Free Speech and Its Relation to Self-Government by Alexander Meiklejohn

In today’s system-on-chip (SoC) implementations, power consumption is a key performance specification. The proliferation of mobile communication devices and distributed wireless sensor networks has necessitated the development of power-efficient analog, radio-frequency (RF), and digital integrated circuits. The rapid scaling of CMOS technology nodes presents opportunities and challenges. Benefits accrue in terms of integration density and higher switching speeds for the digital logic. However, the concomitant reduction in supply voltage and reduced gain of transistors pose obstacles to the design of highperformance analog and mixed-signal circuits such as analog front-ends (AFEs) and data converters. To achieve high DC gain, multistage amplifiers are becoming necessary in AFEs and analog-to-digital converters (ADCs) implemented in the latest CMOS process nodes. This thesis includes the design of multistage amplifiers in 40 nm and 65 nm CMOS processes. An AFE for capacitive body-coupled communication is presented with transistor schematic level results in 40 nm CMOS. The AFE consists of a cascade of amplifiers to boost the received signal followed by a Schmitt trigger which provides digital signal levels at the output. Low noise and reduced power consumption are the important performance criteria for the AFE. A two-stage, single-ended amplifier incorporating indirect compensation using split-length transistors has been designed. The compensation technique does not require the nulling resistor used in traditional Miller compensation. The AFE consisting of a cascade of three amplifiers achieves 57.6 dB DC gain with an input-referred noise power spectral density (PSD) of 4.4 nV/ while consuming 6.8 mW. Numerous compensation schemes have been proposed in the literature for multistage amplifiers. Most of these works investigate frequency compensation of amplifiers which drive large capacitive loads and require low unity-gain frequency. In this thesis, the frequency compensation schemes for high-speed, lowvoltage multistage CMOS amplifiers driving small capacitive loads have been investigated. Existing compensation schemes such as the nested Miller compensation with nulling resistor (NMCNR) and reversed nested indirect compensation (RNIC) have been applied to four-stage and three-stage amplifiers designed in 40 nm and 65 nm CMOS, respectively. The performance metrics used for comparing the different frequency compensation schemes are the unity gain  frequency, phase margin (PM), and total amount of compensation capacitance used. From transistor schematic simulation results, it is concluded that RNIC is more efficient than NMCNR. Successive approximation register (SAR) analog-to-digital converters (ADCs) are becoming increasingly popular in a wide range of applications due to their high power efficiency, design simplicity and scaling-friendly architecture. Singlechannel SAR ADCs have reached high resolutions with sampling rates exceeding 50 MS/s. Time-interleaved SAR ADCs have pushed beyond 1 GS/s with medium resolution. The generation and buffering of reference voltages is often not the focus of published works. For high-speed SAR ADCs, due to the sequential nature of the successive approximation algorithm, a high-frequency clock for the SAR logic is needed. As the digital-to-analog converter (DAC) output voltage needs to settle to the desired accuracy within half clock cycle period of the system clock, a speed limitation occurs due to imprecise DAC settling. The situation is exacerbated by parasitic inductance of bondwires and printed circuit board (PCB) traces especially when the reference voltages are supplied off-chip. In this thesis, a power efficient reference voltage buffer with small area has been implemented in 180 nm CMOS for a 10-bit 1 MS/s SAR ADC which is intended to be used in a fingerprint sensor. Since the reference voltage buffer is part of an industrial SoC, critical performance specifications such as fast settling, high power supply rejection ratio (PSRR), and low noise have to be satisfied under mismatch conditions and over the entire range of process, supply voltage and temperature (PVT) corners. A single-ended, current-mirror amplifier with cascodes has been designed to buffer the reference voltage. Performance of the buffer has been verified by exhaustive simulations on the post-layout extracted netlist. Finally, we describe the design of a 10-bit 50 MS/s SAR ADC in 65 nmCMOS with a high-speed, on-chip reference voltage buffer. In a SAR ADC, the capacitive array DAC is the most area-intensive block. Also a binary-weighted capacitor array has a large spread of capacitor values for moderate and high resolutions which leads to increased power consumption. In this work, a split binary-weighted capacitive array DAC has been used to reduce area and power consumption. The proposed ADC has bootstrapped sampling switches which meet 10-bit linearity over all PVT corners and a two-stage dynamic comparator. The important design parameters of the reference voltage buffer are derived in the context of the SAR ADC. The impact of the buffer on the ADC performance is illustrated by simulations using bondwire parasitics. In post-layout simulation which includes the entire pad frame and associated parasitics, the ADC achieves an ENOB of 9.25 bits at a supply voltage of 1.2 V, typical process corner, and sampling frequency of 50 MS/s for near-Nyquist input. Excluding the reference voltage buffer, the ADC achieves an energy efficiency of 25 fJ/conversion-step while occupying a core area of 0.055 mm2

A Fully Integrated High-Temperature, High-Voltage, BCD-on-SOI Voltage Regulator

Developments in automotive (particularly hybrid electric vehicles), aerospace, and energy production industries over the recent years have led to expanding research interest in integrated circuit (IC) design toward high-temperature applications. A high-voltage, high-temperature SOI process allows for circuit design to expand into these extreme environment applications. Nearly all electronic devices require a reliable supply voltage capable of operating under various input voltages and load currents. These input voltages and load currents can be either DC or time-varying signals. In this work, a stable supply voltage for embedded circuit functions is generated on chip via a voltage regulator circuit producing a stable 5-V output voltage. Although applications of this voltage regulator are not limited to gate driver circuits, this regulator was developed to meet the demands of a gate driver IC. The voltage regulator must provide reliable output voltage over an input range from 10 V to 30 V, a temperature range of −50 ºC to 200 ºC, and output loads from 0 mA to 200 mA. Additionally, low power stand-by operation is provided to help reduce heat generation and thus lower operating junction temperature. This regulator is based on the LM723 Zener reference voltage regulator which allows stable performance over temperature (provided proper design of the temperature compensation scheme). This circuit topology and the SOI silicon process allow for reliable operation under all application demands. The designed voltage regulator has been successfully tested from −50 ºC to 200 ºC while demonstrating an output voltage variation of less than 25 mV under the full range of input voltage. Line regulation tests from 10 V to 35 V show a 3.7-ppm/V supply sensitivity. With the use of a high-temperature ceramic output capacitor, a 5-nsec edge, 0 to 220 mA, 1-µsec pulse width load current induced only a 55 mV drop in regulator output voltage. In the targeted application, load current pulse widths will be much shorter, thereby improving the load transient performance. Full temperature and input voltage range tests reveal the no-load supply current draw is within 330 µA while still providing an excess of 200 mA of load current upon demand

Research progress on coal mine laser methane sensor

This paper discusses the research progress of low-power technology of laser methane sensors for coal mine. On the basis of environment of coal mines, such as ultra-long-distance transmission and high stability, a series of studies have been carried out. The preliminary results have been achieved in the research of low power consumption, temperature and pressure compensation and reliability design. The technology is applied to various products in coal mines, and achieves high stability and high reliability in products such as laser methane sensor, laser methane detection alarm device, wireless laser methane detection alarm device, and optic fiber multichannel laser methane sensor. Experimental testing and analysis of the characteristics of laser methane sensors, combined with the actual application

An Ultra-Low-Power Oscillator with Temperature and Process Compensation for UHF RFID Transponder

This paper presents a 1.28MHz ultra-low-power oscillator with temperature and process compensation. It is very suitable for clock generation circuits used in ultra-high-frequency (UHF) radio-frequency identification (RFID) transponders. Detailed analysis of the oscillator design, including process and temperature compensation techniques are discussed. The circuit is designed using TSMC 0.18μm standard CMOS process and simulated with Spectre. Simulation results show that, without post-fabrication calibration or off-chip components, less than ±3% frequency variation is obtained from –40 to 85°C in three different process corners. Monte Carlo simulations have also been performed, and demonstrate a 3σ deviation of about 6%. The power for the proposed circuitry is only 1.18µW at 27°C

Self-Commissioning Algorithm for Inverter Non-Linearity Compensation in Sensorless Induction Motor Drives

In many sensorless field-oriented control schemes for induction motor (IM) drives, flux is estimated by means of measured motor currents and control reference voltages. In most cases, flux estimation is based on the integral of back-electromotive-force (EMF) voltages. Inverter nonlinear errors (dead-time and on-state voltage drops) introduce a distortion in the estimated voltage that reduces the accuracy of the flux estimation, particularly at low speed. In the literature, most of the compensation techniques of such errors require the offline identification of the inverter model and offline postprocessing. This paper presents a simple and accurate method for the identification of inverter parameters at the drive startup. The method is integrated into the control code of the IM drive, and it is based on the information contained in the feedback signal of the flux observer. The procedure applies, more in general, to all those sensorless ac drives where the flux is estimated using the back-EMF integration, not only for IM drives but also for permanent-magnet synchronous motor drives (surface-mounted permanent magnet and interior permanent magnet). A self-commissioning algorithm is presented and tested for the sensorless control of an IM drive, implemented on a fixed-point DSP. The feasibility and effectiveness of the method are demonstrated by experimental result

Accurate Inverter Error Compensation and Related Self-Commissioning Scheme in Sensorless Induction Motor Drives

This paper presents a technique for accurately identifying and compensating the inverter nonlinear voltage errors that deteriorate the performance of sensorless field-oriented controlled drives at low speed. The inverter model is more accurate than the standard signum-based models that are common in the literature, and the self-identification method is based on the feedback signal of the closed-loop flux observer in dc current steady-state conditions. The inverter model can be identified directly by the digital controller at the drive startup with no extra measures other than the motor phase currents and dc-link voltage. After the commissioning session, the compensation does not require to be tuned furthermore and is robust against temperature detuning. The experimental results, presented here for a rotor-flux-oriented SFOC IM drive for home appliances, demonstrate the feasibility of the proposed solution

Self-Reconfigurable Analog Arrays: Off-The Shelf Adaptive Electronics for Space Applications

Development of analog electronic solutions for space avionics is expensive and lengthy. Lack of flexible analog devices, counterparts to digital Field Programmable Gate Arrays (FPGA), prevents analog designers from benefits of rapid prototyping. This forces them to expensive and lengthy custom design, fabrication, and qualification of application specific integrated circuits (ASIC). The limitations come from two directions: commercial Field Programmable Analog Arrays (FPAA) have limited variability in the components offered on-chip; and they are only qualified for best case scenarios for military grade (-55C to +125C). In order to avoid huge overheads, there is a growing trend towards avoiding thermal and radiation protection by developing extreme environment electronics, which maintain correct operation while exposed to temperature extremes (-180degC to +125degC). This paper describes a recent FPAA design, the Self-Reconfigurable Analog Array (SRAA) developed at JPL. It overcomes both limitations, offering a variety of analog cells inside the array together with the possibility of self-correction at extreme temperatures

A 65-nm CMOS Temperature-Compensated Mobility-Based Frequency reference for wireless sensor networks

For the first time, a temperature-compensated CMOS frequency reference based on the electron mobility in a MOS transistor is presented. Over the temperature range from -55°C to 125 °C, its frequency spread is less than ±0.5% after a two-point trim and less than ±2.7% after a one-point trim. These results make it suitable for use in Wireless Sensor Network nodes. Fabricated in a baseline 65-nm CMOS process, the 150 kHz frequency reference occupies 0.2 mm2 and draws 42.6 μA from a 1.2-V supply at room temperature.\ud \u

A 1.2-V 10- µW NPN-Based Temperature Sensor in 65-nm CMOS With an Inaccuracy of 0.2 °C (3σ) From 70 °C to 125 °C

An NPN-based temperature sensor with digital output transistors has been realized in a 65-nm CMOS process. It achieves a batch-calibrated inaccuracy of ±0.5 ◦C (3¾) and a trimmed inaccuracy of ±0.2 ◦C (3¾) over the temperature range from −70 ◦C to 125 ◦C. This performance is obtained by the use of NPN transistors as sensing elements, the use of dynamic techniques, i.e. correlated double sampling and dynamic element matching, and a single room-temperature trim. The sensor draws 8.3 μA from a 1.2-V supply and occupies an area of 0.1 mm2