Analysis of Dynamic Logic Circuits in Deep Submicron CMOS Technologies

Dynamic logic circuits are utilized to minimize the delay in the critical path of high-performance designs such as the datapath circuits in state-of-the-art microprocessors. However, as integrated circuits (ICs) scale to the very deep submicron (VDSM) regime, dynamic logic becomes susceptible to a variety of failure modes due to decreasing noise margins and increasing leakage currents. The objective of this thesis is to characterize the performance of dynamic logic circuits in VDSM technologies and to evaluate various design strategies to mitigate the effects of leakage currents and small noise margins

Automatic generation of user-defined test algorithm description file for memory BIST implementation

Memory built-in self-test (BIST) is a widely used technique to allow the self-test and self-checking of the embedded memories on chips after the fabrication process. It can be used by implementing a standard testing algorithm available in the EDA tool library or a user-defined algorithm (UDA). This paper presents the development of software that automatically generates a description file of a UDA to be deployed for memory BIST circuit implementation using Tessent memory BIST software. It comprises the test setup and also the microprogram coding for each instruction to be executed when performing tests on embedded memories. The proposed automation software was tested by using March SR as the input algorithm and the results obtained from the simulations show that the output test patterns generated by the implemented memory BIST match the expected patterns and passed all the tests, which validated the correct functionality of the UDA description file generation. The proposed automation software also fast generation the UDA description file, which was completed in less than 500 ms

Overcoming the challenges in very deep submicron for area reduction, power reduction and faster design closure

The project is aimed at understanding the existing very deep sub-micron (VDSM) implementation of a digital design, analyzing it from the point of view of power, area and timing and to come up with solutions and strategies to optimize the implementation in terms of power, area and timing. The effort involved, to understand the constraints, reasons and the requirements resulting in the existing implementation of the design. Further, various experiments were carried out to improve the design in various aspects like power, area and timing. The tradeoffs required and the benefits of each of the experiments were contrasted and analyzed. The optimum solutions and strategies which balance the requirements were tried out and published at the end of the report

Low Cost NBTI Degradation Detection and Masking Approaches

Performance degradation of integrated circuits due to aging effects, such as Negative Bias Temperature Instability (NBTI), is becoming a great concern for current and future CMOS technology. In this paper, we propose two monitoring and masking approaches that detect late transitions due to NBTI degradation in the combinational part of critical data paths and guarantee the correctness of the provided output data by adapting the clock frequency. Compared to recently proposed alternative solutions, one of our approaches (denoted as Low Area and Power (LAP) approach) requires lower area overhead and lower, or comparable, power consumption, while exhibiting the same impact on system performance, while the other proposed approach (denoted as High Performance (HP) approach) allows us to reduce the impact on system performance, at the cost of some increase in area and power consumption

DART: Dependable VLSI Test Architecture and Its Implementation

Although many electronic safety-related systems require very high reliability, it is becoming harder and harder to achieve it because of delay-related failures, which are caused by decreased noise margin. This paper describes a technology named DART and its implementation. The DART repeatedly measures the maximum delay of a circuit and the amount of degradation in field, in consequence, confirms the marginality of the circuit. The system employing the DART will be informed the significant reduction of delay margin in advance of a failure and be able to repair it at an appropriate time. The DART also equips a technique to improve the test coverage using the rotating test and a technique to consider the test environment such as temperature or voltage using novel ring-oscillator-based monitors. The authors applied the proposed technology to an industrial design and confirmed its effectiveness and availability with reasonable resources.2012 IEEE International Test Conference, 5-8 November 2012, Anaheim, CA, US

System-on-Chip Design and Test with Embedded Debug Capabilities

In this project, I started with a System-on-Chip platform with embedded test structures. The baseline platform consisted of a Leon2 CPU, AMBA on-chip bus, and an Advanced Encryption Standard decryption module. The basic objective of this thesis was to use the embedded reconfigurable logic blocks for post-silicon debug and verification. The System-on-Chip platform was designed at the register transistor level and implemented in a 180-nm IBM process. Test logic instrumentation was done with DAFCA (Design Automation for Flexible Chip Architecture) Inc. pre-silicon tools. The design was then synthesized using the Synopsys Design Compiler and placed and routed using Cadence SOC Encounter. Total transistor count is about 3 million, including 1400K transistors for the debug module serving as on chip logic analyzer. Core size of the design is about 4.8mm x 4.8mm and the system is working at 151MHz. Design verification was done with Cadence NCSim. The controllability and observability of internal signals of the design is greatly increased with the help of pre-silicon tools which helps locate bugs and later fix them with the help of post-silicon tools. This helps prevent re-spins on several occasions thus saving millions of dollars. Post-silicon tools have been used to program assertions and triggers and inject numerous personalities into the reconfigurable fabric which has greatly increased the versatility of the circuit

High-speed Low-voltage CMOS Flash Analog-to-Digital Converter for Wideband Communication System-on-a-Chip

With higher-level integration driven by increasingly complex digital systems and downscaling CMOS processes available, system-on-a-chip (SoC) is an emerging technology of low power, high cost effectiveness and high reliability and is exceedingly attractive for applications in high-speed data conversion wireless and wideband communication systems. This research presents a novel ADC comparator design methodology; the speed and performance of which is not restricted by the supply voltage reduction and device linearity deterioration in scaling-down CMOS processes. By developing a dynamic offset suppression technique and a circuit optimization method, the comparator can achieve a 3 dB frequency of 2 GHz in 130 nanometer (nm) CMOS process. Combining this new comparator design and a proposed pipelined thermometer-Gray- binary encoder designed by the DCVSPG logic, a high-speed, low-voltage clocked-digital- comparator (CDC) pipelined CMOS flash ADC architecture is proposed for wideband communication SoC. This architecture has advantages of small silicon area, low power, and low cost. Three CDC-based pipelined CMOS flash ADCs were implemented in 130 nm CMOS process and their experimental results are reported: 1. 4-b, 2.5-GSPS ADC: SFDR of 21.48-dB, SNDR of 15.99-dB, ENOB of 2.4-b, ERBW of 1-GHz, power of 7.9-mW, and area of 0.022-mm2. 2. 4-b, 4-GSPS ADC: SFDR of 25-dB, SNDR of 18.6-dB, ENOB of 2.8-b, ERBW of 2-GHz, power of 11-mW. 3. 6-b, 4-GSPS ADC: SFDR of 48-dB at a signal frequency of 11.72-MHz, SNDR of 34.43-dB, ENOB of 5.4-b, power of 28-mW. An application of the proposed CDC-based pipelined CMOS flash ADC is 1-GHz bandwidth, 2.5-GSPS digital receiver on a chip. To verify the performance of the receiver, a mixed-signal block-level simulation and verification flow was built in Cadence AMS integrated platform. The verification results of the digital receiver using a 4-b 2.5-GSPS CDC-based pipelined CMOS ADC, a 256-point, 12-point kernel function FFT and a frequency detection logic show that two tone signals up to 1125 MHz can be detected and discriminated. A notable contribution of this research is that the proposed ADC architecture and the comparator design with dynamic offset suppression and optimization are extremely suitable for future VDSM CMOS processes and make all-digital receiver SoC design practical

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF