Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

NASA SBIR abstracts of 1991 phase 1 projects

The objectives of 301 projects placed under contract by the Small Business Innovation Research (SBIR) program of the National Aeronautics and Space Administration (NASA) are described. These projects were selected competitively from among proposals submitted to NASA in response to the 1991 SBIR Program Solicitation. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 301, in order of its appearance in the body of the report. Appendixes to provide additional information about the SBIR program and permit cross-reference of the 1991 Phase 1 projects by company name, location by state, principal investigator, NASA Field Center responsible for management of each project, and NASA contract number are included

NASA SBIR abstracts of 1990 phase 1 projects

The research objectives of the 280 projects placed under contract in the National Aeronautics and Space Administration (NASA) 1990 Small Business Innovation Research (SBIR) Phase 1 program are described. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses in response to NASA's 1990 SBIR Phase 1 Program Solicitation. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 280, in order of its appearance in the body of the report. The document also includes Appendixes to provide additional information about the SBIR program and permit cross-reference in the 1990 Phase 1 projects by company name, location by state, principal investigator, NASA field center responsible for management of each project, and NASA contract number

Wireless communication, identification and sensing technologies enabling integrated logistics: a study in the harbor environment

In the last decade, integrated logistics has become an important challenge in the development of wireless communication, identification and sensing technology, due to the growing complexity of logistics processes and the increasing demand for adapting systems to new requirements. The advancement of wireless technology provides a wide range of options for the maritime container terminals. Electronic devices employed in container terminals reduce the manual effort, facilitating timely information flow and enhancing control and quality of service and decision made. In this paper, we examine the technology that can be used to support integration in harbor's logistics. In the literature, most systems have been developed to address specific needs of particular harbors, but a systematic study is missing. The purpose is to provide an overview to the reader about which technology of integrated logistics can be implemented and what remains to be addressed in the future

Modern Applications in Optics and Photonics: From Sensing and Analytics to Communication

Optics and photonics are among the key technologies of the 21st century, and offer potential for novel applications in areas such as sensing and spectroscopy, analytics, monitoring, biomedical imaging/diagnostics, and optical communication technology. The high degree of control over light fields, together with the capabilities of modern processing and integration technology, enables new optical measurement systems with enhanced functionality and sensitivity. They are attractive for a range of applications that were previously inaccessible. This Special Issue aims to provide an overview of some of the most advanced application areas in optics and photonics and indicate the broad potential for the future

Workshop on Advanced Technologies for Planetary Instruments, part 1

This meeting was conceived in response to new challenges facing NASA's robotic solar system exploration program. This volume contains papers presented at the Workshop on Advanced Technologies for Planetary Instruments on 28-30 Apr. 1993. This meeting was conceived in response to new challenges facing NASA's robotic solar system exploration program. Over the past several years, SDIO has sponsored a significant technology development program aimed, in part, at the production of instruments with these characteristics. This workshop provided an opportunity for specialists from the planetary science and DoD communities to establish contacts, to explore common technical ground in an open forum, and more specifically, to discuss the applicability of SDIO's technology base to planetary science instruments

MULTI-SCALE SCHEDULING TECHNIQUES FOR SIGNAL PROCESSING SYSTEMS

A variety of hardware platforms for signal processing has emerged, from distributed systems such as Wireless Sensor Networks (WSNs) to parallel systems such as Multicore Programmable Digital Signal Processors (PDSPs), Multicore General Purpose Processors (GPPs), and Graphics Processing Units (GPUs) to heterogeneous combinations of parallel and distributed devices. When a signal processing application is implemented on one of those platforms, the performance critically depends on the scheduling techniques, which in general allocate computation and communication resources for competing processing tasks in the application to optimize performance metrics such as power consumption, throughput, latency, and accuracy. Signal processing systems implemented on such platforms typically involve multiple levels of processing and communication hierarchy, such as network-level, chip-level, and processor-level in a structural context, and application-level, subsystem-level, component-level, and operation- or instruction-level in a behavioral context. In this thesis, we target scheduling issues that carefully address and integrate scheduling considerations at different levels of these structural and behavioral hierarchies. The core contributions of the thesis include the following. Considering both the network-level and chip-level, we have proposed an adaptive scheduling algorithm for wireless sensor networks (WSNs) designed for event detection. Our algorithm exploits discrepancies among the detection accuracy of individual sensors, which are derived from a collaborative training process, to allow each sensor to operate in a more energy efficient manner while the network satisfies given constraints on overall detection accuracy. Considering the chip-level and processor-level, we incorporated both temperature and process variations to develop new scheduling methods for throughput maximization on multicore processors. In particular, we studied how to process a large number of threads with high speed and without violating a given maximum temperature constraint. We targeted our methods to multicore processors in which the cores may operate at different frequencies and different levels of leakage. We develop speed selection and thread assignment schedulers based on the notion of a core's steady state temperature. Considering the application-level, component-level and operation-level, we developed a new dataflow based design flow within the targeted dataflow interchange format (TDIF) design tool. Our new multiprocessor system-on-chip (MPSoC)-oriented design flow, called TDIF-PPG, is geared towards analysis and mapping of embedded DSP applications on MPSoCs. An important feature of TDIF-PPG is its capability to integrate graph level parallelism and actor level parallelism into the application mapping process. Here, graph level parallelism is exposed by the dataflow graph application representation in TDIF, and actor level parallelism is modeled by a novel model for multiprocessor dataflow graph implementation that we call the Parallel Processing Group (PPG) model. Building on the contribution above, we formulated a new type of parallel task scheduling problem called Parallel Actor Scheduling (PAS) for chip-level MPSoC mapping of DSP systems that are represented as synchronous dataflow (SDF) graphs. In contrast to traditional SDF-based scheduling techniques, which focus on exploiting graph level (inter-actor) parallelism, the PAS problem targets the integrated exploitation of both intra- and inter-actor parallelism for platforms in which individual actors can be parallelized across multiple processing units. We address a special case of the PAS problem in which all of the actors in the DSP application or subsystem being optimized can be parallelized. For this special case, we develop and experimentally evaluate a two-phase scheduling framework with three work flows --- particle swarm optimization with a mixed integer programming formulation, particle swarm optimization with a simulated annealing engine, and particle swarm optimization with a fast heuristic based on list scheduling. Then, we extend our scheduling framework to support general PAS problem which considers the actors cannot be parallelized