504 research outputs found
Orbit Transfer Rocket Engine Technology Program: Advanced engine study, task D.1/D.3
Concepts for space maintainability of OTV engines were examined. An engine design was developed which was driven by space maintenance requirements and by a failure mode and effects (FME) analysis. Modularity within the engine was shown to offer cost benefits and improved space maintenance capabilities. Space operable disconnects were conceptualized for both engine change-out and for module replacement. Through FME mitigation the modules were conceptualized to contain the least reliable and most often replaced engine components. A preliminary space maintenance plan was developed around a controls and condition monitoring system using advanced sensors, controls, and condition monitoring concepts. A complete engine layout was prepared satisfying current vehicle requirements and utilizing projected component advanced technologies. A technology plan for developing the required technology was assembled
Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs
Three-dimensional Integrated Circuits (3D-ICs) vertically stack multiple silicon dies to reduce overall wire length, power consumption, and allow integration of heterogeneous technologies. Through-silicon-vias (TSVs) which act as vertical links between layers pose challenges for 3D integration design. TSV defects can happen in fabrication process and bonding stage, which can reduce the yield and increase the cost. Recent work proposed the employment of redundant TSVs to improve the yield of 3D-ICs. This paper presents a redundant TSVs grouping technique, which partition regular and redundant TSVs into groups. For each group, a set of multiplexers are used to select good signal paths away from defective TSVs. We investigate the impact of grouping ratio (regular-to-redundant TSVs in one group) on trade-off between yield and hardware overhead. We also show probabilistic models for yield analysis under the influence of independent and clustering defect distributions. Simulation results show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratios lead to achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios
Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits
Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount
Fault-tolerant vertical link design for effective 3D stacking
[EN] Recently, 3D stacking has been proposed to alleviate the memory bandwidth limitation arising in chip multiprocessors
(CMPs). As the number of integrated cores in the chip increases the access to external memory becomes the bottleneck, thus
demanding larger memory amounts inside the chip. The most accepted solution to implement vertical links between stacked dies
is by using Through Silicon Vias (TSVs). However, TSVs are exposed to misalignment and random defects compromising the yield of
the manufactured 3D chip. A common solution to this problem is by over-provisioning, thus impacting on area and cost. In this paper,
we propose a fault-tolerant vertical link design. With its adoption, fault-tolerant vertical links can be implemented in a 3D chip design
at low cost without the need of adding redundant TSVs (no over-provision). Preliminary results are very promising as the fault-tolerant
vertical link design increases switch area only by 6.69% while the achieved interconnect yield tends to 100%.This work was supported by the Spanish MEC and MICINN, as well as European Comission FEDER funds, under Grants CSD2006-00046 and TIN2009-14475-C04. It was also partly supported by the project NaNoC (project label 248972) which is funded by the European Commission within the Research Programme FP7.Hernández Luz, C.; Roca Pérez, A.; Flich Cardo, J.; Silla Jiménez, F.; Duato MarÃn, JF. (2011). Fault-tolerant vertical link design for effective 3D stacking. IEEE Computer Architecture Letters. 10(2):41-44. https://doi.org/10.1109/L-CA.2011.17S414410
High-Density Solid-State Memory Devices and Technologies
This Special Issue aims to examine high-density solid-state memory devices and technologies from various standpoints in an attempt to foster their continuous success in the future. Considering that broadening of the range of applications will likely offer different types of solid-state memories their chance in the spotlight, the Special Issue is not focused on a specific storage solution but rather embraces all the most relevant solid-state memory devices and technologies currently on stage. Even the subjects dealt with in this Special Issue are widespread, ranging from process and design issues/innovations to the experimental and theoretical analysis of the operation and from the performance and reliability of memory devices and arrays to the exploitation of solid-state memories to pursue new computing paradigms
Architectural Techniques to Enable Reliable and Scalable Memory Systems
High capacity and scalable memory systems play a vital role in enabling our
desktops, smartphones, and pervasive technologies like Internet of Things
(IoT). Unfortunately, memory systems are becoming increasingly prone to faults.
This is because we rely on technology scaling to improve memory density, and at
small feature sizes, memory cells tend to break easily. Today, memory
reliability is seen as the key impediment towards using high-density devices,
adopting new technologies, and even building the next Exascale supercomputer.
To ensure even a bare-minimum level of reliability, present-day solutions tend
to have high performance, power and area overheads. Ideally, we would like
memory systems to remain robust, scalable, and implementable while keeping the
overheads to a minimum. This dissertation describes how simple cross-layer
architectural techniques can provide orders of magnitude higher reliability and
enable seamless scalability for memory systems while incurring negligible
overheads.Comment: PhD thesis, Georgia Institute of Technology (May 2017
A review of advances in pixel detectors for experiments with high rate and radiation
The Large Hadron Collider (LHC) experiments ATLAS and CMS have established
hybrid pixel detectors as the instrument of choice for particle tracking and
vertexing in high rate and radiation environments, as they operate close to the
LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for
which the tracking detectors will be completely replaced, new generations of
pixel detectors are being devised. They have to address enormous challenges in
terms of data throughput and radiation levels, ionizing and non-ionizing, that
harm the sensing and readout parts of pixel detectors alike. Advances in
microelectronics and microprocessing technologies now enable large scale
detector designs with unprecedented performance in measurement precision (space
and time), radiation hard sensors and readout chips, hybridization techniques,
lightweight supports, and fully monolithic approaches to meet these challenges.
This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog.
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