Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

Study Of The Relationship Between Delta Delay And Adjacent Parallel Wire Length In 45 Nanometer Process Technology

Hierarchical design spans the complete framework of a design flow from Register Transfer Level (RTL), synthesis, place and route, timing closure and various other analyses before sign-off. Finer geometries and increasing interconnect density however have resulted signal integrity becoming the key issue for Deep Sub-Micron design. Post silicon bug due to noise and signal integrity can be prevented and fixed at early stage of the IC design cycle. The purpose of this research is to establish a preventive measurement for adjacent wire that can travel in parallel for 45nm technology. The intention is to ensure that a complex design can be delivered to the market with accurate, fast and trusted analysis and provide sign-off solution. Main approach is to conduct the relationship study between delta delay and adjacent parallel wire in 45 nanometer (nm) process technology and provide a preventive measurement to limit the adjacent wire can travel in parallel. The design is explored thoroughly to study the relationship between delay noise and adjacent parallel wire. The correlation is translated into an equation to estimate the delay noise produced with a certain length of adjacent parallel wire

Automatic synthesis of analog layout : a survey

A review of recent research in the automatic synthesis of physical geometry for analog integrated circuits is presented. On introduction, an explanation of the difficulties involved in analog layout as opposed to digital layout is covered. Review of the literature then follows. Emphasis is placed on the exposition of general methods for addressing problems specific to analog layout, with the details of specific systems only being given when they surve to illustrate these methods well. The conclusion discusses problems remaining and offers a prediction as to how technology will evolve to solve them. It is argued that although progress has been and will continue to be made in the automation of analog IC layout, due to fundamental differences in the nature of analog IC design as opposed to digital design, it should not be expected that the level of automation of the former will reach that of the latter any time soon

Novel Multicarrier Memory Channel Architecture Using Microwave Interconnects: Alleviating the Memory Wall

abstract: The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon. A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel. Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Noise-Constrained Performance Optimization by Simultaneous Gate and Wire Sizing Based on Lagrangian Relaxation

Noise, as well as area, delay, and power, is one of the most important concerns in the design of deep sub-micron ICs. Currently existing algorithms can not handle simultaneous switching conditions of signals for noise minimization. In this paper, we model not only physical coupling capacitance, but also simultaneous switching behavior for noise optimization. Based on Lagrangian relaxation, we present an algorithm that can optimally solve the simultaneous noise, area, delay, and power optimization problem by sizing circuit components. Our algorithm, with linear memory requirement overall and linear runtime per iteration, is very effective and efficient. For example, for a circuit of 6144 wires and 3512 gates, our algorithm solves the simultaneous optimization problem using only 2.1 MB memory and 47 minute runtime to achieve the precision of within 1% error on a SUN UltraSPARC-I workstation

Closed-form crosstalk noise metrics for physical design applications

ABSTRACT In this paper we present efficient closed-form formulas to estimate capacitive coupling-induced crosstalk noise for distributed RC coupling trees. The efficiency of our approach stems from the fact that only the five basic operations are used in the expressions: addition ( ), subtraction ( ), multiplication ( ), division ( ) and square root ( ). The formulas do not require exponent computation or numerical iterations. We have developed closed-form expressions for the peak crosstalk noise amplitude, the peak noise occurring time and the width of the noise waveform. Our approximations are conservative and yet achieve acceptable accuracy. The formulas are simple enough to be used in the inner loops of performance optimization algorithms or as cost functions to guide routers. They capture the influence of coupling direction (near-end and far-end coupling) and coupling location (near-driver and nearreceiver)

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes