Accurate a priori signal integrity estimation using a multilevel dynamic interconnect model for deep submicron VLSI design.

A multilevel dynamic interconnect model was derived for accurate a priori signal integrity estimates. Cross-talk and delay estimations over interconnects in deep submicron technology were analyzed systematically using this model. Good accuracy and excellent time-efficiency were found compared with electromagnetic simulations. We aim to build a dynamic interconnect library with this model to facilitate the interconnect issues for future VLSI design

Tensor Computation: A New Framework for High-Dimensional Problems in EDA

Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

Comprehensive and modular stochastic modeling framework for the variability-aware assessment of Signal Integrity in high-speed links

This paper presents a comprehensive and modular modeling framework for stochastic signal integrity analysis of complex high-speed links. Such systems are typically composed of passive linear networks and nonlinear, usually active, devices. The key idea of the proposed contribution is to express the signals at the ports of each of such system elements or subnetworks as a polynomial chaos expansion. This allows one to compute, for each block, equivalent deterministic models describing the stochastic variations of the network voltages and currents. Such models are synthesized into SPICE-compatible circuit equivalents, which are readily connected together and simulated in standard circuit simulators. Only a single circuit simulation of such an equivalent network is required to compute the pertinent statistical information of the entire system, without the need of running a large number of time-consuming electromagnetic circuit co-simulations. The accuracy and efficiency of the proposed approach, which is applicable to a large class of complex circuits, are verified by performing signal integrity investigations of two interconnect examples

Study Of The Relationship Between Delta Delay And Adjacent Parallel Wire Length In 45 Nanometer Process Technology

Hierarchical design spans the complete framework of a design flow from Register Transfer Level (RTL), synthesis, place and route, timing closure and various other analyses before sign-off. Finer geometries and increasing interconnect density however have resulted signal integrity becoming the key issue for Deep Sub-Micron design. Post silicon bug due to noise and signal integrity can be prevented and fixed at early stage of the IC design cycle. The purpose of this research is to establish a preventive measurement for adjacent wire that can travel in parallel for 45nm technology. The intention is to ensure that a complex design can be delivered to the market with accurate, fast and trusted analysis and provide sign-off solution. Main approach is to conduct the relationship study between delta delay and adjacent parallel wire in 45 nanometer (nm) process technology and provide a preventive measurement to limit the adjacent wire can travel in parallel. The design is explored thoroughly to study the relationship between delay noise and adjacent parallel wire. The correlation is translated into an equation to estimate the delay noise produced with a certain length of adjacent parallel wire

Behavioral synthesis from VHDL using structured modeling

This dissertation describes work in behavioral synthesis involving the development of a VHDL Synthesis System VSS which accepts a VHDL behavioral input specification and performs technology independent synthesis to generate a circuit netlist of generic components. The VHDL language is used for input and output descriptions. An intermediate representation which incorporates signal typing and component attributes simplifies compilation and facilitates design optimization.A Structured Modeling methodology has been developed to suggest standard VHDL modeling practices for synthesis. Structured modeling provides recommendations for the use of available VHDL description styles so that optimal designs will be synthesized.A design composed of generic components is synthesized from the input description through a process of Graph Compilation, Graph Criticism, and Design Compilation. Experiments were performed to demonstrate the effects of different modeling styles on the quality of the design produced by VSS. Several alternative VHDL models were examined for each benchmark, illustrating the improvements in design quality achieved when Structured Modeling guidelines were followed

Towards a scalable and reliable wireless network-on-chip

Multi-core platforms are emerging trends in the design of Systems-on-Chip (SoCs). Interconnect fabrics for these multi-core SoCs play a crucial role in achieving the target performance. The Network-on-Chip (NoC) paradigm has been proposed as a promising solution for designing the interconnect fabric of multi-core SoCs. But the performance requirements of NoC infrastructures in future technology nodes cannot be met by relying only on material innovation with traditional scaling. The continuing demand for low power and high speed interconnects with technology scaling necessitates looking beyond the conventional planar metal/dielectric-based interconnect infrastructures. Among different possible alternatives, the on-chip wireless communication network is envisioned as a revolutionary methodology, capable of bringing significant performance gains for multi-core SoCs. Wireless NoCs (WiNoCs) can be designed by using miniaturized on-chip antennas as an enabling technology. In this work, design methodologies and technology requirements for scalable WiNoC architectures are presented and their performance is evaluated. It is demonstrated that WiNoCs outperform their wired counterparts in terms of network throughput and latency, and that energy dissipation improves by orders of magnitude under various experimental and real-life scenarios. A major challenge that NoC design is expected to face is related to the intrinsic unreliability of the interconnect infrastructure under technology limitations. The devices and components of the WiNoCs are expected to suffer high failure rates. By incorporating error control coding (ECC) schemes along the interconnects, NoC architectures will be able to provide correct functionality even in the presence of different sources of transient noise and yet have low energy dissipation. In this work, designs of novel joint crosstalk avoidance and multiple error correction/detection codes as well as burst error correction codes are proposed and their performance is evaluated in different WiNoC fabrics. It is demonstrated that by using the proposed codes WiNoCs can achieve the same reliability as a wireline NoC with much less energy dissipation and higher performance