Development of generic testing strategies for mixed-signal integrated circuits

Describes work at the Polytechnic of Huddersfield SERC/DTI research project IED 2/1/2121 conducted in collaboration with GEC-Plessey Semiconductors, Wolfson Microelectronics, and UMIST. The aim of the work is to develop generic testing strategies for mixed-signal (mixed analogue and digital) integrated circuits. The paper proposes a test structure for mixed-signal ICs, and details the development of a test technique and fault model for the analogue circuit cells encountered in these devices. Results obtained during the evaluation of this technique in simulation are presented, and the ECAD facilities that have contributed to this and other such projects are described

A design for testability study on a high performance automatic gain control circuit.

A comprehensive testability study on a commercial automatic gain control circuit is presented which aims to identify design for testability (DfT) modifications to both reduce production test cost and improve test quality. A fault simulation strategy based on layout extracted faults has been used to support the study. The paper proposes a number of DfT modifications at the layout, schematic and system levels together with testability. Guidelines that may well have generic applicability. Proposals for using the modifications to achieve partial self test are made and estimates of achieved fault coverage and quality levels presente

Testing of mixed-signal systems using dynamic stimuli

The impulse response of a linear circuit element contains enough information to functionally characterise that element. A technique for comparison of observed and expected (reference) transient responses, which results in an absolute measure of device functionality, is presented. Comparisons of transient response test results with the results from existing test programs are also presented

Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Cancellation of crosstalk-induced jitter

A novel jitter equalization circuit is presented that addresses crosstalk-induced jitter in high-speed serial links. A simple model of electromagnetic coupling demonstrates the generation of crosstalk-induced jitter. The analysis highlights unique aspects of crosstalk-induced jitter that differ from far-end crosstalk. The model is used to predict the crosstalk-induced jitter in 2-PAM and 4-PAM, which is compared to measurement. Furthermore, the model suggests an equalizer that compensates for the data-induced electromagnetic coupling between adjacent links and is suitable for pre- or post-emphasis schemes. The circuits are implemented using 130-nm MOSFETs and operate at 5-10 Gb/s. The results demonstrate reduced deterministic jitter and lower bit-error rate (BER). At 10 Gb/s, the crosstalk-induced jitter equalizer opens the eye at 10^sup-12 BER from 17 to 45 ps and lowers the rms jitter from 8.7 to 6.3 ps

Aircraft electromagnetic compatibility

Illustrated are aircraft architecture, electromagnetic interference environments, electromagnetic compatibility protection techniques, program specifications, tasks, and verification and validation procedures. The environment of 400 Hz power, electrical transients, and radio frequency fields are portrayed and related to thresholds of avionics electronics. Five layers of protection for avionics are defined. Recognition is given to some present day electromagnetic compatibility weaknesses and issues which serve to reemphasize the importance of EMC verification of equipment and parts, and their ultimate EMC validation on the aircraft. Proven standards of grounding, bonding, shielding, wiring, and packaging are laid out to help provide a foundation for a comprehensive approach to successful future aircraft design and an understanding of cost effective EMC in an aircraft setting

Single-Event Upset Analysis and Protection in High Speed Circuits

The effect of single-event transients (SETs) (at a combinational node of a design) on the system reliability is becoming a big concern for ICs manufactured using advanced technologies. An SET at a node of combinational part may cause a transient pulse at the input of a flip-flop and consequently is latched in the flip-flop and generates a soft-error. When an SET conjoined with a transition at a node along a critical path of the combinational part of a design, a transient delay fault may occur at the input of a flip-flop. On the other hand, increasing pipeline depth and using low power techniques such as multi-level power supply, and multi-threshold transistor convert almost all paths in a circuit to critical ones. Thus, studying the behavior of the SET in these kinds of circuits needs special attention. This paper studies the dynamic behavior of a circuit with massive critical paths in the presence of an SET. We also propose a novel flip-flop architecture to mitigate the effects of such SETs in combinational circuits. Furthermore, the proposed architecture can tolerant a single event upset (SEU) caused by particle strike on the internal nodes of a flip-flo