that allows automated placement on the CFRP part.Programa de Doctorado en Ciencia e Ingeniería de Materiales por la Universidad Carlos III de MadridPresidente: Mauricio Terrones - Secretario: Francisco Javier Velasco Lopez - Vocal: José Sánchez Góme