76 research outputs found

    Devices and architectures for large scale integrated silicon photonics circuits

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    We present DWDM nanophotonics architectures based on microring resonator modulators and detectors. We focus on two implementations: an on chip interconnect for multicore processor (Corona) and a high radix network switch (HyperX). Based on the requirements of these applications we discuss the key constraints on the photonic circuits' devices and fabrication techniques as well as strategies to improve their performance

    Efficient Intra-Rack Resource Disaggregation for HPC Using Co-Packaged DWDM Photonics

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    The diversity of workload requirements and increasing hardware heterogeneity in emerging high performance computing (HPC) systems motivate resource disaggregation. Resource disaggregation allows compute and memory resources to be allocated individually as required to each workload. However, it is unclear how to efficiently realize this capability and cost-effectively meet the stringent bandwidth and latency requirements of HPC applications. To that end, we describe how modern photonics can be co-designed with modern HPC racks to implement flexible intra-rack resource disaggregation and fully meet the bit error rate (BER) and high escape bandwidth of all chip types in modern HPC racks. Our photonic-based disaggregated rack provides an average application speedup of 11% (46% maximum) for 25 CPU and 61% for 24 GPU benchmarks compared to a similar system that instead uses modern electronic switches for disaggregation. Using observed resource usage from a production system, we estimate that an iso-performance intra-rack disaggregated HPC system using photonics would require 4x fewer memory modules and 2x fewer NICs than a non-disaggregated baseline.Comment: 15 pages, 12 figures, 4 tables. Published in IEEE Cluster 202

    Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

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    We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges

    Energy-efficient electrical and silicon-photonic networks in many core systems

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    Thesis (Ph.D.)--Boston UniversityDuring the past decade, the very large scale integration (VLSI) community has migrated towards incorporating multiple cores on a single chip to sustain the historic performance improvement in computing systems. As the core count continuously increases, the performance of network-on-chip (NoC), which is responsible for the communication between cores, caches and memory controllers, is increasingly becoming critical for sustaining the performance improvement. In this dissertation, we propose several methods to improve the energy efficiency of both electrical and silicon-photonic NoCs. Firstly, for electrical NoC, we propose a flow control technique, Express Virtual Channel with Taps (EVC-T), to transmit both broadcast and data packets efficiently in a mesh network. A low-latency notification tree network is included to maintain t he order of broadcast packets. The EVC-T technique improves the NoC latency by 24% and the system energy efficiency in terms of energy-delay product (EDP) by 13%. In the near future, the silicon-photonic links are projected to replace the electrical links for global on-chip communication due to their lower data-dependent power and higher bandwidth density, but the high laser power can more than offset these advantages. Therefore, we propose a silicon-photonic multi-bus NoC architecture and a methodology that can reduce the laser power by 49% on average through bandwidth reconfiguration at runtime based on the variations in bandwidth requirements of applications. We also propose a technique to reduce the laser power by dynamically activating/deactivating the 12 cache banks and switching ON/ OFF the corresponding silicon-photonic links in a crossbar NoC. This cache-reconfiguration based technique can save laser power by 23.8% and improves system EDP by 5.52% on average. In addition, we propose a methodology for placing and sharing on-chip laser sources by jointly considering the bandwidth requirements, thermal constraints and physical layout constraints. Our proposed methodology for placing and sharing of on-chip laser sources reduces laser power. In addition to reducing the laser power to improve the energy efficiency of silicon-photonic NoCs, we propose to leverage the large bandwidth provided by silicon-photonic NoC to share computing resources. The global sharing of floating-point units can save system area by 13.75% and system power by 10%
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