N-Link Modular Smart Robotic Arm

Today, 2.6 million industrial robots have been deployed for applications worldwide, allowing us to produce, sort, and create products faster. The goal of this MQP is to develop a modular robotic arm with N-links that can position its end effector in a 3D task space regarding of the number of links attached. It is also a priority that the arm is fault-tolerant and can be removed and attached in real-time without requiring a reboot. The results of this project show a detailed evaluation for the modular robotic arm that verifies that the arm would operate as predicted if it were fully constructed

Advancement in robot programming with specific reference to graphical methods

This research study is concerned with the derivation of advanced robot programming methods. The methods include the use of proprietary simulation modelling and design software tools for the off-line programming of industrial robots. The study has involved the generation of integration software to facilitate the co-operative operation of these software tools. The three major researcli'themes7of "ease of usage", calibration and the integration of product design data have been followed to advance robot programming. The "ease of usage" is concerned with enhancements in the man-machine interface for robo t simulation systems in terms of computer assisted solid modelling and computer assisted task generation. Robot simulation models represent an idealised situation, and any off-line robot programs generated from'them may contain'discrepancies which could seriously effect thq programs' performance; Calibration techniques have therefore been investigated as 'a method of overcoming discrepancies between the simulation model and the real world. At the present time, most computer aided design systems operate as isolated islands of computer technology, whereas their product databases should be used to support decision making processes and ultimately facilitate the generation of machine programs. Thus the integration of product design data has been studied as an important step towards truly computer integrated manufacturing. The functionality of the three areas of study have been generalised and form the basis for recommended enhancements to future robot programming systems

From FPGA to ASIC: A RISC-V processor experience

This work document a correct design flow using these tools in the Lagarto RISC- V Processor and the RTL design considerations that must be taken into account, to move from a design for FPGA to design for ASIC

Automated PCB identification and defect-detection system (APIDS)

Ever growing PCB industry requires automation during manufacturing process to produce defect free products. Machine Vision is widely used as popular means of inspection to find defects in PCBs. However, it is still largely dependent on user input to select algorithm set for the PCB under inspection prior to the beginning of the process. Continuous increase in computation power of computers and image quality of image acquisition devices demands new methods for further automation. This paper proposes a new method to achieve further automation by identifying the type of PCB under inspection prior to begin defect inspection process. Identification of PCB is achieved by using local feature detectors SURF and ORB and using the orientation data acquired to transform the PCB image to the reference image for inspection of defects. A close-loop system is produced as a prototype to reflect the practicality of the idea. A Graphical User Interface was developed using MATLAB to present the proposed system. Test data contained 29 PCBs. Each PCB was tested 5 times for camera acquired images and 3 times for database images. The identification accuracy is 98.66% for database images and 100% for images acquired from the camera. The time taken to detect the model of PCB is recorded and is significantly lower for ORB based identification than SURF based. The system is also a close loop system which detects defects in PCB units. The detection of defects has highest accuracy of 92.3% for best controlled environment scenario. With controlled environment, the system could detect defects in PCB pertaining to smallest of components such as SMDs

A Company-led Methodology for the Specification of Product Design Capabilities in Small and Medium Sized Electronics Companies

It is the aim of the research reported in this thesis to improve the product design effectiveness of small and medium sized electronics companies in the United Kingdom. It does so by presenting a methodology for use by such firms which will enable them to specify product design capabilities which are resilient to changes in their respective business environments. The research has not, however, concerned itself with the details of particular electronics component technologies or with the advantages of various CAD or CAE products, although these are both important aspects of any design capability. Nor is it concerned with the implementation of the product design capability. The methodology, which represents a significant improvement on current practice, is a structured, company-driven approach which draws extensively upon the lessons of international design best practice. It uses well-proven tools and techniques to guide firms through the entire process of creating such capabilities - from the development of an appropriate Mission Statement to the identification of cost effective and appropriate design system solutions which can readily be translated into action plans for improvement. The work emphasises the importance of adopting a holistic, systems approach which acknowledges the interrelationship between the management of the design process, as well as its operational and supporting activities. The research has been structured around the experiences of companies which have implemented electronics design systems and which "own" the problem in question. Hence, a research strategy was adopted which was based upon a case study approach and upon the development of close collaborative links with two leading design automation tool vendor companies. Case study interviews were undertaken in 18 U.K. and European electronics companies and in 11 U.S., Japanese and Korean electronics firms. The work proceeded in two distinct phases. Firstly, the author participated with other researchers to jointly develop a functional specification of an electronics designers' toolset to support the process of product design in an integrated manufacturing environment. The first phase provided the context for Phase 2, the development of the AGILITY methodology for specifying product design capabilities which represents the author's individual contribution. The contribution to knowledge made by the research lies in the creation of a process methodology which, for the first time, will help U.K. electronics companies to define for themselves product design capabilities which are robust and which support their wider business objectives. No such methodology is currently available in a form which is both accessible and affordable to smaller firms. Furthermore, the author has uncovered no evidence of the existence of such a methodology even for use by large electronics firms. Validation of the methodology is subject to an ongoing process of feedback.Racal Redac Lt

Robotic disassembly of electronic components to support end‐of‐life recycling of electric vehicles

This thesis reports on the research undertaken to analyse the factors affecting End-of-Life (EoL) recycling of future Electric Vehicles (EVs). The principle objective of the research is to generate an understanding of challenges and opportunities for the development and implementation of an automated robotic disassembly approach to aid with EoL management of electrical and electronic components within EVs. The research contributions are considered in three main parts. The first part contains a review of advancement in the development of automotive technology, and in particular the alternative fuel vehicles. A review of existing industrial recycling technologies and processes has been conducted which highlighted a number of key challenges in the adoption of current recycling technologies for EVs. The review concludes that there is a need to develop novel recycling technologies and processes to deal with the increased part complexity and material mixture in such vehicles. In this context, the second part of the research details a framework for EoL management of EV components. This framework presents a comprehensive automated robotic disassembly approach in which three specific steps are defined, namely manual disassembly to develop an understanding of product design, initial automated disassembly to test process capability, and optimisation and validation to improve repeatability and efficiency of the robotic disassembly operations. The framework also includes the development of a multi-criteria decision-making tool that assesses the environmental, technological and economic benefits of such robotic disassembly approach. The applicability of the research concepts has been demonstrated via three case studies. The results have highlighted the applicability of the automated robotic disassembly approach in a variety of scenarios of different design complexity and recovery rate. The results indicate that the adoption of this robotic disassembly enhances the pre-concentration of Strategically Important Materials (SIMs) and leads to minimisation of environmental impacts and increased material recovery value

Capturing design process information and rationale to support knowledge-based design and analysis integration

Issued as final reportUnited States. Dept. of Commerc

Next-Generation Pedal: Integration of Sensors in a Braking Pedal for a Full Brake-by-Wire System

This article presents a novel approach to designing and validating a fully electronic braking pedal, addressing the growing integration of electronics in vehicles. With the imminent rise of brake-by-wire (BBW) technology, the brake pedal requires electronification to keep pace with industry advancements. This research explores technologies and features for the next-generation pedal, including low-power consumption electronics, cost-effective sensors, active adjustable pedals, and a retractable pedal for autonomous vehicles. Furthermore, this research brings the benefits of the water injection technique (WIT) as the base for manufacturing plastic pedal brakes towards reducing cost and weight while enhancing torsional stiffness. Communication with original equipment manufacturers (OEMs) has provided valuable insights and feedback, facilitating a productive exchange of ideas. The findings include two sensor prototypes utilizing inductive technology and printed-ink gauges. Significantly, reduced power consumption was achieved in a Hall-effect sensor already in production. Additionally, a functional BBW prototype was developed and validated. This research presents an innovative approach to pedal design that aligns with current electrification trends and autonomous vehicles. It positions the braking pedal as an advanced component that has the potential to redefine industry standards. In summary, this research significantly contributes to the electronic braking pedal technology presenting the critical industry needs that have driven technical studies and progress in the field of sensors, electronics, and materials, highlighting the challenges that component manufacturers will inevitably face in the forthcoming years.This work has been partially supported by the grant “Ayudas para el desarrollo de proyectos de I+D mediante la contratación de personas doctoradas y la realización de doctorados industriales, programa BIKAINTEK 2019” by the Department of Economic Development, Sustainability, and Environment of the Basque Government. Additionally, this work has been partially supported by the Government of Spain, through the Center for the Development of Industrial Technology (CDTI) under grant agreement IDI-20200198 and by Eusko Jaularitza-Gobierno Vasco (SOC4CRIS KK-2023/00015)

Internationalisation of Innovation: Why Chip Design Moving to Asia

This paper will appear in International Journal of Innovation Management, special issue in honor of Keith Pavitt, (Peter Augsdoerfer, Jonathan Sapsed, and James Utterback, guest editors), forthcoming. Among Keith Pavitt's many contributions to the study of innovation is the proposition that physical proximity is advantageous for innovative activities that involve highly complex technological knowledge But chip design, a process that creates the greatest value in the electronics industry and that requires highly complex knowledge, is experiencing a massive dispersion to leading Asian electronics exporting countries. To explain why chip design is moving to Asia, the paper draws on interviews with 60 companies and 15 research institutions that are doing leading-edge chip design in Asia. I demonstrate that "pull" and "policy" factors explain what attracts design to particular locations. But to get to the root causes that shift the balance in favor of geographical decentralization, I examine "push" factors, i.e. changes in design methodology ("system-on-chip design") and organization ("vertical specialization" within global design networks). The resultant increase in knowledge mobility explains why chip design - that, in Pavitt's framework is not supposed to move - is moving from the traditional centers to a few new specialized design clusters in Asia. A completely revised and updated version has been published as: " Complexity and Internationalisation of Innovation: Why is Chip Design Moving to Asia?," in International Journal of Innovation Management, special issue in honour of Keith Pavitt, Vol. 9,1: 47-73.

Indoor Navigation and Manipulation using a Segway RMP

This project dealt with a Segway RMP, utilizing it in an assistive-technology manner, encompassing navigation and manipulation aspects of robotics. First, background research was conducted to develop a blueprint for the robot. The hardware, software, and configuration of the RMP was updated, and a robotic arm was designed to extend the RMP’s capabilities. The robot was programmed to accomplish autonomous multi-floor navigation through the use of the navigation stack in ROS, image detection, and a GUI. The robot can navigate through the hallways of the building utilizing the elevator. The robotic arm was designed to accomplish tasks such as pressing a button and picking an object up off of a table. The Segway RMP is designed to be utilized and expanded upon as a robotics research platform