Low-power and high-performance SRAM design in high variability advanced CMOS technology

As process technologies shrink, the size and number of memories on a chip are exponentially increasing. Embedded SRAMs are a critical component in modern digital systems, and they strongly impact the overall power, performance, and area. To promote memory-related research in academia, this dissertation introduces OpenRAM, a flexible, portable and open-source memory compiler and characterization methodology for generating and verifying memory designs across different technologies.In addition, SRAM designs, focusing on improving power consumption, access time and bitcell stability are explored in high variability advanced CMOS technologies. To have a stable read/write operation for SRAM in high variability process nodes, a differential-ended single-port 8T bitcell is proposed that improves the read noise margin, write noise margin and readout bitcell current by 45%, 48% and 21%, respectively, compared to a conventional 6T bitcell. Also, a differential-ended single-port 12T bitcell for subthreshold operation is proposed that solves the half-select disturbance and allows efficient bit-interleaving. 12T bitcell has a leakage control mechanism which helps to reduce the power consumption and provides operation down to 0.3 V. Both 8T and 12T bitcells are analyzed in a 64 kb SRAM array using 32 nm technology. Besides, to further improve the access time and power consumption, two tracking circuits (multi replica bitline delay and reconfigurable replica bitline delay techniques) are proposed to aid the generation of accurate and optimum sense amplifier set time.An error tolerant SRAM architecture suitable for low voltage video application with dynamic power-quality management is also proposed in this dissertation. This memory uses three power supplies to improve the SRAM stability in low voltages. The proposed triple-supply approach achieves 63% improvement in image quality and 69% reduction in power consumption compared to a single-supply 64 kb SRAM array at 0.70 V

Study and development of innovative strategies for energy-efficient cross-layer design of digital VLSI systems based on Approximate Computing

The increasing demand on requirements for high performance and energy efficiency in modern digital systems has led to the research of new design approaches that are able to go beyond the established energy-performance tradeoff. Looking at scientific literature, the Approximate Computing paradigm has been particularly prolific. Many applications in the domain of signal processing, multimedia, computer vision, machine learning are known to be particularly resilient to errors occurring on their input data and during computation, producing outputs that, although degraded, are still largely acceptable from the point of view of quality. The Approximate Computing design paradigm leverages the characteristics of this group of applications to develop circuits, architectures, algorithms that, by relaxing design constraints, perform their computations in an approximate or inexact manner reducing energy consumption. This PhD research aims to explore the design of hardware/software architectures based on Approximate Computing techniques, filling the gap in literature regarding effective applicability and deriving a systematic methodology to characterize its benefits and tradeoffs. The main contributions of this work are: -the introduction of approximate memory management inside the Linux OS, allowing dynamic allocation and de-allocation of approximate memory at user level, as for normal exact memory; - the development of an emulation environment for platforms with approximate memory units, where faults are injected during the simulation based on models that reproduce the effects on memory cells of circuital and architectural techniques for approximate memories; -the implementation and analysis of the impact of approximate memory hardware on real applications: the H.264 video encoder, internally modified to allocate selected data buffers in approximate memory, and signal processing applications (digital filter) using approximate memory for input/output buffers and tap registers; -the development of a fully reconfigurable and combinatorial floating point unit, which can work with reduced precision formats

Monolithically Integrated SRAM-ReRAM Cache-Main Memory System

Emerging non-volatile memories are dense and potentially compatible with standard CMOS processes, enabling a monolithically integrated CPU-main memory chip. However, area constraints impact the feasibility of fitting the entirety of a multi-core CPU and main memory system into a single die. ReRAM presents a unique opportunity in that it can be fabricated in crosspoint subarrays which leave the bulk of transistors beneath them available for other logic. However, ReRAM also poses a performance challenge; the latency is generally much higher than that of DRAM. Compensating for this through the increased bandwidth afforded from being on-die poses an architectural problem. The access circuitry for ReRAM subarrays requires only a small percentage of the area beneath the array. Still, this dense circuitry and wiring disrupts the layouts of irregular logic like CPUs. Caches are very regular and composed of smaller subarrays, making them a better candidate to place beneath crosspoint subarrays. By co-designing the cache subarrays and ReRAM crosspoint subarrays, minimal disruption to the cache logic can be achieved while still covering the bulk of the last-level cache area in ReRAM. This work explores the design space when co-designing the last-level cache and ReRAM crosspoint subarrays. Using a modified version of Cacti, we are able to explore the design trade-offs when integrating ReRAM and cache and quantify the impact the ReRAM has on the last-level cache. This design space exploration gives us a first order approximation of the memory capacity of a monolithic computer and informs architectural simulations of such a machine. We also examine how the physical integration presents opportunities for logical integration of the last-level cache and main memory. The interconnects and controllers can be combined, and the addressing can be such that data movement between the main memory and cache is primarily vertical. These optimizations can result in area and energy savings with minor impacts on performance. The second section of this work explores one architectural style which can balance the monolithic memory system and a general-purpose compute system---a tiled multicore with wide SIMD and multi-threading. We develop a simulator for this architecture capable of simulating a wide variety of system parameters. Through a design space exploration of many of the parameters across sparse, irregular graph kernels and dense, streaming computations, we find monolithic ReRAM exceeds the performance of a state-of-the-art DRAM system for memory intensive workloads given enough parallelism. We further develop an analytic model to describe our system and highlight the important performance characteristics for a monolithic CPU-main memory chip. The analytic model is validated against our simulation data. Using this model, we examine the architectural balance of the systems we simulated. Finally, we develop an RTL model of the combined cache--main memory interface. This gives a more accurate model for the increase in resources required for the combined controller. We additionally develop a system-on-a-chip with an RTL model that alters requests to the FPGA's main memory to be at the speed of ReRAM requests. This model is used to show the performance of more computationally intensive benchmarks. It also is the first step toward creating a test chip for a monolithically integrated ReRAM main memory

Development and certification of mixed-criticality embedded systems based on probabilistic timing analysis

An increasing variety of emerging systems relentlessly replaces or augments the functionality of mechanical subsystems with embedded electronics. For quantity, complexity, and use, the safety of such subsystems is an increasingly important matter. Accordingly, those systems are subject to safety certification to demonstrate system's safety by rigorous development processes and hardware/software constraints. The massive augment in embedded processors' complexity renders the arduous certification task significantly harder to achieve. The focus of this thesis is to address the certification challenges in multicore architectures: despite their potential to integrate several applications on a single platform, their inherent complexity imperils their timing predictability and certification. Recently, the Measurement-Based Probabilistic Timing Analysis (MBPTA) technique emerged as an alternative to deal with hardware/software complexity. The innovation that MBPTA brings about is, however, a major step from current certification procedures and standards. The particular contributions of this Thesis include: (i) the definition of certification arguments for mixed-criticality integration upon multicore processors. In particular we propose a set of safety mechanisms and procedures as required to comply with functional safety standards. For timing predictability, (ii) we present a quantitative approach to assess the likelihood of execution-time exceedance events with respect to the risk reduction requirements on safety standards. To this end, we build upon the MBPTA approach and we present the design of a safety-related source of randomization (SoR), that plays a key role in the platform-level randomization needed by MBPTA. And (iii) we evaluate current certification guidance with respect to emerging high performance design trends like caches. Overall, this Thesis pushes the certification limits in the use of multicore and MBPTA technology in Critical Real-Time Embedded Systems (CRTES) and paves the way towards their adoption in industry.Una creciente variedad de sistemas emergentes reemplazan o aumentan la funcionalidad de subsistemas mecánicos con componentes electrónicos embebidos. El aumento en la cantidad y complejidad de dichos subsistemas electrónicos así como su cometido, hacen de su seguridad una cuestión de creciente importancia. Tanto es así que la comercialización de estos sistemas críticos está sujeta a rigurosos procesos de certificación donde se garantiza la seguridad del sistema mediante estrictas restricciones en el proceso de desarrollo y diseño de su hardware y software. Esta tesis trata de abordar los nuevos retos y dificultades dadas por la introducción de procesadores multi-núcleo en dichos sistemas críticos: aunque su mayor rendimiento despierta el interés de la industria para integrar múltiples aplicaciones en una sola plataforma, suponen una mayor complejidad. Su arquitectura desafía su análisis temporal mediante los métodos tradicionales y, asimismo, su certificación es cada vez más compleja y costosa. Con el fin de lidiar con estas limitaciones, recientemente se ha desarrollado una novedosa técnica de análisis temporal probabilístico basado en medidas (MBPTA). La innovación de esta técnica, sin embargo, supone un gran cambio cultural respecto a los estándares y procedimientos tradicionales de certificación. En esta línea, las contribuciones de esta tesis están agrupadas en tres ejes principales: (i) definición de argumentos de seguridad para la certificación de aplicaciones de criticidad-mixta sobre plataformas multi-núcleo. Se definen, en particular, mecanismos de seguridad, técnicas de diagnóstico y reacción de faltas acorde con el estándar IEC 61508 sobre una arquitectura multi-núcleo de referencia. Respecto al análisis temporal, (ii) presentamos la cuantificación de la probabilidad de exceder un límite temporal y su relación con los requisitos de reducción de riesgos derivados de los estándares de seguridad funcional. Con este fin, nos basamos en la técnica MBPTA y presentamos el diseño de una fuente de números aleatorios segura; un componente clave para conseguir las propiedades aleatorias requeridas por MBPTA a nivel de plataforma. Por último, (iii) extrapolamos las guías actuales para la certificación de arquitecturas multi-núcleo a una solución comercial de 8 núcleos y las evaluamos con respecto a las tendencias emergentes de diseño de alto rendimiento (caches). Con estas contribuciones, esta tesis trata de abordar los retos que el uso de procesadores multi-núcleo y MBPTA implican en el proceso de certificación de sistemas críticos de tiempo real y facilita, de esta forma, su adopción por la industria.Postprint (published version

ARCHITECTING EMERGING MEMORY TECHNOLOGIES FOR ENERGY-EFFICIENT COMPUTING IN MODERN PROCESSORS

Ph.DDOCTOR OF PHILOSOPH

Reliable Low-Power High Performance Spintronic Memories

Moores Gesetz folgend, ist es der Chipindustrie in den letzten fünf Jahrzehnten gelungen, ein explosionsartiges Wachstum zu erreichen. Dies hatte ebenso einen exponentiellen Anstieg der Nachfrage von Speicherkomponenten zur Folge, was wiederum zu speicherlastigen Chips in den heutigen Computersystemen führt. Allerdings stellen traditionelle on-Chip Speichertech- nologien wie Static Random Access Memories (SRAMs), Dynamic Random Access Memories (DRAMs) und Flip-Flops eine Herausforderung in Bezug auf Skalierbarkeit, Verlustleistung und Zuverlässigkeit dar. Eben jene Herausforderungen und die überwältigende Nachfrage nach höherer Performanz und Integrationsdichte des on-Chip Speichers motivieren Forscher, nach neuen nichtflüchtigen Speichertechnologien zu suchen. Aufkommende spintronische Spe- ichertechnologien wie Spin Orbit Torque (SOT) und Spin Transfer Torque (STT) erhielten in den letzten Jahren eine hohe Aufmerksamkeit, da sie eine Reihe an Vorteilen bieten. Dazu gehören Nichtflüchtigkeit, Skalierbarkeit, hohe Beständigkeit, CMOS Kompatibilität und Unan- fälligkeit gegenüber Soft-Errors. In der Spintronik repräsentiert der Spin eines Elektrons dessen Information. Das Datum wird durch die Höhe des Widerstandes gespeichert, welche sich durch das Anlegen eines polarisierten Stroms an das Speichermedium verändern lässt. Das Prob- lem der statischen Leistung gehen die Speichergeräte sowohl durch deren verlustleistungsfreie Eigenschaft, als auch durch ihr Standard- Aus/Sofort-Ein Verhalten an. Nichtsdestotrotz sind noch andere Probleme, wie die hohe Zugriffslatenz und die Energieaufnahme zu lösen, bevor sie eine verbreitete Anwendung finden können. Um diesen Problemen gerecht zu werden, sind neue Computerparadigmen, -architekturen und -entwurfsphilosophien notwendig. Die hohe Zugriffslatenz der Spintroniktechnologie ist auf eine vergleichsweise lange Schalt- dauer zurückzuführen, welche die von konventionellem SRAM übersteigt. Des Weiteren ist auf Grund des stochastischen Schaltvorgangs der Speicherzelle und des Einflusses der Prozessvari- ation ein nicht zu vernachlässigender Zeitraum dafür erforderlich. In diesem Zeitraum wird ein konstanter Schreibstrom durch die Bitzelle geleitet, um den Schaltvorgang zu gewährleisten. Dieser Vorgang verursacht eine hohe Energieaufnahme. Für die Leseoperation wird gleicher- maßen ein beachtliches Zeitfenster benötigt, ebenfalls bedingt durch den Einfluss der Prozess- variation. Dem gegenüber stehen diverse Zuverlässigkeitsprobleme. Dazu gehören unter An- derem die Leseintereferenz und andere Degenerationspobleme, wie das des Time Dependent Di- electric Breakdowns (TDDB). Diese Zuverlässigkeitsprobleme sind wiederum auf die benötigten längeren Schaltzeiten zurückzuführen, welche in der Folge auch einen über längere Zeit an- liegenden Lese- bzw. Schreibstrom implizieren. Es ist daher notwendig, sowohl die Energie, als auch die Latenz zur Steigerung der Zuverlässigkeit zu reduzieren, um daraus einen potenziellen Kandidaten für ein on-Chip Speichersystem zu machen. In dieser Dissertation werden wir Entwurfsstrategien vorstellen, welche das Ziel verfolgen, die Herausforderungen des Cache-, Register- und Flip-Flop-Entwurfs anzugehen. Dies erre- ichen wir unter Zuhilfenahme eines Cross-Layer Ansatzes. Für Caches entwickelten wir ver- schiedene Ansätze auf Schaltkreisebene, welche sowohl auf der Speicherarchitekturebene, als auch auf der Systemebene in Bezug auf Energieaufnahme, Performanzsteigerung und Zuver- lässigkeitverbesserung evaluiert werden. Wir entwickeln eine Selbstabschalttechnik, sowohl für die Lese-, als auch die Schreiboperation von Caches. Diese ist in der Lage, den Abschluss der entsprechenden Operation dynamisch zu ermitteln. Nachdem der Abschluss erkannt wurde, wird die Lese- bzw. Schreiboperation sofort gestoppt, um Energie zu sparen. Zusätzlich limitiert die Selbstabschalttechnik die Dauer des Stromflusses durch die Speicherzelle, was wiederum das Auftreten von TDDB und Leseinterferenz bei Schreib- bzw. Leseoperationen re- duziert. Zur Verbesserung der Schreiblatenz heben wir den Schreibstrom an der Bitzelle an, um den magnetischen Schaltprozess zu beschleunigen. Um registerbankspezifische Anforderungen zu berücksichtigen, haben wir zusätzlich eine Multiport-Speicherarchitektur entworfen, welche eine einzigartige Eigenschaft der SOT-Zelle ausnutzt, um simultan Lese- und Schreiboperatio- nen auszuführen. Es ist daher möglich Lese/Schreib- Konfilkte auf Bitzellen-Ebene zu lösen, was sich wiederum in einer sehr viel einfacheren Multiport- Registerbankarchitektur nieder- schlägt. Zusätzlich zu den Speicheransätzen haben wir ebenfalls zwei Flip-Flop-Architekturen vorgestellt. Die erste ist eine nichtflüchtige non-Shadow Flip-Flop-Architektur, welche die Speicherzelle als aktive Komponente nutzt. Dies ermöglicht das sofortige An- und Ausschalten der Versorgungss- pannung und ist daher besonders gut für aggressives Powergating geeignet. Alles in Allem zeigt der vorgestellte Flip-Flop-Entwurf eine ähnliche Timing-Charakteristik wie die konventioneller CMOS Flip-Flops auf. Jedoch erlaubt er zur selben Zeit eine signifikante Reduktion der statis- chen Leistungsaufnahme im Vergleich zu nichtflüchtigen Shadow- Flip-Flops. Die zweite ist eine fehlertolerante Flip-Flop-Architektur, welche sich unanfällig gegenüber diversen Defekten und Fehlern verhält. Die Leistungsfähigkeit aller vorgestellten Techniken wird durch ausführliche Simulationen auf Schaltkreisebene verdeutlicht, welche weiter durch detaillierte Evaluationen auf Systemebene untermauert werden. Im Allgemeinen konnten wir verschiedene Techniken en- twickeln, die erhebliche Verbesserungen in Bezug auf Performanz, Energie und Zuverlässigkeit von spintronischen on-Chip Speichern, wie Caches, Register und Flip-Flops erreichen

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu