New techniques for functional testing of microprocessor based systems

Electronic devices may be affected by failures, for example due to physical defects. These defects may be introduced during the manufacturing process, as well as during the normal operating life of the device due to aging. How to detect all these defects is not a trivial task, especially in complex systems such as processor cores. Nevertheless, safety-critical applications do not tolerate failures, this is the reason why testing such devices is needed so to guarantee a correct behavior at any time. Moreover, testing is a key parameter for assessing the quality of a manufactured product. Consolidated testing techniques are based on special Design for Testability (DfT) features added in the original design to facilitate test effectiveness. Design, integration, and usage of the available DfT for testing purposes are fully supported by commercial EDA tools, hence approaches based on DfT are the standard solutions adopted by silicon vendors for testing their devices. Tests exploiting the available DfT such as scan-chains manipulate the internal state of the system, differently to the normal functional mode, passing through unreachable configurations. Alternative solutions that do not violate such functional mode are defined as functional tests. In microprocessor based systems, functional testing techniques include software-based self-test (SBST), i.e., a piece of software (referred to as test program) which is uploaded in the system available memory and executed, with the purpose of exciting a specific part of the system and observing the effects of possible defects affecting it. SBST has been widely-studies by the research community for years, but its adoption by the industry is quite recent. My research activities have been mainly focused on the industrial perspective of SBST. The problem of providing an effective development flow and guidelines for integrating SBST in the available operating systems have been tackled and results have been provided on microprocessor based systems for the automotive domain. Remarkably, new algorithms have been also introduced with respect to state-of-the-art approaches, which can be systematically implemented to enrich SBST suites of test programs for modern microprocessor based systems. The proposed development flow and algorithms are being currently employed in real electronic control units for automotive products. Moreover, a special hardware infrastructure purposely embedded in modern devices for interconnecting the numerous on-board instruments has been interest of my research as well. This solution is known as reconfigurable scan networks (RSNs) and its practical adoption is growing fast as new standards have been created. Test and diagnosis methodologies have been proposed targeting specific RSN features, aimed at checking whether the reconfigurability of such networks has not been corrupted by defects and, in this case, at identifying the defective elements of the network. The contribution of my work in this field has also been included in the first suite of public-domain benchmark networks

Advances in Logic Locking: Past, Present, and Prospects

Logic locking is a design concealment mechanism for protecting the IPs integrated into modern System-on-Chip (SoC) architectures from a wide range of hardware security threats at the IC manufacturing supply chain. Logic locking primarily helps the designer to protect the IPs against reverse engineering, IP piracy, overproduction, and unauthorized activation. For more than a decade, the research studies that carried out on this paradigm has been immense, in which the applicability, feasibility, and efficacy of the logic locking have been investigated, including metrics to assess the efficacy, impact of locking in different levels of abstraction, threat model definition, resiliency against physical attacks, tampering, and the application of machine learning. However, the security and strength of existing logic locking techniques have been constantly questioned by sophisticated logical and physical attacks that evolve in sophistication at the same rate as logic locking countermeasure approaches. By providing a comprehensive definition regarding the metrics, assumptions, and principles of logic locking, in this survey paper, we categorize the existing defenses and attacks to capture the most benefit from the logic locking techniques for IP protection, and illuminating the need for and giving direction to future research studies in this topic. This survey paper serves as a guide to quickly navigate and identify the state-of-the-art that should be considered and investigated for further studies on logic locking techniques, helping IP vendors, SoC designers, and researchers to be informed of the principles, fundamentals, and properties of logic locking

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Doctor of Philosophy

dissertationThe design of integrated circuit (IC) requires an exhaustive verification and a thorough test mechanism to ensure the functionality and robustness of the circuit. This dissertation employs the theory of relative timing that has the advantage of enabling designers to create designs that have significant power and performance over traditional clocked designs. Research has been carried out to enable the relative timing approach to be supported by commercial electronic design automation (EDA) tools. This allows asynchronous and sequential designs to be designed using commercial cad tools. However, two very significant holes in the flow exist: the lack of support for timing verification and manufacturing test. Relative timing (RT) utilizes circuit delay to enforce and measure event sequencing on circuit design. Asynchronous circuits can optimize power-performance product by adjusting the circuit timing. A thorough analysis on the timing characteristic of each and every timing path is required to ensure the robustness and correctness of RT designs. All timing paths have to conform to the circuit timing constraints. This dissertation addresses back-end design robustness by validating full cyclical path timing verification with static timing analysis and implementing design for testability (DFT). Circuit reliability and correctness are necessary aspects for the technology to become commercially ready. In this study, scan-chain, a commercial DFT implementation, is applied to burst-mode RT designs. In addition, a novel testing approach is developed along with scan-chain to over achieve 90% fault coverage on two fault models: stuck-at fault model and delay fault model. This work evaluates the cost of DFT and its coverage trade-off then determines the best implementation. Designs such as a 64-point fast Fourier transform (FFT) design, an I2C design, and a mixed-signal design are built to demonstrate power, area, performance advantages of the relative timing methodology and are used as a platform for developing the backend robustness. Results are verified by performing post-silicon timing validation and test. This work strengthens overall relative timed circuit flow, reliability, and testability

Analysis and Test of the Effects of Single Event Upsets Affecting the Configuration Memory of SRAM-based FPGAs

SRAM-based FPGAs are increasingly relevant in a growing number of safety-critical application fields, ranging from automotive to aerospace. These application fields are characterized by a harsh radiation environment that can cause the occurrence of Single Event Upsets (SEUs) in digital devices. These faults have particularly adverse effects on SRAM-based FPGA systems because not only can they temporarily affect the behaviour of the system by changing the contents of flip-flops or memories, but they can also permanently change the functionality implemented by the system itself, by changing the content of the configuration memory. Designing safety-critical applications requires accurate methodologies to evaluate the system’s sensitivity to SEUs as early as possible during the design process. Moreover it is necessary to detect the occurrence of SEUs during the system life-time. To this purpose test patterns should be generated during the design process, and then applied to the inputs of the system during its operation. In this thesis we propose a set of software tools that could be used by designers of SRAM-based FPGA safety-critical applications to assess the sensitivity to SEUs of the system and to generate test patterns for in-service testing. The main feature of these tools is that they implement a model of SEUs affecting the configuration bits controlling the logic and routing resources of an FPGA device that has been demonstrated to be much more accurate than the classical stuck-at and open/short models, that are commonly used in the analysis of faults in digital devices. By keeping this accurate fault model into account, the proposed tools are more accurate than similar academic and commercial tools today available for the analysis of faults in digital circuits, that do not take into account the features of the FPGA technology.. In particular three tools have been designed and developed: (i) ASSESS: Accurate Simulator of SEuS affecting the configuration memory of SRAM-based FPGAs, a simulator of SEUs affecting the configuration memory of an SRAM-based FPGA system for the early assessment of the sensitivity to SEUs; (ii) UA2TPG: Untestability Analyzer and Automatic Test Pattern Generator for SEUs Affecting the Configuration Memory of SRAM-based FPGAs, a static analysis tool for the identification of the untestable SEUs and for the automatic generation of test patterns for in-service testing of the 100% of the testable SEUs; and (iii) GABES: Genetic Algorithm Based Environment for SEU Testing in SRAM-FPGAs, a Genetic Algorithm-based Environment for the generation of an optimized set of test patterns for in-service testing of SEUs. The proposed tools have been applied to some circuits from the ITC’99 benchmark. The results obtained from these experiments have been compared with results obtained by similar experiments in which we considered the stuck-at fault model, instead of the more accurate model for SEUs. From the comparison of these experiments we have been able to verify that the proposed software tools are actually more accurate than similar tools today available. In particular the comparison between results obtained using ASSESS with those obtained by fault injection has shown that the proposed fault simulator has an average error of 0:1% and a maximum error of 0:5%, while using a stuck-at fault simulator the average error with respect of the fault injection experiment has been 15:1% with a maximum error of 56:2%. Similarly the comparison between the results obtained using UA2TPG for the accurate SEU model, with the results obtained for stuck-at faults has shown an average difference of untestability of 7:9% with a maximum of 37:4%. Finally the comparison between fault coverages obtained by test patterns generated for the accurate model of SEUs and the fault coverages obtained by test pattern designed for stuck-at faults, shows that the former detect the 100% of the testable faults, while the latter reach an average fault coverage of 78:9%, with a minimum of 54% and a maximum of 93:16%

New Techniques for On-line Testing and Fault Mitigation in GPUs

L'abstract è presente nell'allegato / the abstract is in the attachmen

Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Self-Test Mechanisms for Automotive Multi-Processor System-on-Chips

L'abstract è presente nell'allegato / the abstract is in the attachmen