Monitoring Additive Manufacturing Machine Health

Additive manufacturing (AM) allows the production of parts and goods with many benefits over more conventional manufacturing methods. AM permits more geometrically complex designs, custom and low-volume production runs, and the flexibility to produce a wide variety of parts on a single machine with reduced pre-production cost and time requirements. However, it can be difficult to determine the condition, or health, of an AM machine since complex designs can increase the variability of part quality. With fewer parts produced, destructive testing is less desirable and statistical methods of tracking part quality may be less informative. Combined with the relatively more complex nature of AM machines, qualifying AM machines and monitoring their health to perform maintenance or repairs is a challenging task. We first present a case study that demonstrates the difficulty of monitoring the qualification of an AM machine. We then discuss some unique challenges AM presents when calibrating and taking measurements of laser power, and we demonstrate the relative insufficiency of this method in tracking the qualification status of an AM machine and the quality of the parts produced. Next, we present a framework that reverses the directionality of monitoring AM machine health. Rather than monitoring machine subsystems and intermediate metrics reflective of part quality, we instead directly monitor part quality through a combination of witness builds and witness parts that provide observational data to define the health status of a machine. Witness builds provide more accurate data separated from the noisy influence of parts and parameter settings, while witness artifacts provide more timely data but with less accuracy. Finally, machine health is modeled as a partially observed Markov decision process using the witness parts framework to maximize the long-term expected value per build. We show the superiority of this model by comparison to two less complex models, one that uses no use no witness parts and another that uses only witness builds. A case study shows the benefits of implementing the model, and a sensitivity analysis is performed to show relevant insights and considerations

Entwicklung und Einführung von Produktionssteuerungsverbesserungen für die kundenorientierte Halbleiterfertigung

Production control in a semiconductor production facility is a very complex and timeconsuming task. Different demands regarding facility performance parameters are defined by customer and facility management. These requirements are usually opponents, and an efficient strategy is not simple to define. In semiconductor manufacturing, the available production control systems often use priorities to define the importance of each production lot. The production lots are ranked according to the defined priorities. This process is called dispatching. The priority allocation is carried out by special algorithms. In literature, a huge variety of different strategies and rules is available. For the semiconductor foundry business, there is a need for a very flexible and adaptable policy taking the facility state and the defined requirements into account. At our case the production processes are characterized by a low-volume high-mix product portfolio. This portfolio causes additional stability problems and performance lags. The unstable characteristic increases the influence of reasonable production control logic. This thesis offers a very flexible and adaptable production control policy. This policy is based on a detailed facility model with real-life production data. The data is extracted from a real high-mix low-volume semiconductor facility. The dispatching strategy combines several dispatching rules. Different requirements like line balance, throughput optimization and on-time delivery targets can be taken into account. An automated detailed facility model calculates a semi-optimal combination of the different dispatching rules under a defined objective function. The objective function includes different demands from the management and the customer. The optimization is realized by a genetic heuristic for a fast and efficient finding of a close-to-optimal solution. The strategy is evaluated with real-life production data. The analysis with the detailed facility model of this fab shows an average improvement of 5% to 8% for several facility performance parameters like cycle time per mask layer. Finally the approach is realized and applied at a typical high-mix low-volume semiconductor facility. The system realization bases on a JAVA implementation. This implementation includes common state-of-the-art technologies such as web services. The system replaces the older production control solution. Besides the dispatching algorithm, the production policy includes the possibility to skip several metrology operations under defined boundary conditions. In a real-life production process, not all metrology operations are necessary for each lot. The thesis evaluates the influence of the sampling mechanism to the production process. The solution is included into the system implementation as a framework to assign different sampling rules to different metrology operations. Evaluations show greater improvements at bottleneck situations. After the productive introduction and usage of both systems, the practical results are evaluated. The staff survey offers good acceptance and response to the system. Furthermore positive effects on the performance measures are visible. The implemented system became part of the daily tools of a real semiconductor facility.Produktionssteuerung im Bereich der kundenorientierten Halbleiterfertigung ist heutzutage eine sehr komplexe und zeitintensive Aufgabe. Verschiedene Anforderungen bezüglich der Fabrikperformance werden seitens der Kunden als auch des Fabrikmanagements definiert. Diese Anforderungen stehen oftmals in Konkurrenz. Dadurch ist eine effiziente Strategie zur Kompromissfindung nicht einfach zu definieren. Heutige Halbleiterfabriken mit ihren verfügbaren Produktionssteuerungssystemen nutzen oft prioritätsbasierte Lösungen zur Definition der Wichtigkeit eines jeden Produktionsloses. Anhand dieser Prioritäten werden die Produktionslose sortiert und bearbeitet. In der Literatur existiert eine große Bandbreite verschiedener Algorithmen. Im Bereich der kundenorientierten Halbleiterfertigung wird eine sehr flexible und anpassbare Strategie benötigt, die auch den aktuellen Fabrikzustand als auch die wechselnden Kundenanforderungen berücksichtigt. Dies gilt insbesondere für den hochvariablen geringvolumigen Produktionsfall. Diese Arbeit behandelt eine flexible Strategie für den hochvariablen Produktionsfall einer solchen Produktionsstätte. Der Algorithmus basiert auf einem detaillierten Fabriksimulationsmodell mit Rückgriff auf Realdaten. Neben synthetischen Testdaten wurde der Algorithmus auch anhand einer realen Fertigungsumgebung geprüft. Verschiedene Steuerungsregeln werden hierbei sinnvoll kombiniert und gewichtet. Wechselnde Anforderungen wie Linienbalance, Durchsatz oder Liefertermintreue können adressiert und optimiert werden. Mittels einer definierten Zielfunktion erlaubt die automatische Modellgenerierung eine Optimierung anhand des aktuellen Fabrikzustandes. Die Optimierung basiert auf einen genetischen Algorithmus für eine flexible und effiziente Lösungssuche. Die Strategie wurde mit Realdaten aus der Fertigung einer typischen hochvariablen geringvolumigen Halbleiterfertigung geprüft und analysiert. Die Analyse zeigt ein Verbesserungspotential von 5% bis 8% für die bekannten Performancekriterien wie Cycletime im Vergleich zu gewöhnlichen statischen Steuerungspolitiken. Eine prototypische Implementierung realisiert diesen Ansatz zur Nutzung in der realen Fabrikumgebung. Die Implementierung basiert auf der JAVA-Programmiersprache. Aktuelle Implementierungsmethoden erlauben den flexiblen Einsatz in der Produktionsumgebung. Neben der Fabriksteuerung wurde die Möglichkeit der Reduktion von Messoperationszeit (auch bekannt unter Sampling) unter gegebenen Randbedingungen einer hochvariablen geringvolumigen Fertigung untersucht und geprüft. Oftmals ist aufgrund stabiler Prozesse in der Fertigung die Messung aller Lose an einem bestimmten Produktionsschritt nicht notwendig. Diese Arbeit untersucht den Einfluss dieses gängigen Verfahrens aus der Massenfertigung für die spezielle geringvolumige Produktionsumgebung. Die Analysen zeigen insbesondere in Ausnahmesituationen wie Anlagenausfällen und Kapazitätsengpässe einen positiven Effekt, während der Einfluss unter normalen Produktionsbedingungen aufgrund der hohen Produktvariabilität als gering angesehen werden kann. Nach produktiver Einführung in einem typischen Vertreter dieser Halbleiterfabriken zeigten sich schnell positive Effekte auf die Fabrikperformance als auch eine breite Nutzerakzeptanz. Das implementierte System wurde Bestandteil der täglichen genutzten Werkzeuglandschaft an diesem Standort

Managing preventative maintenance activities at Intel Corporation

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; and, (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; in conjunction with the Leaders for Manufacturing Program at MIT, 2006.Includes bibliographical references (leaf 51).The work for this thesis was completed at Intel Corporation in Colorado Springs, Colorado at Fab 23, a semiconductor fabrication facility making flash memory. The project focused on evaluating and managing preventative maintenance activities to improve WIP (Work in Progress) management and cycle time. Equipment runs a factory, but effective maintenance of that equipment is often overlooked for improvement efforts due to constrained technical resources. However, preventative maintenance (PM) activities can provide process stability and increased throughput if scheduled and executed efficiently. This thesis evaluates the benefits of coordinating PMs among functional areas and the effectiveness of existing PM practices at a 24 hours per day, 7 days per week facility. Using a WIP model, I show that wait times can be significantly reduced by scheduling PMs on sequential tools at the same time, so WIP only waits once for PMs. Additionally, the goal of an effective maintenance team is to spend more scheduled time maintaining equipment and less time doing unscheduled repairs. A base line of PM performance at Fab 23 is completed showing that they have opportunities to improve their PM processes by learning from other Intel facilities and implementing off-line repairs.by Rebecca Cassler Fearing.M.B.A.S.M

Development and Simulation Assessment of Semiconductor Production System Enhancements for Fast Cycle Times

Long cycle times in semiconductor manufacturing represent an increasing challenge for the industry and lead to a growing need of break-through approaches to reduce it. Small lot sizes and the conversion of batch processes to mini-batch or single-wafer processes are widely regarded as a promising means for a step-wise cycle time reduction. Our analysis with discrete-event simulation and queueing theory shows that small lot size and the replacement of batch tools with mini-batch or single wafer tools are beneficial but lot size reduction lacks persuasive effectiveness if reduced by more than half. Because the results are not completely convincing, we develop a new semiconductor tool type that further reduces cycle time by lot streaming leveraging the lot size reduction efforts. We show that this combined approach can lead to a cycle time reduction of more than 80%

Power Semiconductors for An Energy-Wise Society

This IEC White Paper establishes the critical role that power semiconductors play in transitioning to an energy wise society. It takes an in-depth look at expected trends and opportunities, as well as the challenges surrounding the power semiconductors industry. Among the significant challenges mentioned is the need for change in industry practices when transitioning from linear to circular economies and the shortage of skilled personnel required for power semiconductor development. The white paper also stresses the need for strategic actions at the policy-making level to address these concerns and calls for stronger government commitment, policies and funding to advance power semiconductor technologies and integration. It further highlights the pivotal role of standards in removing technical risks, increasing product quality and enabling faster market acceptance. Besides noting benefits of existing standards in accelerating market growth, the paper also identifies the current standardization gaps. The white paper emphasizes the importance of ensuring a robust supply chain for power semiconductors to prevent supply-chain disruptions like those seen during the COVID-19 pandemic, which can have widespread economic impacts.The white paper highlights the importance of inspiring young professionals to take an interest in power semiconductors and power electronics, highlighting the potential to make a positive impact on the world through these technologies.The white paper concludes with recommendations for policymakers, regulators, industry and other IEC stakeholders for collaborative structures and accelerating the development and adoption of standards

The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules

This dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were investigated, and the concept for a novel SiC power module was discussed. This highly-integrated SiC power module was assessed for feasibility, with a focus on achieving ultralow parasitic inductances in the critical switching loops. This will enable higher switching frequencies, leading to a reduction in the size of the passive devices in the system and resulting in systems with lower weight and volume. The proposed concept yielded an order-of-magnitude reduction in system parasitics, alongside the possibility of a compact system integration. The technological barriers to realizing these concepts were identified, and solutions for novel interconnection schemes were proposed and evaluated. A novel sintered silver preform was developed to facilitate flip-chip interconnections for a bare-die power device while operating in a high ambient temperature. The preform was demonstrated to have 3.75× more bonding strength than a conventional sintered silver bond and passed rigorous thermal shock tests. A chip-scale and flip-chip capable power device was also developed. The novel package combined the ease of assembly of a discrete device with a performance exceeding a wire bonded module. It occupied a 14× smaller footprint than a discrete device, and offered power loop inductances which were less than a third of a conventional wire bonded module. A detailed manufacturing process flow and qualification is included in this dissertation. These novel devices were implemented in various electrical systems—a discrete Schottky barrier diode package, a half-bridge module with external gate drive, and finally a half-bridge with integrated gate driver in-module. The results of these investigations have been reported and their benefits assessed. The wire bondless modules showed \u3c 5% overshoot under all test conditions. No observable detrimental effects due to dv/dt were observed for any of the modules even under aggressive voltage slew rates of 20-25 V/ns

Demand-oriented Competency Development in a Manufacturing Context: The Relevance of Process and Knowledge Modeling

Competency management is a crucial success factor for organizations in the area of tension between knowledge management, human resource management, and process management, and has to be considered from a knowledge economy perspective. A basis for developing appropriate qualification measures in organizations is the comparison of necessary and available competencies. Given the time and cost intensity of the comparison process, the use of appropriate methods is of particular relevance for enterprises. This paper presents a procedural method and a software tool which enable resource-saving comparisons. Usually, employees’ “to competencies” are determined on a strategic level. Currently available “is competencies” can be derived from the actual knowledge transfer or from existing competence profiles. The method and tool first allow for the appropriate visualization of both competencies. After an automatized comparison of both contents, an overview of given and missing “to competencies” will be provided. Not available competencies can be addressed as qualification requirements and reflections regarding staffing or task allocation can be conducted

The NASA SBIR product catalog

The purpose of this catalog is to assist small business firms in making the community aware of products emerging from their efforts in the Small Business Innovation Research (SBIR) program. It contains descriptions of some products that have advanced into Phase 3 and others that are identified as prospective products. Both lists of products in this catalog are based on information supplied by NASA SBIR contractors in responding to an invitation to be represented in this document. Generally, all products suggested by the small firms were included in order to meet the goals of information exchange for SBIR results. Of the 444 SBIR contractors NASA queried, 137 provided information on 219 products. The catalog presents the product information in the technology areas listed in the table of contents. Within each area, the products are listed in alphabetical order by product name and are given identifying numbers. Also included is an alphabetical listing of the companies that have products described. This listing cross-references the product list and provides information on the business activity of each firm. In addition, there are three indexes: one a list of firms by states, one that lists the products according to NASA Centers that managed the SBIR projects, and one that lists the products by the relevant Technical Topics utilized in NASA's annual program solicitation under which each SBIR project was selected