On-Line Dependability Enhancement of Multiprocessor SoCs by Resource Management

This paper describes a new approach towards dependable design of homogeneous multi-processor SoCs in an example satellite-navigation application. First, the NoC dependability is functionally verified via embedded software. Then the Xentium processor tiles are periodically verified via on-line self-testing techniques, by using a new IIP Dependability Manager. Based on the Dependability Manager results, faulty tiles are electronically excluded and replaced by fault-free spare tiles via on-line resource management. This integrated approach enables fast electronic fault detection/diagnosis and repair, and hence a high system availability. The dependability application runs in parallel with the actual application, resulting in a very dependable system. All parts have been verified by simulation

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Design and application of reconfigurable circuits and systems

Open Acces

Cross-layer fault tolerance in networks-on-chip

The design of Networks-on-Chip follows the Open Systems Interconnection (OSI) reference model. The OSI model defines strictly separated network abstraction layers and specifies their functionality. Each layer has layer-specific information about the network that can be exclusively accessed by the methods of the layer. Adhering to the strict layer boundaries, however, leads to methods of the individual layers working in isolation from each other. This lack of interaction between methods is disadvantageous for fault diagnosis and fault tolerance in Networks-on-Chip as it results in solutions that have a high effort in terms of the time and implementation costs required to deal with faults. For Networks-on-Chip cross-layer design is considered as a promising method to remedy these shortcomings. It removes the strict layer boundaries by the exchange of information between layers. This interaction enables methods of different layers to cooperate, and thus, deal with faults more efficiently. Furthermore, providing lower layer information to the software allows hardware methods to be implemented as software tasks resulting in a reduction of the hardware complexity. The goal of this dissertation is the investigation of cross-layer design for fault diagnosis and fault tolerance in Networks-on-Chip. For fault diagnosis a scheme is proposed that allows the interaction of protocol-based diagnosis of the transport layer with functional diagnosis of the network layer and structural diagnosis of the physical layer by exchanging diagnostic information. The techniques use this information for optimizing their own diagnosis process. For protocol-based diagnosis on the transport layer, a diagnosis protocol is proposed that is able to locate faulty links, switches, and crossbar connections. For this purpose, the technique utilizes available information of lower layers. As proof of concept for the proposed interaction scheme, the diagnosis protocol is combined with a functional and a structural diagnosis approach and the performance and diagnosis quality of the resulting combinations is investigated. The results show that the combinations of the diagnosis protocol with one of the lower layer techniques have a considerably reduced fault localization latency compared to the functional and the structural standalone techniques. This reduction, however, comes at the expense of a reduced diagnosis quality. In terms of fault tolerance, the focus of this dissertation is on the design and implementation of cross-layer approaches utilizing software methods to provide fault tolerance for network layer routings. Two approaches for different routings are presented. The requirements to provide information of lower layers to the software using the available Network-on-Chip resources and interfaces for data communication are discussed. The concepts of two mechanisms of the data link layer are presented for converting status information into communicable units and for preventing communication resources from being blocked. In the first approach, software-based packet rerouting is proposed. By incorporating information from different layers, this approach provides fault tolerance for deterministic network layer routings. As specialization of software-based rerouting, dimension-order XY rerouting is presented. In the second approach, a reconfigurable routing for Networks-on-Chip with logical hierarchy is proposed in which cross-layer interaction is used to enable hierarchical units to manage themselves autonomously and to reconfigure the routing. Both approaches are evaluated regarding their performance as well as their implementation costs. In a final study, the cross-layer diagnosis technique and cross-layer fault tolerance approaches are combined. The information obtained by the diagnosis technique is used by the fault tolerance approaches for packet rerouting or for routing reconfiguration. The combinations are evaluated regarding their impact on Networks-on-Chip performance. The results show that the crosslayer information exchange with software has a considerable impact on performance when the amount of information becomes too large. In case of crosslayer diagnosis, however, the impact on Networks-on-Chip performance is significantly lower compared to functional and structural diagnosis

Design of complex integrated systems based on networks-on-chip: Trading off performance, power and reliability

The steady advancement of microelectronics is associated with an escalating number of challenges for design engineers due to both the tiny dimensions and the enormous complexity of integrated systems. Against this background, this work deals with Network-On-Chip (NOC) as the emerging design paradigm to cope with diverse issues of nanotechnology. The detailed investigations within the chapters focus on the communication-centric aspects of multi-core-systems, whereas performance, power consumption as well as reliability are considered likewise as the essential design criteria

Software-based and regionally-oriented traffic management in Networks-on-Chip

Since the introduction of chip-multiprocessor systems, the number of integrated cores has been steady growing and workload applications have been adapted to exploit the increasing parallelism. This changed the importance of efficient on-chip communication significantly and the infrastructure has to keep step with these new requirements. The work at hand makes significant contributions to the state-of-the-art of the latest generation of such solutions, called Networks-on-Chip, to improve the performance, reliability, and flexible management of these on-chip infrastructures

Analyse und Erweiterung eines fehler-toleranten NoC für SRAM-basierte FPGAs in Weltraumapplikationen

Data Processing Units for scientific space mission need to process ever higher volumes of data and perform ever complex calculations. But the performance of available space-qualified general purpose processors is just in the lower three digit megahertz range, which is already insufficient for some applications. As an alternative, suitable processing steps can be implemented in hardware on a space-qualified SRAM-based FPGA. However, suitable devices are susceptible against space radiation. At the Institute for Communication and Network Engineering a fault-tolerant, network-based communication architecture was developed, which enables the construction of processing chains on the basis of different processing modules within suitable SRAM-based FPGAs and allows the exchange of single processing modules during runtime, too. The communication architecture and its protocol shall isolate non SEU mitigated or just partial SEU mitigated modules affected by radiation-induced faults to prohibit the propagation of errors within the remaining System-on-Chip. In the context of an ESA study, this communication architecture was extended with further components and implemented in a representative hardware platform. Based on the acquired experiences during the study, this work analyses the actual fault-tolerance characteristics as well as weak points of this initial implementation. At appropriate locations, the communication architecture was extended with mechanisms for fault-detection and fault-differentiation as well as with a hardware-based monitoring solution. Both, the former measures and the extension of the employed hardware-platform with selective fault-injection capabilities for the emulation of radiation-induced faults within critical areas of a non SEU mitigated processing module, are used to evaluate the effects of radiation-induced faults within the communication architecture. By means of the gathered results, further measures to increase fast detection and isolation of faulty nodes are developed, selectively implemented and verified. In particular, the ability of the communication architecture to isolate network nodes without SEU mitigation could be significantly improved.Instrumentenrechner für wissenschaftliche Weltraummissionen müssen ein immer höheres Datenvolumen verarbeiten und immer komplexere Berechnungen ausführen. Die Performanz von verfügbaren qualifizierten Universalprozessoren liegt aber lediglich im unteren dreistelligen Megahertz-Bereich, was für einige Anwendungen bereits nicht mehr ausreicht. Als Alternative bietet sich die Implementierung von entsprechend geeigneten Datenverarbeitungsschritten in Hardware auf einem qualifizierten SRAM-basierten FPGA an. Geeignete Bausteine sind jedoch empfindlich gegenüber der Strahlungsumgebung im Weltraum. Am Institut für Datentechnik und Kommunikationsnetze wurde eine fehlertolerante netzwerk-basierte Kommunikationsarchitektur entwickelt, die innerhalb eines geeigneten SRAM-basierten FPGAs Datenverarbeitungsmodule miteinander nach Bedarf zu Verarbeitungsketten verbindet, sowie den Austausch von einzelnen Modulen im Betrieb ermöglicht. Nicht oder nur partiell SEU mitigierte Module sollen bei strahlungsbedingten Fehlern im Modul durch das Protokoll und die Fehlererkennungsmechanismen der Kommunikationsarchitektur isoliert werden, um ein Ausbreiten des Fehlers im restlichen System-on-Chip zu verhindern. Im Kontext einer ESA Studie wurde diese Kommunikationsarchitektur um Komponenten erweitert und auf einer repräsentativen Hardwareplattform umgesetzt. Basierend auf den gesammelten Erfahrungen aus der Studie, wird in dieser Arbeit eine Analyse der tatsächlichen Fehlertoleranz-Eigenschaften sowie der Schwachstellen dieser ursprünglichen Implementierung durchgeführt. Die Kommunikationsarchitektur wurde an geeigneten Stellen um Fehlerdetektierungs- und Fehlerunterscheidungsmöglichkeiten erweitert, sowie um eine hardwarebasierte Überwachung ergänzt. Sowohl diese Maßnahmen, als auch die Erweiterung der Hardwareplattform um gezielte Fehlerinjektions-Möglichkeiten zum Emulieren von strahlungsinduzierten Fehlern in kritischen Komponenten eines nicht SEU mitigierten Prozessierungsmoduls werden genutzt, um die tatsächlichen auftretenden Effekte in der Kommunikationsarchitektur zu evaluieren. Anhand der Ergebnisse werden weitere Verbesserungsmaßnahmen speziell zur schnellen Detektierung und Isolation von fehlerhaften Knoten erarbeitet, selektiv implementiert und verifiziert. Insbesondere die Fähigkeit, fehlerhafte, nicht SEU mitigierte Netzwerkknoten innerhalb der Kommunikationsarchitektur zu isolieren, konnte dabei deutlich verbessert werden

A Holistic Approach to Functional Safety for Networked Cyber-Physical Systems

Functional safety is a significant concern in today's networked cyber-physical systems such as connected machines, autonomous vehicles, and intelligent environments. Simulation is a well-known methodology for the assessment of functional safety. Simulation models of networked cyber-physical systems are very heterogeneous relying on digital hardware, analog hardware, and network domains. Current functional safety assessment is mainly focused on digital hardware failures while minor attention is devoted to analog hardware and not at all to the interconnecting network. In this work we believe that in networked cyber-physical systems, the dependability must be verified not only for the nodes in isolation but also by taking into account their interaction through the communication channel. For this reason, this work proposes a holistic methodology for simulation-based safety assessment in which safety mechanisms are tested in a simulation environment reproducing the high-level behavior of digital hardware, analog hardware, and network communication. The methodology relies on three main automatic processes: 1) abstraction of analog models to transform them into system-level descriptions, 2) synthesis of network infrastructures to combine multiple cyber-physical systems, and 3) multi-domain fault injection in digital, analog, and network. Ultimately, the flow produces a homogeneous optimized description written in C++ for fast and reliable simulation which can have many applications. The focus of this thesis is performing extensive fault simulation and evaluating different functional safety metrics, \eg, fault and diagnostic coverage of all the safety mechanisms

Analysis and optimization of a debug post-silicon hardware architecture

The goal of this thesis is to analyze the post-silicon validation hardware infrastructure implemented on multicore systems taking as an example Esperanto Technologies SoC, which has thousands of RISC-V processors and targets specific software applications. Then, based on the conclusions of the analysis, the project proposes a new post-silicon debug architecture that can fit on any System on-Chip without depending on its target application or complexity and that optimizes the options available on the market for multicore systems