Physical Design of Optoelectronic System-on-a-Chip/Package Using Electrical and Optical Interconnects: CAD Tools and Algorithms

Current electrical systems are faced with the limitation in performance by the electrical interconnect technology determining overall processing speed. In addition, the electrical interconnects containing many long distance interconnects require high power to drive. One of the best ways to overcome these bottlenecks is through the use of optical interconnect to limit interconnect latency and power. This research explores new computer-aided design algorithms for developing optoelectronic systems. These algorithms focus on place and route problems using optical interconnections covering system-on-a-chip design as well as system-on-a-package design. In order to design optoelectronic systems, optical interconnection models are developed at first. The CAD algorithms include optical interconnection models and solve place and route problems for optoelectronic systems. The MCNC and GSRC benchmark circuits are used to evaluate these algorithms.Ph.D.Committee Chair: Abhijit Chatterjee; Committee Member: C. P. Wong; Committee Member: David E. Schimmel; Committee Member: John A. Buck; Committee Member: Madhavan Swaminatha

Advanced information processing system for advanced launch system: Hardware technology survey and projections

The major goals of this effort are as follows: (1) to examine technology insertion options to optimize Advanced Information Processing System (AIPS) performance in the Advanced Launch System (ALS) environment; (2) to examine the AIPS concepts to ensure that valuable new technologies are not excluded from the AIPS/ALS implementations; (3) to examine advanced microprocessors applicable to AIPS/ALS, (4) to examine radiation hardening technologies applicable to AIPS/ALS; (5) to reach conclusions on AIPS hardware building blocks implementation technologies; and (6) reach conclusions on appropriate architectural improvements. The hardware building blocks are the Fault-Tolerant Processor, the Input/Output Sequencers (IOS), and the Intercomputer Interface Sequencers (ICIS)

Integrated Circuit Design for Hybrid Optoelectronic Interconnects

This dissertation focuses on high-speed circuit design for the integration of hybrid optoelectronic interconnects. It bridges the gap between electronic circuit design and optical device design by seamlessly incorporating the compact Verilog-A model for optical components into the SPICE-like simulation environment, such as the Cadence design tool. Optical components fabricated in the IME 130nm SOI CMOS process are characterized. Corresponding compact Verilog-A models for Mach-Zehnder modulator (MZM) device are developed. With this approach, electro-optical co-design and hybrid simulation are made possible. The developed optical models are used for analyzing the system-level specifications of an MZM based optoelectronic transceiver link. Link power budgets for NRZ, PAM-4 and PAM-8 signaling modulations are simulated at system-level. The optimal transmitter extinction ratio (ER) is derived based on the required receiver\u27s minimum optical modulation amplitude (OMA). A limiting receiver is fabricated in the IBM 130 nm CMOS process. By side- by-side wire-bonding to a commercial high-speed InGaAs/InP PIN photodiode, we demonstrate that the hybrid optoelectronic limiting receiver can achieve the bit error rate (BER) of 10-12 with a -6.7 dBm sensitivity at 4 Gb/s. A full-rate, 4-channel 29-1 length parallel PRBS is fabricated in the IBM 130 nm SiGe BiCMOS process. Together with a 10 GHz phase locked loop (PLL) designed from system architecture to transistor level design, the PRBS is demonstrated operating at more than 10 Gb/s. Lessons learned from high-speed PCB design, dealing with signal integrity issue regarding to the PCB transmission line are summarized

NASA Tech Briefs, February 1993

Topics include: Communication Technology; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences

Digital neural circuits : from ions to networks

PhD ThesisThe biological neural computational mechanism is always fascinating to human beings since it shows several state-of-the-art characteristics: strong fault tolerance, high power efficiency and self-learning capability. These behaviours lead the developing trend of designing the next-generation digital computation platform. Thus investigating and understanding how the neurons talk with each other is the key to replicating these calculation features. In this work I emphasize using tailor-designed digital circuits for exactly implementing bio-realistic neural network behaviours, which can be considered a novel approach to cognitive neural computation. The first advance is that biological real-time computing performances allow the presented circuits to be readily adapted for real-time closed-loop in vitro or in vivo experiments, and the second one is a transistor-based circuit that can be directly translated into an impalpable chip for high-level neurologic disorder rehabilitations. In terms of the methodology, first I focus on designing a heterogeneous or multiple-layer-based architecture for reproducing the finest neuron activities both in voltage-and calcium-dependent ion channels. In particular, a digital optoelectronic neuron is developed as a case study. Second, I focus on designing a network-on-chip architecture for implementing a very large-scale neural network (e.g. more than 100,000) with human cognitive functions (e.g. timing control mechanism). Finally, I present a reliable hybrid bio-silicon closed-loop system for central pattern generator prosthetics, which can be considered as a framework for digital neural circuit-based neuro-prosthesis implications. At the end, I present the general digital neural circuit design principles and the long-term social impacts of the presented work

NASA Tech Briefs, February 1989

This issue contains a special feature on shaping the future with Ceramics. Other topics include: Electronic Components & and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences