Power Management Techniques for Data Centers: A Survey

With growing use of internet and exponential growth in amount of data to be stored and processed (known as 'big data'), the size of data centers has greatly increased. This, however, has resulted in significant increase in the power consumption of the data centers. For this reason, managing power consumption of data centers has become essential. In this paper, we highlight the need of achieving energy efficiency in data centers and survey several recent architectural techniques designed for power management of data centers. We also present a classification of these techniques based on their characteristics. This paper aims to provide insights into the techniques for improving energy efficiency of data centers and encourage the designers to invent novel solutions for managing the large power dissipation of data centers.Comment: Keywords: Data Centers, Power Management, Low-power Design, Energy Efficiency, Green Computing, DVFS, Server Consolidatio

Energy challenges for ICT

The energy consumption from the expanding use of information and communications technology (ICT) is unsustainable with present drivers, and it will impact heavily on the future climate change. However, ICT devices have the potential to contribute signi - cantly to the reduction of CO2 emission and enhance resource e ciency in other sectors, e.g., transportation (through intelligent transportation and advanced driver assistance systems and self-driving vehicles), heating (through smart building control), and manu- facturing (through digital automation based on smart autonomous sensors). To address the energy sustainability of ICT and capture the full potential of ICT in resource e - ciency, a multidisciplinary ICT-energy community needs to be brought together cover- ing devices, microarchitectures, ultra large-scale integration (ULSI), high-performance computing (HPC), energy harvesting, energy storage, system design, embedded sys- tems, e cient electronics, static analysis, and computation. In this chapter, we introduce challenges and opportunities in this emerging eld and a common framework to strive towards energy-sustainable ICT

DReAM: An approach to estimate per-Task DRAM energy in multicore systems

Accurate per-task energy estimation in multicore systems would allow performing per-task energy-aware task scheduling and energy-aware billing in data centers, among other applications. Per-task energy estimation is challenged by the interaction between tasks in shared resources, which impacts tasks’ energy consumption in uncontrolled ways. Some accurate mechanisms have been devised recently to estimate per-task energy consumed on-chip in multicores, but there is a lack of such mechanisms for DRAM memories. This article makes the case for accurate per-task DRAM energy metering in multicores, which opens new paths to energy/performance optimizations. In particular, the contributions of this article are (i) an ideal per-task energy metering model for DRAM memories; (ii) DReAM, an accurate yet low cost implementation of the ideal model (less than 5% accuracy error when 16 tasks share memory); and (iii) a comparison with standard methods (even distribution and access-count based) proving that DReAM is much more accurate than these other methods.Peer ReviewedPostprint (author's final draft

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12{\deg}C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking

Reliable and Energy Efficient MLC STT-RAM Buffer for CNN Accelerators

We propose a lightweight scheme where the formation of a data block is changed in such a way that it can tolerate soft errors significantly better than the baseline. The key insight behind our work is that CNN weights are normalized between -1 and 1 after each convolutional layer, and this leaves one bit unused in half-precision floating-point representation. By taking advantage of the unused bit, we create a backup for the most significant bit to protect it against the soft errors. Also, considering the fact that in MLC STT-RAMs the cost of memory operations (read and write), and reliability of a cell are content-dependent (some patterns take larger current and longer time, while they are more susceptible to soft error), we rearrange the data block to minimize the number of costly bit patterns. Combining these two techniques provides the same level of accuracy compared to an error-free baseline while improving the read and write energy by 9% and 6%, respectively

Microarchitectural wire management for performance and power in partitioned architectures

Journal ArticleFuture high-performance billion-transistor processors are likely to employ partitioned architectures to achieve high clock speeds, high parallelism, low design complexity, and low power. In such architectures, inter-partition communication over global wires has a significant impact on overall processor performance and power consumption. VLSI techniques allow a variety of wire implementations, but these wire properties have previously never been exposed to the microarchitecture. This paper advocates global wire management at the microarchitecture level and proposes a heterogeneous interconnect that is comprised of wires with varying latency, bandwidth, and energy characteristics. We propose and evaluate microarchitectural techniques that can exploit such a heterogeneous interconnect to improve performance and reduce energy consumption. These techniques include a novel cache pipeline design, the identification of narrow bit-width operands, the classification of non-critical data, and the detection of interconnect load imbalance. For a dynamically scheduled partitioned architecture, our results demonstrate that the proposed innovations result in up to 11% reductions in overall processor ED2, compared to a baseline processor that employs a homogeneous interconnect