Thin-film piezoelectric-on-substrate resonators and narrowband filters

A new class of micromachined devices called thin-film piezoelectric-on-substrate (TPoS) resonators is introduced, and the performance of these devices in RF and sensor applications is studied. TPoS resonators benefit from high electromechanical coupling of piezoelectric transduction mechanism and superior acoustic properties of a substrate such as single crystal silicon. Therefore, the motional impedance of these resonators are significantly smaller compared to typical capacitively-transduced counterparts while they exhibit relatively high quality factor and power handling and can be operated in air. The combination of all these features suggests TPoS resonators as a viable alternative for current acoustic devices. In this thesis, design and fabrication methods to realize dispersed-frequency lateral-extensional TPoS resonators are discussed. TPoS devices are fabricated on both silicon-on-insulator and thin-film nanocrystalline diamond substrates. The performance of these resonators in simple and low-power oscillators is measured and compared. Furthermore, a unique coupling technique for implementation of high frequency filters is introduced in which dual resonance modes of a single resonant structure are coupled. The measured results of this work show that these filters are suitable candidates for single-chip implementation of multiple-frequency narrow-band filters with high out-of-band rejection in a small footprint.Ph.D.Committee Chair: Farrokh Ayazi; Committee Member: James D. Meindl; Committee Member: John D. Cressler; Committee Member: Nazanin Bassiri-Gharb; Committee Member: Oliver Bran

DEVELOPMENT OF PIEZOELECTRIC MEMS DEVICES

Ph.DDOCTOR OF PHILOSOPH

Additive manufacturing (3D print) of air-coupled diaphragm ultrasonic transdrucers

Air-coupled ultrasound is a non-contact technology that has become increasingly common in Non Destructive Evaluation (NDE) and material evaluation. Normally, the bandwidth of a conventional transducer can be enhanced, but with a cost to its sensitivity. However, low sensitivity is very disadvantageous in air-coupled devices. This thesis proposes a methodology for improving the bandwidth of an air-coupled micro-machined ultrasonic transducer (MUT) without sensitivity loss by connecting a number of resonating pipes of various length to a cavity in the backplate. This design is inspired by the pipe organ musical instrument, where the resonant frequency (pitch) of each pipe is mainly determined by its length. The −6 dB bandwidth of the "pipe organ" inspired air-coupled transducer is 55.7% and 58.5% in transmitting and receiving modes, respectively, which is ∼5 times wider than a custom-built standard device. After validating the concept via a series of single element low-frequency prototypes, two improved designs: the multiple element and the high-frequency single element pipe organ transducers were simulated in order to tailor the pipe organ design to NDE applications.Although the simulated and experimental performance of the pipe organ inspired transducers are proved to be significantly better than the conventional designs, conventional micro-machined technologies are not able to satisfy their required 3D manufacturing resolution. In recent years, there has been increasing interest in using additive manufacturing (3D printing) technology to fabricate sensors and actuators due to rapid prototyping, low-cost manufacturing processes, customized features and the ability to create complex 3D geometries at micrometre scale. This work combines the ultrasonic diaphragm transducer design with a novel stereolithographic additive manufacturing technique. This includes developing a multi-material fabrication process using a commercial digital light processing printer and optimizing the formula of custom-built functional (conductive and piezoelectric) materials. A set of capacitive acoustic and ultrasonic transducers was fabricated using the additive manufacturing technology. The additive manufactured capacitive transducers have a receiving sensitivity of up to 0.4 mV/Pa at their resonant frequency.Air-coupled ultrasound is a non-contact technology that has become increasingly common in Non Destructive Evaluation (NDE) and material evaluation. Normally, the bandwidth of a conventional transducer can be enhanced, but with a cost to its sensitivity. However, low sensitivity is very disadvantageous in air-coupled devices. This thesis proposes a methodology for improving the bandwidth of an air-coupled micro-machined ultrasonic transducer (MUT) without sensitivity loss by connecting a number of resonating pipes of various length to a cavity in the backplate. This design is inspired by the pipe organ musical instrument, where the resonant frequency (pitch) of each pipe is mainly determined by its length. The −6 dB bandwidth of the "pipe organ" inspired air-coupled transducer is 55.7% and 58.5% in transmitting and receiving modes, respectively, which is ∼5 times wider than a custom-built standard device. After validating the concept via a series of single element low-frequency prototypes, two improved designs: the multiple element and the high-frequency single element pipe organ transducers were simulated in order to tailor the pipe organ design to NDE applications.Although the simulated and experimental performance of the pipe organ inspired transducers are proved to be significantly better than the conventional designs, conventional micro-machined technologies are not able to satisfy their required 3D manufacturing resolution. In recent years, there has been increasing interest in using additive manufacturing (3D printing) technology to fabricate sensors and actuators due to rapid prototyping, low-cost manufacturing processes, customized features and the ability to create complex 3D geometries at micrometre scale. This work combines the ultrasonic diaphragm transducer design with a novel stereolithographic additive manufacturing technique. This includes developing a multi-material fabrication process using a commercial digital light processing printer and optimizing the formula of custom-built functional (conductive and piezoelectric) materials. A set of capacitive acoustic and ultrasonic transducers was fabricated using the additive manufacturing technology. The additive manufactured capacitive transducers have a receiving sensitivity of up to 0.4 mV/Pa at their resonant frequency

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

Building a novel nanofabrication system using MEMS

Micro-electromechanical systems (MEMS) are electrically controlled micro-machines which have been widely used in both industrial applications and scientific research. This technology allows us to use macro-machines to build micro-machines (MEMS) and then use micro-machines to fabricate even smaller structures, namely nano-structures. In this thesis, the concept of Fab on a Chip will be discussed where we construct a palette of MEMS-based micron scale tools including lithography tools, novel atomic deposition sources, atomic mass sensors, thermometers, heaters, shutters and interconnect technologies that allow us to precisely fabricate nanoscale structures and conduct in-situ measurements using these micron scale devices. Such MEMS devices form a novel microscopic nanofabrication system that can be integrated into a single silicon chip. Due to the small dimension of MEMS, fabrication specifications including heat generation, patterning resolution and film deposition precision outperform traditional fabrication in many ways. It will be shown that one gains many advantages by doing nano-lithography and physical vapor deposition at the micron scale. As an application, I will showcase the power of the technique by discussing how we use Fab on a Chip to conduct quench condensation of superconducting Pb thin films where we are able to gently place atoms upon a surface, creating a uniform, disordered amorphous film and precisely tune the superconducting properties. This shows how the new set of techniques for nanofabrication will open up an unexplored regime for the study of the physics of devices and structures with small numbers of atoms

Microelectromechanical Systems and Devices

The advances of microelectromechanical systems (MEMS) and devices have been instrumental in the demonstration of new devices and applications, and even in the creation of new fields of research and development: bioMEMS, actuators, microfluidic devices, RF and optical MEMS. Experience indicates a need for MEMS book covering these materials as well as the most important process steps in bulk micro-machining and modeling. We are very pleased to present this book that contains 18 chapters, written by the experts in the field of MEMS. These chapters are groups into four broad sections of BioMEMS Devices, MEMS characterization and micromachining, RF and Optical MEMS, and MEMS based Actuators. The book starts with the emerging field of bioMEMS, including MEMS coil for retinal prostheses, DNA extraction by micro/bio-fluidics devices and acoustic biosensors. MEMS characterization, micromachining, macromodels, RF and Optical MEMS switches are discussed in next sections. The book concludes with the emphasis on MEMS based actuators