Characterization of 28 nm FDSOI MOS and application to the design of a low-power 2.4 GHz LNA

IoT is expected to connect billions of devices all over world in the next years, and in a near future, it is expected to use LR-WPAN in a wide variety of applications. Not all the devices will require of high performance but will require of low power hungry systems since most of them will be powered with a battery. Conventional CMOS technologies cannot cover these needs even scaling it to very small regimes, which appear other problems. Hence, new technologies are emerging to cover the needs of this devices. One promising technology is the UTBB FDSOI, which achieves good performance with very good energy efficiency. This project characterizes this technology to obtain a set of parameters of interest for analog/RF design. Finally, with the help of a low-power design methodology (gm/Id approach), a design of an ULP ULV LNA is performed to check the suitability of this technology for IoT

Sub-pJ per operation scalable computing: The PULP experience

none1noUltra-low power operation and extreme energy efficiency are strong requirements for a number of high-growth Internet of-Things (IoT) applications requiring near-sensor processing. A promising approach to achieve major energy efficiency improvements is near-threshold computing. However, frequency degradation due to aggressive voltage scaling may not be acceptable for performance-constrained applications. The PULP platform leverages multi-core parallelism with explicitly-managed shared L1 memory to overcome performance degradation at low voltage, while maintaining the flexibility and programmability typical of instruction processors. PULP supports OpenMP, OpenCL, and OpenVX parallel programming with hardware support for energy efficient synchronization. Multiple silicon implementations of PULP have been taped out and achieve hundreds of GOPS/W on video, audio, inertial sensor data processing and classification, within power envelopes of a few milliwatts. PULP hardware and software are open-source, with the goal of supporting and boosting an innovation ecosystem focusing on ULP computing for the IoT.openRossi, DavideRossi, David

Circuit Design in Nanoscale FDSOI Technologies

Abstract -Planar fully-depleted SOI technology with ultrathin body and buried oxide presents a platform for an energyefficient design in deeply scaled technologies without major changes in the bulk-CMOS design infrastructure. Good control of short-channel effects with thin transistor body offers a possibility to reduce the supply voltage. Thin buried oxide provides threshold tuning via body bias. Overall design optimality is achieved through sensitivity-based optimization by selecting optimal supplies and thresholds

A Survey on Low-Power Techniques with Emerging Technologies: From Devices to Systems

Nowadays, power consumption is one of the main limitations of electronic systems. In this context, novel and emerging devices provide us with new opportunities to keep the trend to low-power design. In this survey paper, we present a transversal survey on energy efficient techniques ranging from devices to architectures. The actual trends of device research, with fully-depleted planar devices, tri-gate geometries and gate-all-around structures, allows us to reach an increasingly higher level of performance while reducing the associated power. In addition, beyond the simple device properties enhancements, emerging devices also lead to innovations at circuit and architectural levels. In particular, devices whose properties can be tuned through additional terminals enable a fine and dynamic control of device threshold. They also enable designers to realize logic gates and to implement power-related techniques in a compact way unreachable to standard technologies. These innovations reduce the power consumption at the gate level and unlock new means of actuation in architectural solutions like adaptive voltage and frequency scaling

A methodology for the design of dynamic accuracy operators by runtime back bias

Mobile and IoT applications must balance increasing processing demands with limited power and cost budgets. Approximate computing achieves this goal leveraging the error tolerance features common in many emerging applications to reduce power consumption. In particular, adequate (i.e., energy/quality-configurable) hardware operators are key components in an error tolerant system. Existing implementations of these operators require significant architectural modifications, hence they are often design-specific and tend to have large overheads compared to accurate units. In this paper, we propose a methodology to design adequate data-path operators in an automatic way, which uses threshold voltage scaling as a knob to dynamically control the power/accuracy tradeoff. The method overcomes the limitations of previous solutions based on supply voltage scaling, in that it introduces lower overheads and it allows fine-grain regulation of this tradeoff. We demonstrate our approach on a state-of-the-art 28nm FDSOI technology, exploiting the strong effect of back biasing on threshold voltage. Results show a power consumption reduction of as much as 39% compared to solutions based only on supply voltage scaling, at iso-accuracy

Design of variability compensation architectures of digital circuits with adaptive body bias

The most critical concern in circuit is to achieve high level of performance with very tight power constraint. As the high performance circuits moved beyond 45nm technology one of the major issues is the parameter variation i.e. deviation in process, temperature and voltage (PVT) values from nominal specifications. A key process parameter subject to variation is the transistor threshold voltage (Vth) which impacts two important parameters: frequency and leakage power. Although the degradation can be compensated by the worstcase scenario based over-design approach, it induces remarkable power and performance overhead which is undesirable in tightly constrained designs. Dynamic voltage scaling (DVS) is a more power efficient approach, however its coarse granularity implies difficulty in handling fine grained variations. These factors have contributed to the growing interest in power aware robust circuit design. We propose a variability compensation architecture with adaptive body bias, for low power applications using 28nm FDSOI technology. The basic approach is based on a dynamic prediction and prevention of possible circuit timing errors. In our proposal we are using a Canary logic technique that enables the typical-case design. The body bias generation is based on a DLL type method which uses an external reference generator and voltage controlled delay line (VCDL) to generate the forward body bias (FBB) control signals. The adaptive technique is used for dynamic detection and correction of path failures in digital designs due to PVT variations. Instead of tuning the supply voltage, the key idea of the design approach is to tune the body bias voltage bymonitoring the error rate during operation. The FBB increases operating speed with an overhead in leakage power

Study of Radiation Effects on 28nm UTBB FDSOI Technology

With the evolution of modern Complementary Metal-Oxide-Semiconductor (CMOS) technology, transistor feature size has been scaled down to nanometers. The scaling has resulted in tremendous advantages to the integrated circuits (ICs), such as higher speed, smaller circuit size, and lower operating voltage. However, it also creates some reliability concerns. In particular, small device dimensions and low operating voltages have caused nanoscale ICs to become highly sensitive to operational disturbances, such as signal coupling, supply and substrate noise, and single event effects (SEEs) caused by ionizing particles, like cosmic neutrons and alpha particles. SEEs found in ICs can introduce transient pulses in circuit nodes or data upsets in storage cells. In well-designed ICs, SEEs appear to be the most troublesome in a space environment or at high altitudes in terrestrial environment. Techniques from the manufacturing process level up to the system design level have been developed to mitigate radiation effects. Among them, silicon-on-insulator (SOI) technologies have proven to be an effective approach to reduce single-event effects in ICs. So far, 28nm ultra-thin body and buried oxide (UTBB) Fully Depleted SOI (FDSOI) by STMicroelectronics is one of the most advanced SOI technologies in commercial applications. Its resilience to radiation effects has not been fully explored and it is of prevalent interest in the radiation effects community. Therefore, two test chips, namely ST1 and AR0, were designed and tested to study SEEs in logic circuits fabricated with this technology. The ST1 test chip was designed to evaluate SET pulse widths in logic gates. Three kinds of the on-chip pulse-width measurement detectors, namely the Vernier detector, the Pulse Capture detector and the Pulse Filter detector, were implemented in the ST1 chip. Moreover, a Circuit for Radiation Effects Self-Test (CREST) chain with combinational logic was designed to study both SET and SEU effects. The ST1 chip was tested using a heavy ion irradiation beam source in Radiation Effects Facility (RADEF), Finland. The experiment results showed that the cross-section of the 28nm UTBB-FDSOI technology is two orders lower than its bulk competitors. Laser tests were also applied to this chip to research the pulse distortion effects and the relationship between SET, SEU and the clock frequency. Total Ionizing Dose experiments were carried out at the University of Saskatchewan and European Space Agency with Co-60 gammacell radiation sources. The test results showed the devices implemented in the 28nm UTBB-FDSOI technology can maintain its functionality up to 1 Mrad(Si). In the AR0 chip, we designed five ARM Cortex-M0 cores with different logic protection levels to investigate the performance of approximate logic protecting methods. There are three custom-designed SRAM blocks in the test chip, which can also be used to measure the SEU rate. From the simulation result, we concluded that the approximate logic methodology can protect the digital logic efficiently. This research comprehensively evaluates the radiation effects in the 28nm UTBB-FDSOI technology, which provides the baseline for later radiation-hardened system designs in this technology

FDSOI Design using Automated Standard-Cell-Grained Body Biasing

With the introduction of FDSOI processes at competitive technology nodes, body biasing on an unprecedented scale was made possible. Body biasing influences one of the central transistor characteristics, the threshold voltage. By being able to heighten or lower threshold voltage by more than 100mV, the very physics of transistor switching can be manipulated at run time. Furthermore, as body biasing does not lead to different signal levels, it can be applied much more fine-grained than, e.g., DVFS. With the state of the art mainly focused on combinations of body biasing with DVFS, it has thus ignored granularities unfeasible for DVFS. This thesis fills this gap by proposing body bias domain partitioning techniques and for body bias domain partitionings thereby generated, algorithms that search for body bias assignments. Several different granularities ranging from entire cores to small groups of standard cells were examined using two principal approaches: Designer aided pre-partitioning based determination of body bias domains and a first-time, fully automatized, netlist based approach called domain candidate exploration. Both approaches operate along the lines of activation and timing of standard cell groups. These approaches were evaluated using the example of a Dynamically Reconfigurable Processor (DRP), a highly efficient category of reconfigurable architectures which consists of an array of processing elements and thus offers many opportunities for generalization towards many-core architectures. Finally, the proposed methods were validated by manufacturing a test-chip. Extensive simulation runs as well as the test-chip evaluation showed the validity of the proposed methods and indicated substantial improvements in energy efficiency compared to the state of the art. These improvements were accomplished by the fine-grained partitioning of the DRP design. This method allowed reducing dynamic power through supply voltage levels yielding higher clock frequencies using forward body biasing, while simultaneously reducing static power consumption in unused parts.Die Einführung von FDSOI Prozessen in gegenwärtigen Prozessgrößen ermöglichte die Nutzung von Substratvorspannung in nie zuvor dagewesenem Umfang. Substratvorspannung beeinflusst unter anderem eine zentrale Eigenschaft von Transistoren, die Schwellspannung. Mittels Substratvorspannung kann diese um mehr als 100mV erhöht oder gesenkt werden, was es ermöglicht, die schiere Physik des Schaltvorgangs zu manipulieren. Da weiterhin hiervon der Signalpegel der digitalen Signale unberührt bleibt, kann diese Technik auch in feineren Granularitäten angewendet werden, als z.B. Dynamische Spannungs- und Frequenz Anpassung (Engl. Dynamic Voltage and Frequency Scaling, Abk. DVFS). Da jedoch der Stand der Technik Substratvorspannung hauptsächlich in Kombinationen mit DVFS anwendet, werden feinere Granularitäten, welche für DVFS nicht mehr wirtschaftlich realisierbar sind, nicht berücksichtigt. Die vorliegende Arbeit schließt diese Lücke, indem sie Partitionierungsalgorithmen zur Unterteilung eines Entwurfs in Substratvorspannungsdomänen vorschlägt und für diese hierdurch unterteilten Domänen entsprechende Substratvorspannungen berechnet. Hierzu wurden verschiedene Granularitäten berücksichtigt, von ganzen Prozessorkernen bis hin zu kleinen Gruppen von Standardzellen. Diese Entwürfe wurden dann mit zwei verschiedenen Herangehensweisen unterteilt: Chipdesigner unterstützte, vorpartitionierungsbasierte Bestimmung von Substratvorspannungsdomänen, sowie ein erstmals vollautomatisierter, Netzlisten basierter Ansatz, in dieser Arbeit Domänen Kandidaten Exploration genannt. Beide Ansätze funktionieren nach dem Prinzip der Aktivierung, d.h. zu welchem Zeitpunkt welcher Teil des Entwurfs aktiv ist, sowie der Signallaufzeit durch die entsprechenden Entwurfsteile. Diese Ansätze wurden anhand des Beispiels Dynamisch Rekonfigurierbarer Prozessoren (DRP) evaluiert. DRPs stellen eine Klasse hocheffizienter rekonfigurierbarer Architekturen dar, welche hauptsächlich aus einem Feld von Rechenelementen besteht und dadurch auch zahlreiche Möglichkeiten zur Verallgemeinerung hinsichtlich Many-Core Architekturen zulässt. Schließlich wurden die vorgeschlagenen Methoden in einem Testchip validiert. Alle ermittelten Ergebnisse zeigen im Vergleich zum Stand der Technik drastische Verbesserungen der Energieeffizienz, welche durch die feingranulare Unterteilung in Substratvorspannungsdomänen erzielt wurde. Hierdurch konnten durch die Anwendung von Substratvorspannung höhere Taktfrequenzen bei gleicher Versorgungsspannung erzielt werden, während zeitgleich in zeitlich unkritischen oder ungenutzten Entwurfsteilen die statische Leistungsaufnahme minimiert wurde

Low energy digital circuits in advanced nanometer technologies

The demand for portable devices and the continuing trend towards the Internet ofThings (IoT) have made of energy consumption one of the main concerns in the industry and researchers. The most efficient way of reducing the energy consump-tion of digital circuits is decreasing the supply voltage (Vdd) since the dynamicenergy quadratically depends onVdd. Several works have shown that an optimumsupply voltage exists that minimizes the energy consumption of digital circuits. This optimum supply voltage is usually around 200 mV and 400 mV dependingon the circuit and technology used. To obtain these low supply voltages, on-chipdc-dc converters with high efficiency are needed.This thesis focuses on the study of subthreshold digital systems in advancednanometer technologies. These systems usually can be divided into a Power Man-agement Unit (PMU) and a digital circuit operating at the subthreshold regime.In particular, while considering the PMU, one of the key circuits is the dc-dcconverter. This block converts the voltage from the power source (battery, supercapacitor or wireless power transfer link) to a voltage between 200 mV and 400mV in order to power the digital circuit. In this thesis, we developed two chargerecycling techniques in order to improve the efficiency of switched capacitors dc-dcconverters. The first one is based on a technique used in adiabatic circuits calledstepwise charging. This technique was used in circuits and applications wherethe switching consumption of a big capacitance is very important. We analyzedthe possibility of using this technique in switched capacitor dc-dc converters withintegrated capacitors. We showed through measurements that a 29% reductionin the gate drive losses can be obtained with this technique. The second one isa simplification of stepwise charging which can be applied in some architecturesof switched capacitors dc-dc converters. We also fabricated and tested a dc-dcconverter with this technique and obtained a 25% energy reduction in the drivingof the switches that implement the converter.Furthermore, we studied the digital circuit working in the subthreshold regime,in particular, operating at the minimum energy point. We studied different modelsfor circuits working in these conditions and improved them by considering thedifferences between the NMOS and PMOS transistors. We obtained an optimumNMOS/PMOS leakage current imbalance that minimizes the total leakage energy per operation. This optimum depends on the architecture of the digital circuitand the input data. However, we also showed that important energy reductionscan be obtained by operating at a mean optimum imbalance. We proposed two techniques to achieve the optimum imbalance. We used aFully Depleted Silicon on Insulator (FD-SOI) 28 nm technology for most of the simulations, but we also show that these techniques can be applied in traditionalbulk CMOS technologies. The first one consists in using the back plane voltage of the transistors (or bulk voltage in traditional CMOS) to adjust independently theleakage current of the NMOS and PMOS transistor to work under the optimum NMOS/PMOS leakage current imbalance. We called this approach the OptimumBack Plane Biasing (OBB). A second technique consists of using the length of the transistors to adjust this leakage current imbalance. In the subthreshold regimeand in advanced nanometer technologies a moderate increase in the length has little impact in the output capacitance of the gates and thus in the dynamic energy.We called this approach an Asymmetric Length Biasing (ALB). Finally, we use these techniques in some basic circuits such as adders. We show that around 50% energy reduction can be obtained, in a wide range of frequency while working near the minimum energy point and using these techniques. The main contributions of this thesis are: • Analysis of the stepwise charging technique in small capacitances. •Implementation of stepwise charging technique as a charge recycling tech-nique for efficiency improvement in switched capacitor dc-dc converters. • Development of a charge sharing technique for efficiency improvement inswitched capacitor dc-dc converters. • Analysis of minimum operating voltage of digital circuits due to intrinsicnoise and the impact of technology scaling in this minimum. • Improvement in the modeling of the minimum energy point while considering NMOS and PMOS transistors difference. • Demonstration of the existence of an optimum leakage current imbalance be-tween the NMOS and PMOS transistors that minimizes energy consumptionin the subthreshold regiion. • Development of a back plane (bulk) voltage strategy for working in this optimum.• Development of a sizing strategy for working in the aforementioned optimum. • Analysis of the impact of architecture and input data on the optimum im-balance. The thesis is based on the publications [1–8]. During the Ph.D. program, other publications were generated [9–16] that are partially related with the thesis butwere not included in it.La constante demanda de dispositivos portables y los avances hacia la Internet de las Cosas han hecho del consumo de energía uno de los mayores desafíos y preocupación en la industria y la academia. La forma más eficiente de reducir el consumo de energía de los circuitos digitales es reduciendo su voltaje de alimentación ya que la energía dinámica depende de manera cuadrática con dicho voltaje. Varios trabajos demostraron que existe un voltaje de alimentación óptimo, que minimiza la energía consumida para realizar cierta operación en un circuito digital, llamado punto de mínima energía. Este óptimo voltaje se encuentra usualmente entre 200 mV y 400 mV dependiendo del circuito y de la tecnología utilizada. Para obtener estos voltajes de alimentación de la fuente de energía, se necesitan conversores dc-dc integrados con alta eficiencia. Esta tesis se concentra en el estudio de sistemas digitales trabajando en la región sub umbral diseñados en tecnologías nanométricas avanzadas (28 nm). Estos sistemas se pueden dividir usualmente en dos bloques, uno llamado bloque de manejo de potencia, y el segundo, el circuito digital operando en la region sub umbral. En particular, en lo que corresponde al bloque de manejo de potencia, el circuito más crítico es en general el conversor dc-dc. Este circuito convierte el voltaje de una batería (o super capacitor o enlace de transferencia inalámbrica de energía o unidad de cosechado de energía) en un voltaje entre 200 mV y 400 mV para alimentar el circuito digital en su voltaje óptimo. En esta tesis desarrollamos dos técnicas que, mediante el reciclado de carga, mejoran la eficiencia de los conversores dc-dc a capacitores conmutados. La primera es basada en una técnica utilizada en circuitos adiabáticos que se llama carga gradual o a pasos. Esta técnica se ha utilizado en circuitos y aplicaciones en donde el consumo por la carga y descarga de una capacidad grande es dominante. Nosotros analizamos la posibilidad de utilizar esta técnica en conversores dc-dc a capacitores conmutados con capacitores integrados. Se demostró a través de medidas que se puede reducir en un 29% el consumo debido al encendido y apagado de las llaves que implementan el conversor dc-dc. La segunda técnica, es una simplificación de la primera, la cual puede ser aplicada en ciertas arquitecturas de conversores dc-dc a capacitores conmutados. También se fabricó y midió un conversor con esta técnica y se obtuvo una reducción del 25% en la energía consumida por el manejo de las llaves del conversor. Por otro lado, estudiamos los circuitos digitales operando en la región sub umbral y en particular cerca del punto de mínima energía. Estudiamos diferentes modelos para circuitos operando en estas condiciones y los mejoramos considerando las diferencias entre los transistores NMOS y PMOS. Mediante este modelo demostramos que existe un óptimo en la relación entre las corrientes de fuga de ambos transistores que minimiza la energía de fuga consumida por operación. Este óptimo depende de la arquitectura del circuito digital y ademas de los datos de entrada del circuito. Sin embargo, demostramos que se puede reducir el consumo de manera considerable al operar en un óptimo promedio. Propusimos dos técnicas para alcanzar la relación óptima. Utilizamos una tecnología FD-SOI de 28nm para la mayoría de las simulaciones, pero también mostramos que estas técnicas pueden ser utilizadas en tecnologías bulk convencionales. La primer técnica, consiste en utilizar el voltaje de la puerta trasera (o sustrato en CMOS convencional) para ajustar de manera independiente las corrientes del NMOS y PMOS para que el circuito trabaje en el óptimo de la relación de corrientes. Esta técnica la llamamos polarización de voltaje de puerta trasera óptimo. La segunda técnica, consiste en utilizar los largos de los transistores para ajustar las corrientes de fugas de cada transistor y obtener la relación óptima. Trabajando en la región sub umbral y en tecnologías avanzadas, incrementar moderadamente el largo del transistor tiene poco impacto en la energía dinámica y es por eso que se puede utilizar. Finalmente, utilizamos estas técnicas en circuitos básicos como sumadores y mostramos que se puede obtener una reducción de la energía consumida de aproximadamente 50%, en un amplio rango de frecuencias, mientras estos circuitos trabajan cerca del punto de energía mínima. Las principales contribuciones de la tesis son: • Análisis de la técnica de carga gradual o a pasos en capacidades pequeñas. • Implementación de la técnica de carga gradual para la mejora de eficiencia de conversores dc-dc a capacitores conmutados. • Simplificación de la técnica de carga gradual para mejora de la eficiencia en algunas arquitecturas de conversores dc-dc de capacitores conmutados. • Análisis del mínimo voltaje de operación en circuitos digitales debido al ruido intrínseco del dispositivo y el impacto del escalado de las tecnologías en el mismo. • Mejoras en el modelado del punto de energía mínima de operación de un circuito digital en el cual se consideran las diferencias entre el transistor PMOS y NMOS. • Demostración de la existencia de un óptimo en la relación entre las corrientes de fuga entre el NMOS y PMOS que minimiza la energía de fugas consumida en la región sub umbral. • Desarrollo de una estrategia de polarización del voltaje de puerta trasera para que el circuito digital trabaje en el óptimo antes mencionado. • Desarrollo de una estrategia para el dimensionado de los transistores que componen las compuertas digitales que permite al circuito digital operar en el óptimo antes mencionado. • Análisis del impacto de la arquitectura del circuito y de los datos de entrada del mismo en el óptimo antes mencionado

Conception, fabrication, caractérisation et modélisation de transistors MOSFET haute tension en technologie avancée SOI (Silicon-On-Insulator)

Nowadays the scaling of bulk silicon CMOS technologies is reaching physical limits. In this context, the FDSOI technology (fully depleted silicon-on-insulator) becomes an alternative for the industry because of its superior performances. The use of an ultra-thin SOI substrate provides an improvement of the MOSFETs behaviour and guarantees their electrostatic integrity for devices of 28nm and below. The development of high-voltage applications such DC/DC converters, voltage regulators and power amplifiers become necessary to integrate new functionalities in the technology. However, the standard devices are not designed to handle such high voltages. To overcome this limitation, this work is focused on the design of a high voltage MOSFET in FDSOI. Through simulations and electrical characterizations, we are exploring several solutions such as the hybridization of the SOI substrate (local opening of the buried oxide) or the implementation in the silicon film. An innovative architecture on SOI, the Dual Ground Plane EDMOS, is proposed, characterized and modelled. It relies on the biasing of a dedicated ground plane introduced below the device to offer promising RON.S/BV trade-off for the targeted applications.A l’heure où la miniaturisation des technologies CMOS sur substrat massif atteint des limites, la technologie FDSOI (silicium sur isolant totalement déserté) s’impose comme une alternative pour l’industrie en raison de ses meilleures performances. Dans cette technologie, l’utilisation d’un substrat SOI ultramince améliore le comportement des transistors MOSFETs et garantit leur intégrité électrostatique pour des dimensions en deçà de 28nm. Afin de lui intégrer de nouvelles fonctionnalités, il devient nécessaire de développer des applications dites « haute tension » comme les convertisseurs DC/DC, les régulateurs de tension ou encore les amplificateurs de puissance. Cependant les composants standards de la technologie CMOS ne sont pas capables de fonctionner sous les hautes tensions requises. Pour répondre à cette limitation, ces travaux portent sur le développement et l’étude de transistors MOS haute tension en technologie FDSOI. Plusieurs solutions sont étudiées à l’aide de simulations numériques et de caractérisations électriques : l’hybridation du substrat (gravure localisée de l’oxyde enterré) et la transposition sur le film mince. Une architecture innovante sur SOI, le Dual Gound Plane EDMOS, est alors proposée, caractérisée et modélisée. Cette architecture repose sur la polarisation d’une seconde grille arrière pour offrir un compromis RON.S/BV prometteur pour les applications visées