A Novel Power-Efficient Wireless Multi-channel Recording System for the Telemonitoring of Electroencephalography (EEG)

This research introduces the development of a novel EEG recording system that is modular, batteryless, and wireless (untethered) with the supporting theoretical foundation in wireless communications and related design elements and circuitry. Its modular construct overcomes the EEG scaling problem and makes it easier for reconfiguring the hardware design in terms of the number and placement of electrodes and type of standard EEG system contemplated for use. In this development, portability, lightweight, and applicability to other clinical applications that rely on EEG data are sought. Due to printer tolerance, the 3D printed cap consists of 61 electrode placements. This recording capacity can however extend from 21 (as in the international 10-20 systems) up to 61 EEG channels at sample rates ranging from 250 to 1000 Hz and the transfer of the raw EEG signal using a standard allocated frequency as a data carrier. The main objectives of this dissertation are to (1) eliminate the need for heavy mounted batteries, (2) overcome the requirement for bulky power systems, and (3) avoid the use of data cables to untether the EEG system from the subject for a more practical and less restrictive setting. Unpredictability and temporal variations of the EEG input make developing a battery-free and cable-free EEG reading device challenging. Professional high-quality and high-resolution analog front ends are required to capture non-stationary EEG signals at microvolt levels. The primary components of the proposed setup are the wireless power transmission unit, which consists of a power amplifier, highly efficient resonant-inductive link, rectification, regulation, and power management units, as well as the analog front end, which consists of an analog to digital converter, pre-amplification unit, filtering unit, host microprocessor, and the wireless communication unit. These must all be compatible with the rest of the system and must use the least amount of power possible while minimizing the presence of noise and the attenuation of the recorded signal A highly efficient resonant-inductive coupling link is developed to decrease power transmission dissipation. Magnetized materials were utilized to steer electromagnetic flux and decrease route and medium loss while transmitting the required energy with low dissipation. Signal pre-amplification is handled by the front-end active electrodes. Standard bio-amplifier design approaches are combined to accomplish this purpose, and a thorough investigation of the optimum ADC, microcontroller, and transceiver units has been carried out. We can minimize overall system weight and power consumption by employing battery-less and cable-free EEG readout system designs, consequently giving patients more comfort and freedom of movement. Similarly, the solutions are designed to match the performance of medical-grade equipment. The captured electrical impulses using the proposed setup can be stored for various uses, including classification, prediction, 3D source localization, and for monitoring and diagnosing different brain disorders. All the proposed designs and supporting mathematical derivations were validated through empirical and software-simulated experiments. Many of the proposed designs, including the 3D head cap, the wireless power transmission unit, and the pre-amplification unit, are already fabricated, and the schematic circuits and simulation results were based on Spice, Altium, and high-frequency structure simulator (HFSS) software. The fully integrated head cap to be fabricated would require embedding the active electrodes into the 3D headset and applying current technological advances to miniaturize some of the design elements developed in this dissertation

Scalable Array Transceivers with Wide Frequency Tuning Range for Next Generation Radios

Scalable array transceivers with wide frequency tuning range are attractive for next-generationradios. Key challenges for such radios include generation of LO signals with widefrequency tuning range, scalable synchronization between multiple array unit cells andtolerance to in-band and out-of-band interferers. This thesis presents approaches toaddress these challenges in commercial CMOS technologies.The first part focuses on a series resonant mode-switching VCO architecture thatachieves both state-of-art area and power efficiency with an octave frequency tuningrange from 6.4-14 GHz achieved 186-dB-188-dB Figure-of-Merit (FoM) in 65 nm CMOStechnology. The scalability of this approach towards achieving even larger FTR is alsodemonstrated by a triple-mode 2.2 GHz to 8.7 GHz (119% FTR) CMOS VCO.In the second part a scalable, single-wire coupled-PLL architecture for RF mm-wavearrays is presented. The proposed architecture preserves the simplicity of a daisy-chained LO distribution, compensates for phase offset due to interconnect, and provides phasenoise improvement commensurate to the number of coupled PLLs. Measurements on a28 GHz CMOS prototype demonstrate the feasibility of this scheme.The third part of this thesis presents filtering techniques for in-band blocker suppression.A spatial spectral notch filter design for MIMO digital beam forming arrays is proposedto relax the ADC dynamic range requirement. Orthogonal properties of Walsh functionsincorporated into passive N-path approach enables reconfigurable notches at multiplefrequencies and angles-of-incidence. A 0.3 GHz-1.4 GHz four-element array prototypeimplemented in 65 nm CMOS achieves > 15-dB notch filtering at RF input for twoblockers while causing < 3-dB NF degradation.Finally, a code-domain N-path receiver (RX) is proposed based on pseudo-random(PN) code-modulated LO pulses for simultaneous transmission and reception (STAR)applications. A combination of Walsh-Function and PN sequence is proposed to createcode-domain matched filter at the RF frontend which reflects unknown in-band blockersand rejects known in-band TX self-interference (SI) by using orthogonal codes at RXinput thereby maximizing the SNR of the received signals. The resulting prototype in65 nm is functional from 0.3 GHz-1.4 GHz with 35 dB gain and concurrently receivestwo code-modulated signals. Proposed transmitter (TX) SI mitigation approach resultsin 38.5 dB rejection for -11.8 dBm 1.46 Mb s QPSK modulated SI at RX input. TheRX achieves 23.7 dBm OP1dB for in-band SI, while consuming ∼35 mW and occupies0.31 mm2Keywords: Passive Mixers, dual band, TX self-Interferer, synchronisation, STAR, Code domain N-path receiver, mode switching, notch filter, Phase locked loops, Octave tuning range, CMOS, phase noise, VCO, large-scale 5G mm-wave arrays, resonator, Simultaneous transmit and receive, resonator band-switching, LO distribution, scalable coupled-PLL, N-path passive mixers, MIMO arrays, digital beamforming, CDMA, phased arrays, wide tuning range, Walsh Functio

Heterogeneous Integration on Silicon-Interconnect Fabric using fine-pitch interconnects (≤10 �m)

Today, the ever-growing data-bandwidth demand is pushing the boundaries of the traditional printed circuit board (PCB) based integration schemes. Moreover, with the apparent saturation of semiconductor scaling, commonly called Moore's law, system scaling warrants a paradigm shift in packaging technologies, assembly techniques, and integration methodologies. In this work, a superior alternative to PCBs called the Silicon-Interconnect Fabric (Si-IF) is investigated. The Si-IF is a silicon-based, package-less, fine-pitch, highly scalable, heterogeneous integration platform for wafer-scale systems. In this technology, unpackaged dielets are assembled on the Si-IF at small inter-dielet spacings (≤100 �m) using fine-pitch (≤10 �m) die-to-substrate interconnects. A novel assembly process using a solder-less direct metal-metal (gold-gold and copper-copper) thermal compression bonding was developed. Using this process, sub-10 �m pitch interconnects with a low specific contact resistance of ≤0.7 Ω-�m2 were successfully demonstrated. Because of the tightly packed Si-IF assembly, the communication links between the neighboring dies are short (≤500 �m) with low loss (≤2 dB), comparable to on-chip connections. Consequently, simple buffers can transfer data between dies using a Simple Universal Parallel intERface for chips (SuperCHIPS) at low latency (&lt;30 ps), low energy per bit (≤0.03 pJ/b), and high data-rates (up to 10 Gbps/link), corresponding to an aggregate bandwidth up to 8 Tbps/mm. The benefits of the SuperCHIPS protocol were experimentally demonstrated to provide 5-90X higher data-bandwidth, 8-30X lower latency, and 5-40X lower energy per bit compared to existing integration schemes. This dissertation addresses the assembly technology and communication protocols of the Si-IF technology

Novel Multicarrier Memory Channel Architecture Using Microwave Interconnects: Alleviating the Memory Wall

abstract: The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon. A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel. Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Evaluating Techniques for Wireless Interconnected 3D Processor Arrays

In this thesis the viability of a wireless interconnect network for a highly parallel computer is investigated. The main theme of this thesis is to project the performance of a wireless network used to connect the processors in a parallel machine of such design. This thesis is going to investigate new design opportunities a wireless interconnect network can offer for parallel computing. A simulation environment is designed and implemented to carry out the tests. The results have shown that if the available radio spectrum is shared effectively between building blocks of the parallel machine, there are substantial chances to achieve high processor utilisation. The results show that some factors play a major role in the performance of such a machine. The size of the machine, the size of the problem and the communication and computation capabilities of each element of the machine are among those factors. The results show these factors set a limit on the number of nodes engaged in some classes of tasks. They have shown promising potential for further expansion and evolution of our idea to new architectural opportunities, which is discussed by the end of this thesis. To build a real machine of this type the architects would need to solve a number of challenging problems including heat dissipation, delivering electric power and Chip/board design; however, these issues are not part of this thesis and will be tackled in future

Precision at Scale: System Design from Tiny Biosensors to Giant Arrays

In order to change the world, technological advancements must be made affordable and available for the general public to use. In other words, we must be able to scale our inventions effectively. Silicon integrated circuits are crucial components in scaling electronic systems because they are mass producible and offer a phenomenal cost-to-complexity ratio. This thesis summarizes the author’s work on highly scalable sensor and array systems. It presents three high precision systems, that demonstrate how the use of highly functional radio-frequency integrated circuits enables the realization of previously unfeasible architectures

Ultra-Low Power Optical Interface Circuits for Nearly Invisible Wireless Sensor Nodes.

Technological advances in the semiconductor industry and integrated circuit design have resulted in electronic devices that are smaller and cheaper than ever, and yet they are more pervasive and powerful than what could hardly be imagined several decades ago. Nowadays, small hand-held devices such as smartphones have completely reshaped the way people communicate, share information, and get entertained. According to Bell’s Law, the next generation of computers will be cubic-millimeter-scale in volume with more prevalent presence than any other computing platform available today, opening up myriad of new applications. In this dissertation, a millimeter-scale wireless sensor node for visual sensing applications is proposed, with emphasis on the optical interface circuits that enable wireless optical communication and visual imaging. Visual monitoring and imaging with CMOS image sensors opens up a variety of new applications for wireless sensor nodes, ranging from surveillance to in vivo molecular imaging. In particular, the ability to detect motion can enable intelligent power management through on-demand duty cycling and reduce the data storage requirement. Optical communication provides an ultra-low power method to wirelessly control or transmit data to the sensor node after encapsulation and deployment. The proposed wireless sensor node is a nearly-invisible, yet a complete system with imaging, optics, two-way wireless communication, CPU, memory, battery and energy harvesting with solar cells. During its ultra-low power motion detection mode, the overall power consumption is merely 304 nW, allowing energy autonomous continuous operation with 10 klux of background lighting. Such complete features in the unprecedented form factor can revolutionize the role of electronics in our future daily lives, taking the “Smart Dust” concept from fiction to reality.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/110399/1/coolkgh_1.pd

Control of wireless power transfer system for dynamic charging of electric vehicles

L'abstract è presente nell'allegato / the abstract is in the attachmen

Architecting a One-to-many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems

With the aggressive scaling of device geometries, the yield of complex Multi Core Single Chip(MCSC) systems with many cores will decrease due to the higher probability of manufacturing defects especially, in dies with a large area. Disintegration of large System-on-Chips(SoCs) into smaller chips called chiplets has shown to improve the yield and cost of complex systems. Therefore, platform-based computing modules such as embedded systems and micro-servers have already adopted Multi Core Multi Chip (MCMC) architectures overMCSC architectures. Due to the scaling of memory intensive parallel applications in such systems, data is more likely to be shared among various cores residing in different chips resulting in a significant increase in chip-to-chip traffic, especially one-to-many traffic. This one-to-many traffic is originated mainly to maintain cache-coherence between many cores residing in multiple chips. Besides, one-to-many traffics are also exploited by many parallel programming models, system-level synchronization mechanisms, and control signals. How-ever, state-of-the-art Network-on-Chip (NoC)-based wired interconnection architectures do not provide enough support as they handle such one-to-many traffic as multiple unicast trafficusing a multi-hop MCMC communication fabric. As a result, even a small portion of such one-to-many traffic can significantly reduce system performance as traditional NoC-basedinterconnect cannot mask the high latency and energy consumption caused by chip-to-chipwired I/Os. Moreover, with the increase in memory intensive applications and scaling of MCMC systems, traditional NoC-based wired interconnects fail to provide a scalable inter-connection solution required to support the increased cache-coherence and synchronization generated one-to-many traffic in future MCMC-based High-Performance Computing (HPC) nodes. Therefore, these computation and memory intensive MCMC systems need an energy-efficient, low latency, and scalable one-to-many (broadcast/multicast) traffic-aware interconnection infrastructure to ensure high-performance. Research in recent years has shown that Wireless Network-in-Package (WiNiP) architectures with CMOS compatible Millimeter-Wave (mm-wave) transceivers can provide a scalable, low latency, and energy-efficient interconnect solution for on and off-chip communication. In this dissertation, a one-to-many traffic-aware WiNiP interconnection architecture with a starvation-free hybrid Medium Access Control (MAC), an asymmetric topology, and a novel flow control has been proposed. The different components of the proposed architecture are individually one-to-many traffic-aware and as a system, they collaborate with each other to provide required support for one-to-many traffic communication in a MCMC environment. It has been shown that such interconnection architecture can reduce energy consumption and average packet latency by 46.96% and 47.08% respectively for MCMC systems. Despite providing performance enhancements, wireless channel, being an unguided medium, is vulnerable to various security attacks such as jamming induced Denial-of-Service (DoS), eavesdropping, and spoofing. Further, to minimize the time-to-market and design costs, modern SoCs often use Third Party IPs (3PIPs) from untrusted organizations. An adversary either at the foundry or at the 3PIP design house can introduce a malicious circuitry, to jeopardize an SoC. Such malicious circuitry is known as a Hardware Trojan (HT). An HTplanted in the WiNiP from a vulnerable design or manufacturing process can compromise a Wireless Interface (WI) to enable illegitimate transmission through the infected WI resulting in a potential DoS attack for other WIs in the MCMC system. Moreover, HTs can be used for various other malicious purposes, including battery exhaustion, functionality subversion, and information leakage. This information when leaked to a malicious external attackercan reveals important information regarding the application suites running on the system, thereby compromising the user profile. To address persistent jamming-based DoS attack in WiNiP, in this dissertation, a secure WiNiP interconnection architecture for MCMC systems has been proposed that re-uses the one-to-many traffic-aware MAC and existing Design for Testability (DFT) hardware along with Machine Learning (ML) approach. Furthermore, a novel Simulated Annealing (SA)-based routing obfuscation mechanism was also proposed toprotect against an HT-assisted novel traffic analysis attack. Simulation results show that,the ML classifiers can achieve an accuracy of 99.87% for DoS attack detection while SA-basedrouting obfuscation could reduce application detection accuracy to only 15% for HT-assistedtraffic analysis attack and hence, secure the WiNiP fabric from age-old and emerging attacks