Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

Automatic synthesis and optimization of chip multiprocessors

The microprocessor technology has experienced an enormous growth during the last decades. Rapid downscale of the CMOS technology has led to higher operating frequencies and performance densities, facing the fundamental issue of power dissipation. Chip Multiprocessors (CMPs) have become the latest paradigm to improve the power-performance efficiency of computing systems by exploiting the parallelism inherent in applications. Industrial and prototype implementations have already demonstrated the benefits achieved by CMPs with hundreds of cores.CMP architects are challenged to take many complex design decisions. Only a few of them are:- What should be the ratio between the core and cache areas on a chip?- Which core architectures to select?- How many cache levels should the memory subsystem have?- Which interconnect topologies provide efficient on-chip communication?These and many other aspects create a complex multidimensional space for architectural exploration. Design Automation tools become essential to make the architectural exploration feasible under the hard time-to-market constraints. The exploration methods have to be efficient and scalable to handle future generation on-chip architectures with hundreds or thousands of cores.Furthermore, once a CMP has been fabricated, the need for efficient deployment of the many-core processor arises. Intelligent techniques for task mapping and scheduling onto CMPs are necessary to guarantee the full usage of the benefits brought by the many-core technology. These techniques have to consider the peculiarities of the modern architectures, such as availability of enhanced power saving techniques and presence of complex memory hierarchies.This thesis has several objectives. The first objective is to elaborate the methods for efficient analytical modeling and architectural design space exploration of CMPs. The efficiency is achieved by using analytical models instead of simulation, and replacing the exhaustive exploration with an intelligent search strategy. Additionally, these methods incorporate high-level models for physical planning. The related contributions are described in Chapters 3, 4 and 5 of the document.The second objective of this work is to propose a scalable task mapping algorithm onto general-purpose CMPs with power management techniques, for efficient deployment of many-core systems. This contribution is explained in Chapter 6 of this document.Finally, the third objective of this thesis is to address the issues of the on-chip interconnect design and exploration, by developing a model for simultaneous topology customization and deadlock-free routing in Networks-on-Chip. The developed methodology can be applied to various classes of the on-chip systems, ranging from general-purpose chip multiprocessors to application-specific solutions. Chapter 7 describes the proposed model.The presented methods have been thoroughly tested experimentally and the results are described in this dissertation. At the end of the document several possible directions for the future research are proposed

Scanning Probe Investigations of the Surface Self-Assembly of Organothiols and Organosilanes Using Nanoscale Lithography

Particle lithography and scanning probe lithography were applied to study the kinetics and mechanisms of surface self-assembly processes. Organothiols on Au(111) and organosilane on Si(111) were chosen as model systems for investigations at the nanoscale using atomic force microscopy (AFM). Fundamental insight of structure/property interrelationships and understanding the properties of novel materials are critical for developments with molecular devices. Methods using an AFM probe for nanofabrication have been applied successfully to prepare sophisticated molecular architectures with high reproducibility and spatial precision. The established capabilities of AFM-based nanografting were reviewed for inscribing patterns of diverse composition, to generate complicated surface designs with well-defined chemistries. Nanografting provides a versatile tool for generating nanostructures of organic and biological molecules, as well as nanoparticles. Protocols of nanografting are accomplished in liquid media, providing a mechanism for introducing new reagents for successive in situ steps for 3-D fabrication of designed nanopatterns. Because so many chemical reactions can be accomplished in solution, there are rich possibilities for chemists to design studies of other surface reactions. Surface assembly and self-polymerization of chloromethylphenyltrichlorosilane (CMPS) were investigated using test platforms of organosilanes fabricated with particle lithography. A thin film of octadecyltrichlorosilane (OTS) with well-defined nanopores was prepared on Si(111) to spatially confine the surface assembly of CMPS within nanopores of OTS. Time-dependent changes during the self-polymerization of CMPS was visualized ex situ using AFM. Molecular-level details of CMPS nanostructures were obtained from high resolution AFM images to track the growth of organosilanes on Si(111). Measurements of the heights and diameters of CMPS nanostructures provided quantitative information of the kinetics of CMPS self-polymerization. Scanning probe-based methods of nanolithography were applied to investigate the self-assembly of a tridentate organothiol, 1,1,1-tris(mercaptomethyl)heptadecane (TMMH). Multidentate adsorbates can address problems with long-term stability to oxidation observed with monothiolated n-alkylthiols. Multidentate thiol ligands demonstrate improved resistance to oxidation, thermal desorption and UV exposure. Progressive changes in surface morphology for TMMH assembly onto Au(111) was studied in situ with time-lapse AFM, monitoring changes in surface coverage at different time intervals. Nanoshaving and nanografting were used as molecular rulers to evaluate the thickness of films of TMMH

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Scanning Probe Investigations of Nanopatterned and Thermo-responsive Polypeptoids and the Design of a Sample Stage for Force Modulation Microscopy

Protocols for patterning nanostructures of polymers were developed to enable scanning probe microscopy (SPM) studies of surface properties at the molecular level. A chemically selective surface for patterning polymers was generated by combining particle lithography with organosilane immersion. Poly(N-allyl glycine), a biocompatible and backbone degradable polypeptoid, was grown on Si(111) at confined amine sites using surface-initiated polymerization (also known as the “graft from” approach). A thermo-responsive random copolypeptoid, poly[(N-ethyl glycine)32-r-(N-butyl glycine17)], was pre-synthesized and attached onto a patterned organosilane surface using a thiol-ene click reaction (“graft to” approach). The phase transitions of the copolypeptoid nanostructures in an aqueous environment was studied using in situ atomic force microscopy (AFM). A heated stage was used to heat the nanopatterned sample in liquid media. Force modulation microscopy (FMM), one of over 50 possible modes of SPM, is used to acquire mechanical properties of samples concurrent with topographic information. The history, instrument set-up, advantages, and applications with self-assembled monolayers, polymers, biological and inorganic samples are reviewed in this dissertation. The sample is placed directly on an xyz scanner for the most common FMM configuration. Most commercial SPM systems are designed to have the tip mounted on the piezotube scanner. To facilitate FMM with tip-mounted scanners, a sample stage was designed and constructed of machined polycarbonate. A piezoactuator in the sample stage was used to drive the vibration of the sample in the z-direction at selected frequency and amplitude. The sample stage was evaluated by studying three samples with increasing complexity. This sample-driven FMM was compared with indirect magnetic modulation (IMM), an alternate way to accomplish force modulation studies by modulating the nosecone assembly. A test platform of patterned nanoring samples was evaluated to systematically compare FMM and IMM. Both methods can be used to sensitively acquire high resolution images of sample elasticity. However, the newly designed sample stage for FMM is easier to operate compared with IMM

Head-of-Line Blocking Reduction in Power-Efficient Networks-on-Chip

Tesis por compendioNowadays, thanks to the continuous improvements in the integration scale, more and more cores are added on the same chip, leading to higher system performance. In order to interconnect all nodes, a network-on-chip (NoC) is used, which is in charge of delivering data between cores. However, increasing the number of cores leads to a significant power consumption increase, leading the NoC to be one of the most expensive components in terms of power. Because of this, during the last years, several mechanisms have been proposed to address the NoC power consumption by means of DVFS (Dynamic Voltage and Frequency Scaling) and power-gating strategies. Nevertheless, improvements achieved by these mechanisms are achieved, to a greater or lesser extent, at the cost of system performance, potentially increasing the risk of saturating the network by forming congested points which, in turn, compromise the rest of the system functionality. One side effect is the creation of the "Head-of-Line blocking" effect where congested packets at the head of queues prevent other non-blocked packets from advancing. To address this issue, in this thesis, on one hand, we propose novel congestion control techniques in order to improve system performance by removing the "Head-of-Line" blocking effect. On the other hand, we propose combined solutions adapted to DVFS in order to achieve improvements in terms of performance and power. In addition to this, we propose a path-aware power-gating-based mechanism, which is capable of detecting the flows sharing buffer resources along data paths and perform to switch them off when not needed. With all these combined solutions we can significantly reduce the power consumption of the NoC when compared with state-of-the-art proposals.Hoy en día, gracias a las mejoras en la escala de integración cada vez se integran más y más núcleos en un mismo chip, mejorando así sus prestaciones. Para interconectar todos los nodos dentro del chip se emplea una red en chip (NoC, Network-on-Chip), la cual es la encargada de intercambiar información entre núcleos. No obstante, aumentar el número de núcleos en el chip también conlleva a su vez un importante incremento en el consumo de la NoC, haciendo que ésta se convierta en una de las partes más caras del chip en términos de consumo. Por ello, en los últimos años se han propuesto diversas técnicas de ahorro de energía orientadas a reducir el consumo de la NoC mediante el uso de DVFS (Dynamic Voltage and Frequency Scaling) o estrategias basadas en "power-gating". Sin embargo, éstas mejoras de consumo normalmente se obtienen a costa de sacrificar, en mayor o menor medida, las prestaciones del sistema, aumentado potencialmente así el riesgo de saturar la red, generando puntos de congestión que, a su vez, comprometen el rendimiento del resto del sistema. Un efecto colateral es el "Head-of-Line blocking", mediante el que paquetes congestionados en la cabeza de la cola impiden que otros paquetes no congestionados avancen. Con el fin de solucionar este problema, en ésta tesis, en primer lugar, proponemos técnicas novedosas de control de congestión para incrementar el rendimiento del sistema mediante la eliminación del "Head-of-Line blocking", mientras que, por otra parte, proponemos soluciones combinadas adaptadas a DVFS con el fin de conseguir mejoras en términos de rendimiento y energía. Además, proponemos una técnica de "power-gating" orientada a rutas de datos, la cual es capaz de detectar flujos de datos compartiendo recursos a lo largo de rutas y apagar dichos recursos de forma dinámica cuando no son necesarios. Con todas éstas soluciones combinadas podemos reducir el consumo de energía de la NoC en comparación con otras técnicas presentes en el estado del arte.Hui en dia, gr\`acies a les millores en l'escala d'integraci\'o, cada vegada s'integren m\'es i m\'es nuclis en un mateix xip, la qual cosa millora les seues prestacions. Per tal d'interconectar tots els nodes dins el xip es fa \'us d'una Xarxa en Xip (NoC; Network-on-Chip), la qual \'es l'encarregada d'intercanviar informaci\'o entre els nuclis. No obstant aix\`o, incrementar el nombre de nuclis en el xip tamb\'e comporta un important augment en el consum de la NoC, la qual cosa fa que aquesta es convertisca en una de les parts m\'es costoses del xip en termes de consum. Per aix\`o, en els \'ultims anys s'han proposat diverses t\`ecniques d'estalvi d'energia orientades a reduir el consum de la NoC mitjançant l'\'us de DVFS (Dynamic Voltage and Frequency Scaling) o estrat\`egies basades en ``power-gating''. Malgrat aix\`o, aquestes millores en les prestacions normalment s'obtenen a costa de sacrificar, en major o menor mesura, les prestacions del sistema i augmenta aix\'i el risc de saturar la xarxa al generar-se punts de congesti\'o, que al mateix temps, comprometen el rendiment de la resta del sistema. Un efecte col-lateral \'es el ``Head-of- Line blocking'', mitjançant el qual, els paquets congestionats al cap de la cua, impedixen que altres paquets no congestionats avancen. A fi de solucionar eixe problema, en aquesta tesi, en primer lloc, proposem noves t\`ecniques de control de congesti\'o amb l'objectiu d'incrementar el rendiment del sistema per mitj\`a de l'eliminaci\'o del ``Head-of- Line blocking'', i d'altra banda, proposem solucions combinades adaptades a DVFS amb la finalitat d'aconseguir millores en termes de rendiment i energia. A m\'es, proposem una t\`ecnica de ``power-gating'' orientada a rutes de dades, la qual \'es capa\c c de detectar fluxos de dades al compartir recursos al llarg de les rutes i apagar eixos recursos de forma din\`amica quan no s\'on necessaris. Amb totes aquestes solucions combinades podem reduir el consum d'energia de la NoC en comparaci\'o amb altres t\`ecniques presents en l'estat de l'art.Escamilla López, JV. (2017). Head-of-Line Blocking Reduction in Power-Efficient Networks-on-Chip [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/90419TESISCompendi

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures