Monolithic Integration Piezoelectric Resonators on CMOS for Radio-Frequency and Sensing Applications

Software cognitive radios and Internet of Things (IoT) are recent interest areas that need low loss and low power consumption hardware. More specifically, the area of software cognitive radios requires that hardware be frequency agile and highly selective. Meanwhile, IoT relies on multiple low power sensor networks. By combining Complementary Metal Oxide Semiconductors (CMOS) technology with piezoelectric Micro-Electro-Mechanical Systems (MEMS), we can fabricate Systems-on-Chip (SoC) that can be used as filters or references (oscillators) and highly selective sensors. In this work we developed a die-level compatible process for the monolithic integration of Bulk Acoustic Resonators (BAWs) on CMOS for low power, reduced area and high-quality passives for radio frequency applications. Using CMOS as a fabrication substrate some stringent requirements were added to maintain the dies and the technology’s integrity. A few of these limitations were the need for a low thermal budget fabrication process, die handling and electro-static discharge (ESD) protection. The devices were first fabricated on glass for modeling extraction that was later used for the design of the integrated circuits (IC). Three integrated circuits were designed as substrates for the integration using IBM’s 180nm and TSMC’s 65nm technology. A monolithic BAW oscillator with a resonance frequency of 1.8GHz was demonstrated with an FOM ~186dBc/Hz, comparable to other academia work. Using the developed process, a membrane BAW structure (FBAR) was integrated as well. Using a susceptor coating and zinc oxide’s (ZnO) high temperature coefficient of frequency (TCF) the device was studied as an alternative uncooled infrared sensor. Finally, a reprogrammable IC and an RF PCB were designed for volatile organic compound (VOC) testing using self-assembled monolayers (SAMs) as the absorber layer

Performance Comparison of Phase Change Materials and Metal-Insulator Transition Materials for Direct Current and Radio Frequency Switching Applications

Advanced understanding of the physics makes phase change materials (PCM) and metal-insulator transition (MIT) materials great candidates for direct current (DC) and radio frequency (RF) switching applications. In the literature, germanium telluride (GeTe), a PCM, and vanadium dioxide (VO2), an MIT material have been widely investigated for DC and RF switching applications due to their remarkable contrast in their OFF/ON state resistivity values. In this review, innovations in design, fabrication, and characterization associated with these PCM and MIT material-based RF switches, have been highlighted and critically reviewed from the early stage to the most recent works. We initially report on the growth of PCM and MIT materials and then discuss their DC characteristics. Afterwards, novel design approaches and notable fabrication processes; utilized to improve switching performance; are discussed and reviewed. Finally, a brief vis-á-vis comparison of resistivity, insertion loss, isolation loss, power consumption, RF power handling capability, switching speed, and reliability is provided to compare their performance to radio frequency microelectromechanical systems (RF MEMS) switches; which helps to demonstrate the current state-of-the-art, as well as insight into their potential in future applications

DESIGN AND MICROFABRICATION OF A CMOS-MEMS PIEZORESISTIVE ACCELEROMETER AND A NANO-NEWTON FORCE SENSOR

DESIGN AND MICROFABRICATION OF A CMOS-MEMS PIEZORESISTIVE ACCELEROMETER AND A NANO-NEWTON FORCE SENSOR by Mohd Haris Md Khir Adviser: Hongwei Qu, Ph.D. This thesis work consists of three aspects of research efforts: I. Design, fabrication, and characterization of a CMOS-MEMS piezoresistive accelerometer 2. Design, fabrication, and characterization of a CMOS-MEMS nano-Newton force sensor 3. Observer-based controller design of a nano-Newton force sensor actuator system A low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass has been fabricated. Inherent CMOS polysilicon thin film was utilized as piezoresistive material and full Wheatstone bridge was constructed through easy wiring allowed by three metal layers in CMOS thin films. The device fabrication process consists of a standard CMOS process for sensor configuration and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. Bulk single-crystal silicon (SCS) substrate was included in the proof mass to increase sensor sensitivity. Using a low operating power of 1.67 m W, the sensitivity was measured as 30.7 mV/g after amplification and 0.077 mV/g prior to amplification. With a total noise floor of 1.03 mg!-!Hz, the minimum detectable acceleration is found to be 32.0 mg for a bandwidth of I kHz which is sufficient for many applications. The second device investigated in this thesis work is a CMOS-MEMS capacitive force sensor capable ofnano-Newton out-of-plane force measurement. Sidewall and fringe capacitance formed by the multiple CMOS metal layers were utilized and fully differential sensing was enabled by common-centroid wiring of the sensing capacitors. Single-crystal silicon (SCS) is incorporated in the entire sensing element for robust structures and reliable sensor deployment in force measurement. A sensitivity of 8 m V /g prior to amplification was observed. With a total noise floor of 0.63 mg!-IHz, the minimum detection acceleration is found to be 19.8 mg, which is equivalent to a sensing force of 449 nN. This work also addresses the design and simulation of an observer-based nonlinear controller employed in a CMOS-MEMS nano-Newton force sensor actuator system. Measurement errors occur when there are in-plane movements of the probe tip; these errors can be controlled by the actuators incorporated within the sensor. Observerbased controller is necessitated in real-world control applications where not all the state variables are accessible for on-line measurements. V

Resistive-RAM for Data Storage Applications.

Mainstream non-volatile memory technology, dominated by the floating gate transistor, has historically improved in density, performance and cost primarily by means of process scaling. This simple geometrical scaling now faces significant challenges due to constraints of electrostatics and reliability. Thus, novel non-transistor based memory paradigms are being widely explored. Among the various contenders for next generation storage technology, RRAM devices have got immense attention due to their high-speed, multilevel capability, scalability, simple structure, low voltage operation and high endurance. In this thesis, electrical and material characterization is carried out on a MIM device system and formation / annihilation of nanoscale filaments is shown to be the reason behind the resistance switching. The MIM system is optimized to include an in-cell resistor which is shown to improve device endurance and reduce stuck-at-one faults. For highest density, the devices were arranged in a crossbar geometry and vertically integrated on CMOS decoders to demonstrate the feasibility of practical data storage applications. Next, we show that these binary RRAM devices exhibit native stochastic nature of resistive switching. Even for a fixed voltage on the same device, the wait time associated with programming is not fixed and is random and broadly distributed. However, the probability of switching can be predicted and controlled by the programming pulse. These binary devices have been used to generate random bit-streams with predicable bias ratios in time and space domains. The ability to produce random bit-streams using binary resistive switching devices based on the native stochastic switching principle may potentially lead to novel non-von-Neumann computing paradigms. Further, sub-1nA operating current devices have been developed. This ultra-low current provides energy savings by minimizing programming, erase and read currents. Despite having such low currents, excellent retention, on/off ratio and endurance have been demonstrated. Finally a scalable approach to simple 3D stacking is discussed. By implementation of a vertical sidewall-based architecture, the number of critical lithography steps can be reduced. A vertical device structure based on a W / WOx / Pd material system is developed. This scalable architecture is well suited for development of analog memory and neuromorphic systems.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/110461/1/sidgaba_1.pd

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

Doctor of Philosophy

dissertationMicroelectromechanical systems (MEMS) resonators on Si have the potential to replace the discrete passive components in a power converter. The main intention of this dissertation is to present a ring-shaped aluminum nitride (AlN) piezoelectric microreson

Laterally Movable Gate Field Effect Transistor (LMGFET) for microsensor and microactuator applications

Laterally Movable Gate Field Effect Transistor (LMGFET) invented at LSU as a microactuator is the subject of study in this research. The gate moving in lateral direction in a LMGFET changes channel width but keeps the channel length and the gap between the metal gate and the gate oxide constant. LMGFET offers linear change in drain current with gate motion and a large displacement range. This research is the first demonstration of LMGFET. In this dissertation, a post-IC LIGA-like process for LMGFET microstructure fabrication has been developed that is compatible with monolithic integration with CMOS circuitry. A two-mask post-IC process has been developed in this research for LMGFET fabrication. This novel process utilizes S1813 photoresist as a sacrificial layer in conjunction with a thicker resist like AZ P4620 or SU-8 as an electroplating mold. New curing temperatures for the sacrificial layer photoresist have been determined for this purpose. LMGFET microstructures have been successfully integrated with CMOS circuitry on the same chip to form integrated microsystem. LMGFET microstructure driven by a comb-drive with serpentine retaining spring shows sensitivities Sel of 2 and 1.43 nA/V respectively at 5 and 25 Hz. These numbers reflect that LMGFET is capable of measuring nm range displacement. Electrical characteristics of a depletion type LMGFET structure are measured and show an average sensitivity Sl of - 4 µA/µm at drain to source voltage VDS of 10 V with the gate shorted to source. Several applications of microsystems utilizing LMGFET microstructures as a position sensor or an accelerometer, a spectrum analyzer or an electro-mechanical filter and a mechanical/optical switch are described