CMOS Image Sensors for High Speed Applications

Recent advances in deep submicron CMOS technologies and improved pixel designs have enabled CMOS-based imagers to surpass charge-coupled devices (CCD) imaging technology for mainstream applications. The parallel outputs that CMOS imagers can offer, in addition to complete camera-on-a-chip solutions due to being fabricated in standard CMOS technologies, result in compelling advantages in speed and system throughput. Since there is a practical limit on the minimum pixel size (4∼5 μm) due to limitations in the optics, CMOS technology scaling can allow for an increased number of transistors to be integrated into the pixel to improve both detection and signal processing. Such smart pixels truly show the potential of CMOS technology for imaging applications allowing CMOS imagers to achieve the image quality and global shuttering performance necessary to meet the demands of ultrahigh-speed applications. In this paper, a review of CMOS-based high-speed imager design is presented and the various implementations that target ultrahigh-speed imaging are described. This work also discusses the design, layout and simulation results of an ultrahigh acquisition rate CMOS active-pixel sensor imager that can take 8 frames at a rate of more than a billion frames per second (fps)

A mismatch-insensitive high-accuracy high-speed continuous-time current comparator in low voltage CMOS

This paper presents a CMOS current comparator which employs nonlinear feedback to obtain high-accuracy (down to 1.5 pA) and high-speed for low input currents (8 ns@50 nA). This structure is much faster for low currents (below 10 /spl mu/A) than other previous nonlinear feedback comparators. Particularly, when compared to the fastest current comparator reported up to now, the new one operates at more that 100 times faster for a 1 nA current, with smaller area occupation and similar power consumption. In addition, the new comparator is virtually insensitive to mismatch and capable of operating with supply voltages as low as 1 V

The rising role of photonics in today's data centres

In recent years there has been a rapid growth in demand for ultra high speed data transmission with end users expecting fast, high bandwidth network access. This growth has put data centres under increasing pressure to provide greater data throughput and ever increasing data rates while at the same time improving the quality of data handling in terms of reduced latency, increased scalability and improved channel speed for users. However, data networks are becoming increasingly difficult to scale to meet this growing demand using current well established CMOS technology and architectures. As a result electronic bottlenecks are becoming apparent despite improvements in data management. The inter-related issues of electronic scalability, power consumption, copper interconnect bandwidth and the limited speed of CMOS electronics will be discussed; and the tremendous potential of optical fibre based networks to provide the necessary bandwidth will be illustrated. In addition, some applications of photonics to alleviate speed, throughput and latency issues in data networks will be discussed. Finally, progress in the form of a novel and highly scalable optical interconnect will be reviewed

Metal Microelectromechanical Resonator Exhibiting Fast Human Activity Detection

This work presents a MEMS resonator used as an ultra-high resolution water vapor sensor (humidity sensing) to detect human activity through finger movement as a demonstrator example. This microelectromechanical resonator is designed as a clamped-clamped beam fabricated using the top metal layer of a commercial CMOS technology (0.35 μm CMOS-AMS) and monolithically integrated with conditioning and readout circuitry. Sensing is performed through the resonance frequency change due to the addition of water onto the clamped clamped beam coming from the moisture created by the evaporation of water in the human body. The sensitivity and high-speed response to the addition of water onto the metal bridge, as well as the quick dewetting of the surface, make it suitable for low-power human activity sensing

Characterization And Optimization Of Avalanche Photodiodes Fabricated By Standard Cmos Process For High-Speed High-Speed Photoreceivers

A dissertation presented on the characterization and optimization of avalanche photodiodes fabricated by standard CMOS process (CMOS-APD) for high-speed photoreceivers, beginning with the theory and principle related to photodetector and avalanche photodiodes, followed by characterization,optimization, and wavelength dependence of CMOS-APD, and finally link up with the transimpedance amplifier. nMOS-type and pMOS-type silicon avalanche photodiodes were fabricated by standard 0.18 μm CMOS process, and the currentvoltage characteristic and the frequency response of the CMOS-APDs with and without the guard ring structure were measured. CMOS-APDs have features of high avalanche gain below 10 V, wide bandwidth over 5 GHz, and easy integration with electronic circuits. In CMOS-APDs, guard ring structure is introduced for high-speed operation with the role of elimination the slow photo generated carriers in a deep layer and a substrate. The bandwidth of the CMOS-APD is enhanced with the guard ring structure at a sacrifice of the responsivity. Based on comparison of nMOS-type and pMOS-type APDs, the nMOS-type APD is more suitable for high-speed operation. The bandwidth is enhanced with decreasing the spacing of interdigital electrodes due to decreased carrier transit time and with decreasing the detection area and the PAD size for RF probing due to decreased device capacitance. Thus, an nMOS-type APD with the electrode spacing of 0.84 μm, the detection area of 10 x 10 μm², the PAD size for RF probing of 30 x 30 μm² along with the guard ring structure was fabricated. As a results, the maximum bandwidth of 8.4 GHz at the avalanche gain of about 10 and the gain-bandwidth product of 280 GHz were achieved. Furthermore, the wavelength dependence of the responsivity and the bandwidth of the CMOS-APDs with and without the guard ring structure also revealed. At a wavelength of 520 nm or less, there is no difference in the responsivity and the frequency response because all the illuminated light is absorbed in the p+-layer and the Nwell due to strong light absorption of Si. On the other hand, a part of the incident light is absorbed in the Psubstrate and the photo-generated carriers in the P-substrate are eliminated by the guard ring structure for the wavelength longer than 520 nm, and then bandwidth was remarkably enhanced at the sacrifice of the responsivity. In addition, to achieve high-speed photoreceivers, two types of TIA which are common-source and regulated-cascode TIAs were simulated by utilizing the output of the CMOSAPDs.The figure of merits of gain-bandwidth product was used to find the ideal results of the transimpedance gain and bandwidth performance due to trade-offs between both of them. The common-source TIA produced the transimpedance gain of 22.17 dBΩ, the bandwidth of 21.21 GHz and the gain-bandwidth product of 470.23 THz × dBΩ. Besides that, the simulated results of the regulated-cascade TIA configuration demonstrate 79.45 dBΩ transimpedance gain, 10.64 GHz bandwidth, and 845.35 THz × dBΩ gain-bandwidth product. Both of these TIA results meet the target of this research and further encouraging this successful CMOS-APDs to realize high-speed photoreceivers

A modular CMOS analog fuzzy controller

The low/medium precision required for many fuzzy applications makes analog circuits natural candidates to design fuzzy chips with optimum speed/power figures. This paper presents a sixteen rules-two inputs analog fuzzy controller in a CMOS 1 /spl mu/m single-poly technology based on building blocks implementations previously proposed by the authors (1995). However, such building blocks are rearranged here to get a highly modular architecture organized from two high level blocks: the label block and the rule block. In addition, sharing of membership function circuits allows a compact design with low area and power consumption and its highly modular architecture will permit to increase the number of inputs and rules in future chips with hardly design effort. The paper includes measurements from a silicon prototype of the controller

Low-power, 10-Gbps 1.5-Vpp differential CMOS driver for a silicon electro-optic ring modulator

We present a novel driver circuit enabling electro-optic modulation with high extinction ratio from a co-designed silicon ring modulator. The driver circuit provides an asymmetric differential output at 10Gbps with a voltage swing up to 1.5V(pp) from a single 1.0V supply, maximizing the resonance-wavelength shift of depletion-type ring modulators while avoiding carrier injection. A test chip containing 4 reconfigurable driver circuits was fabricated in 40nm CMOS technology. The measured energy consumption for driving a 100fF capacitive load at 10Gbps was as low as 125fJ/bit and 220fJ/bit at 1V(pp) and 1.5V(pp) respectively. After flip-chip integration with ring modulators on a silicon-photonics chip, the power consumption was measured to be 210fJ/bit and 350fJ/bit respectively

On evolution of CMOS image sensors

CMOS Image Sensors have become the principal technology in majority of digital cameras. They started replacing the film and Charge Coupled Devices in the last decade with the promise of lower cost, lower power requirement, higher integration and the potential of focal plane processing. However, the principal factor behind their success has been the ability to utilise the shrinkage in CMOS technology to make smaller pixels, and thereby have more resolution without increasing the cost. With the market of image sensors exploding courtesy their inte- gration with communication and computation devices, technology developers improved the CMOS processes to have better optical performance. Nevertheless, the promises of focal plane processing as well as on-chip integration have not been fulfilled. The market is still being pushed by the desire of having higher number of pixels and better image quality, however, differentiation is being difficult for any image sensor manufacturer. In the paper, we will explore potential disruptive growth directions for CMOS Image sensors and ways to achieve the same

Hybrid memristor-CMOS implementation of logic gates design using LTSpice

In this paper, a hybrid memristor-CMOS implementation of logic gates simulated using LTSpice. Memristors' implementation in computer architecture designs explored in various design structures proposed by researchers from all around the world. However, all prior designs have some drawbacks in terms of applicability, scalability, and performance. In this research, logic gates design based on the hybrid memristor-CMOS structure presented. 2-inputs AND, OR, NAND, NOR, XOR, and XNOR are demonstrated with minimum components requirements. In addition, a 1-bit full adder circuit with high performance and low area consumption is also proposed. The proposed full adder only consists of 4 memristors and 7 CMOS transistors. Half design of the adder base on the memristor component created. Through analysis and simulations, the memristor implementation on designing logic gates using memristor-CMOS structure demonstrated using the generalized metastable switch memristor (MSS) model and LTSpice. In conclusion, the proposed approach improves speed and require less area