A BCB Diaphragm Based Adhesive Wafer Bonded CMUT Probe for Biomedical Application

This dissertation presents the design methodology, fabrication procedure, and key experimental characterization results of a linear array of capacitive micromachined ultrasonic transducers (CMUT) for possible ophthalmic anterior segment imaging application. The design methodology involves analytical, 3-D electromechanical finite element analysis, and Verasonics Vantage 128 ultrasonic research platform based diagnostic imaging simulations to develop a technique that minimizes electrical charging and center frequency drift while improving the transduction efficiency. In the design, Bisbenzocyclobutene (BCB), a low K polymer from Dow Chemical Company, has been innovatively used for the first time to fabricate the structural layer of the CMUT diaphragm, realize the interelectrode dielectric spacer, and to act as a low temperature adhesive bonding agent. Additionally, the top CMUT electrode has been placed at the bottom of the diaphragm to affect higher capacitance change that increases sensitivity and provides additional decoupling of the electrical charging effects. Several arrays with element count ranging from 8 to 128 elements and a center frequency range of 5 MHz to 40 MHz have been designed and fabricated. Due to an unforeseen adhesion issue during wirebonding, a 32 channel 40 MHz CMUT array has been packaged manually to validate the fabrication process and CMUT operation. Extensive SEM inspections of the CMUT cross-sections show good agreement with the design specifications. Static and dynamic measurements using a Polytec laser Doppler vibrometer, impedance measurement using an Agilent vector network analyzer, and LCR measurement results are in excellent agreement with analytical and FEA analysis using IntelliSuite. The frequency analysis exhibits high electromechanical coupling coefficient of 0.66 at a low bias voltage of 20 V and high uniformity. A successful measurement of the lower drift of the center frequency 0.32% and higher coupling coefficient verifies the hypothesis that the excellent electrical, structural, and processing characteristics of BCB is a viable option to mitigate the dielectric charging and improve the transduction efficiency of CMUTs

CMUT Crosstalk Reduction Using Crosslinked Silica Aerogel

Inter-element acoustic crosstalk is one of the major concerns which restricts the potential deployment of Capacitive Micromachined Ultrasonic Transducers (CMUTs) in Nondestructive Evaluation (NDE) despite its superior transduction capabilities. This thesis investigates the causes of acoustic crosstalk in CMUTs and develops a novel method of CMUT crosstalk reduction by passivating the CMUT top surface by a thin layer of Di-isocyanate enhanced crosslinked silica aerogel. This powerful technique derives its inspiration from the Scholte waves attenuation techniques as used in boreholes at the permeable formations. Analytical and 3D finite element analysis in MATLAB and COMSOL Multiphysics, respectively, show that the developed technique can minimize the crosstalk due to Scholte waves at the fluid-solid interfaces by at least 5 dB more at the nearest neighbor as compared to other published techniques. An added advantage of the developed technique is that the level of Scholte wave attenuation can be controlled by altering the porosity of the aerogel layer. A simple and cost-effective fabrication process employing sol-gel and ambient pressure drying processes for the aerogel layer deposition has been developed that doesn’t interfere with the basic CMUT operation or fabrication techniques

A 2D CMUT Array for Liver Elastography

Proper diagnosis of liver disease at an early stage is very crucial for its effective treatment. Chronic liver disease if not treated can often lead to cirrhosis. At present, liver biopsy is the main diagnostic procedure. A non-destructive, patient friendly diagnostic imaging technology is necessary. Piezoelectric transducer used for High Intensity Focused Ultrasound (HIFU) has a narrower bandwidth, thus a single transducer cannot be used for both imaging and HIFU operation. But capacitive micromachined ultrasonic tranducers (CMUTs) can be used for both HIFU and imaging. In this thesis work, a unique design has been proposed where a first attempt has been made to design a 2D CMUT array for dual mode operation to detect liver cancer. First is the HIFU mode, where the device transmits a focused ultrasound to the target region in the liver just to momentarily deform (Strain) the liver tissue. Then the same device is switched to second mode which is an imaging mode. In this mode the ultrasonic image is captured using elastography process. Analytical and 3D finite element analysis has been carried out in MATLAB and Intellisuite software, respectively. Bisbenzocyclobutene (BCB), a low K polymer is used as a primary structural material for the CMUT membrane and also for the structure of the CMUT. Gold is used as a top conductor placed on top of the diaphragm. Analytical calculations have been done on several CMUT cells in an array while designing the final array. Elements ranging from 8x8, 16x16, 32x32, and 64x64 have been analyzed. Finally, 64x64 array have been used for best results with a center frequency of 7.5 MHz which are in great agreement with FEA analysis done using Intellisuite software

Semiconductor Infrared Devices and Applications

Infrared (IR) technologies—from Herschel’s initial experiment in the 1800s to thermal detector development in the 1900s, followed by defense-focused developments using HgCdTe—have now incorporated a myriad of novel materials for a wide variety of applications in numerous high-impact fields. These include astronomy applications; composition identifications; toxic gas and explosive detection; medical diagnostics; and industrial, commercial, imaging, and security applications. Various types of semiconductor-based (including quantum well, dot, ring, wire, dot in well, hetero and/or homo junction, Type II super lattice, and Schottky) IR (photon) detectors, based on various materials (type IV, III-V, and II-VI), have been developed to satisfy these needs. Currently, room temperature detectors operating over a wide wavelength range from near IR to terahertz are available in various forms, including focal plane array cameras. Recent advances include performance enhancements by using surface Plasmon and ultrafast, high-sensitivity 2D materials for infrared sensing. Specialized detectors with features such as multiband, selectable wavelength, polarization sensitive, high operating temperature, and high performance (including but not limited to very low dark currents) are also being developed. This Special Issue highlights advances in these various types of infrared detectors based on various material systems

A 77 GHz BCB BASED HIGH PERFORMANCE ANTENNA ARRAY FOR AUTONOMOUS VEHICLE RADARS

A bisbenzocyclobutene (BCB) based 77 GHz aperture coupled microstrip antenna array for frequency modulated continuous wave (FMCW) automotive radars has been developed for use in automotive collision avoidance and cruise control applications. Each of the microstrip patches of the developed antenna array has been desiged to have a microfbaricated airfilled cavity to realize a synthesized effective dielectric constant of 1.46 in contrast to original BCB dielectric constant of 2.6 to improve the diecrectivity, gain, and bandwidth in a compact footprint suitable for small automotive radars. The developed antenna array has a foot print area of 20 x 21 mm2 to accommodate 56 micorstrip patches in a 7 x 8 matrix configuration. Each of the gold patches has a length of 1.46 mm and a width of 1.7 mm. The anteena array exhibits an ADS™ (Advanced Dsign Systems) 3D simulated -10 dB bandwidth of 4.2 GHz, 22.5 dBi directivity, and a gain of 19.78 dBi with sidelobe levels lower than 13.78 dB to meet the auto industry roadmap reccommendations. A fabrication process table has been developed and simualated successfully using IntelliSuite™, an industry standard software. The developed process table can be used to fabricate the device. The developed antenna array will pave the way to manufacture low cost high performance automotive radars to mitigate fatal crashes to save lives and minimize property and infrastructural damage while also forming an integral part of the adaptive cruise control system for autonomous vehicles

Integrated sensors for process monitoring and health monitoring in microsystems

This thesis presents the development of integrated sensors for health monitoring in Microsystems, which is an emerging method for early diagnostics of status or “health” of electronic systems and devices under operation based on embedded tests. Thin film meander temperature sensors have been designed with a minimum footprint of 240 m × 250 m. A microsensor array has been used successfully for accurate temperature monitoring of laser assisted polymer bonding for MEMS packaging. Using a frame-shaped beam, the temperature at centre of bottom substrate was obtained to be ~50 ºC lower than that obtained using a top-hat beam. This is highly beneficial for packaging of temperature sensitive MEMS devices. Polymer based surface acoustic wave humidity sensors were designed and successfully fabricated on 128° cut lithium niobate substrates. Based on reflection signals, a sensitivity of 0.26 dB/RH% was achieved between 8.6 %RH and 90.6 %RH. Fabricated piezoresistive pressure sensors have also been hybrid integrated and electrically contacted using a wire bonding method. Integrated sensors based on both LiNbO3 and ZnO/Si substrates are proposed. Integrated sensors were successfully fabricated on a LiNbO3 substrate with a footprint of 13 mm × 12 mm, having multi monitoring functions for simultaneous temperature, measurement of humidity and pressure in the health monitoring applications

Diode laser processing of PMMA and LCP materials for microsystem packaging

The thesis describes the development of laser-assisted bonding methods for assembly of microfluidic devices and MEMS packaging. A laser microwelding technique for assembly of transparent polymer substrates for fabrication of microfluidic devices was studied. The transparent PMMA substrates were bonded together using a high power diode laser system with a broad top-hat beam profile and an intermediate titanium thin film consisting of 0.7 mm diameter spots. A tensile strength of 6 MPa was achieved for this novel method which is comparable to that of the previous work in laser welding of polymers. It has been demonstrated that the method is capable of leak free encapsulation of a microfluidic channel. Furthermore, a novel laser-based method using an LCP film for packaging of MEMS, sensors and other microelectronic devices has been investigated. The results show that it is possible to use a laser based method with an LCP polymer for high quality substrate bonding applications. Glass-glass based cavities allow optical transmission and have potential applications for optical sensors and other photonic devices. For glass-glass bonding, it was shown that thin film titanium material can be used as an effective optical absorber in the laser based LCP bonding technique. Laser bonding of glass and silicon using an LCP film has also been achieved but in this case the silicon substrate acted as the absorber to capture the laser power. Laser bonding of a silicon cap to a molded LCP package has also been demonstrated successfully. The results of temperature monitoring using embedded sensors show that the temperature at the base of the LCP package (~130C) is substantially lower than the bonding temperature (> 280C). The results of shear and leak test show good reliability and hermeticity of the laser bonded microcavities. Both two-dimensional and three-dimensional models of heat transfer are developed and studied using the COMSOL Multiphysics software tool to understand the localised laser heating effects. The results are in good agreement with those of the practical work

Benzocyclobutene-based Electric Micromachines Supported on Microball Bearings: Design, Fabrication, and Characterization

This dissertation summarizes the research activities that led to the development of the first microball-bearing-supported linear electrostatic micromotor with benzocyclobutene (BCB) low-k polymer insulating layers. The primary application of this device is long-range, high-speed linear micropositioning. The future generations of this device include rotary electrostatic micromotors and microgenerators. The development of the first generation of microball-bearing-supported micromachines, including device theory, design, and modeling, material characterization, process development, device fabrication, and device test and characterization is presented. The first generation of these devices is based on a 6-phase, bottom-drive, linear, variable-capacitance micromotor (B-LVCM). The design of the electrical and mechanical components of the micromotor, lumped-circuit modeling of the device and electromechanical characteristics, including variable capacitance, force, power, and speed are presented. Electrical characterization of BCB polymers, characterization of BCB chemical mechanical planarization (CMP), development of embedded BCB in silicon (EBiS) process, and integration of device components using microfabrication techniques are also presented. The micromotor consists of a silicon stator, a silicon slider, and four stainless-steel microballs. The aligning force profile of the micromotor was extracted from simulated and measured capacitances of all phases. An average total aligning force of 0.27 mN with a maximum of 0.41 mN, assuming a 100 V peak-to-peak square-wave voltage, was measured. The operation of the micromotor was verified by applying square-wave voltages and characterizing the slider motion. An average slider speed of 7.32 mm/s when excited by a 40 Hz, 120 V square-wave voltage was reached without losing the synchronization. This research has a pivotal impact in the field of power microelectromechanical systems (MEMS). It establishes the foundation for the development of more reliable, efficient electrostatic micromachines with variety of applications such as micropropulsion, high-speed micropumping, microfluid delivery, and microsystem power generation