A novel reseeding mechanism for pseudo-random testing of VLSI circuits

[[abstract]]During built-in self-test (BIST), the set of patterns generated by a pseudo-random pattern generator may not provide sufficiently high fault coverage and many patterns were undetected fault (useless patterns). In order to reduce the test time, we can remove useless patterns or change them to useful patterns (fault dropping). In this paper, we reseed, modify the pseudo-random, and use an additional bit counter to improve test length and achieve high fault coverage. The fact is that a random test set contains useless patterns, so we present a technique, including both reseeding and bit modifying to remove useless patterns or change them to useful patterns, and when the patterns change, we pick out the numbers with less bits, leading to very short test length. The technique we present is applicable for single-stuck-at faults. The seeds we use are deterministic so 100% fault coverage can be achieve.[[conferencetype]]國際[[conferencedate]]20050523~20050526[[booktype]]紙本[[conferencelocation]]Kobe, Japa

A Novel Reseeding Mechanism for Improving Pseudo-Random Testing of VLSI Circuits

[[abstract]]During built-in self-test (BIST), the set of patterns generated by a pseudo-random pattern generator may not provide sufficiently high fault coverage and many patterns can't detect fault (called useless patterns). In order to reduce the test time, we can remove useless patterns or change them to useful patterns (fault dropping). In fact, a random test set includes many useless patterns. Therefore we present a technology, including both reseeding and bit modifying (a.k.a. pattern mapping) to remove useless patterns or change them to useful patterns. When patterns changed, we pick out number of different fewer bits, leading to very short test length. Then we use an additional bit counter to improve test length and achieve high fault coverage. The technique we present is applicable for single-stuck-at faults. Experimental results indicate that complete fault coverage-100% can be obtained with less test time.[[notice]]補正完畢[[journaltype]]國際[[incitationindex]]EI[[ispeerreviewed]]Y[[booktype]]紙本[[countrycodes]]TW

Genetic algorithm as self-test path and circular self-test path design method

The paper presents the use of Genetic Algorithm to search for non-linear Autonomous Test Structures (ATS) in Built-In Testing approach. Such structures can include essentially STP and CSTP and their modifications. Non-linear structures are more difficult to analyze than the widely used structures such as independent Test Pattern Generator and the Test Response Compactor realized by Linear Feedback Shift Registers. To reduce time-consuming test simulation of sequential circuit, it was used an approach based on the stochastic model of pseudo-random testing. The use of stochastic model significantly affects the time effectiveness of the search for evolutionary autonomous structures. In test simulation procedure, the block of sequential circuit memory is not disconnected. This approach does not require a special selection of memory registers such as BILBOs. A series of studies to test circuits set ISCAS’89 are made. The results of the study are very promising

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification

NASA Tech Briefs Index, 1976

Abstracts of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electronic systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences

REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains

NASA Tech Briefs, Fall 1976

Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of seloc.ted Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences