Very-Large-Scale-Integration Circuit Techniques in Internet-of-Things Applications

Heading towards the era of Internet-of-things (IoT) means both opportunity and challenge for the circuit-design community. In a system where billions of devices are equipped with the ability to sense, compute, communicate with each other and perform tasks in a coordinated manner, security and power management are among the most critical challenges. Physically unclonable function (PUF) emerges as an important security primitive in hardware-security applications; it provides an object-specific physical identifier hidden within the intrinsic device variations, which is hard to expose and reproduce by adversaries. Yet, designing a compact PUF robust to noise, temperature and voltage remains a challenge. This thesis presents a novel PUF design approach based on a pair of ultra-compact analog circuits whose output is proportional to absolute temperature. The proposed approach is demonstrated through two works: (1) an ultra-compact and robust PUF based on voltage-compensated proportional-to-absolute-temperature voltage generators that occupies 8.3× less area than the previous work with the similar robustness and twice the robustness of the previously most compact PUF design and (2) a technique to transform a 6T-SRAM array into a robust analog PUF with minimal overhead. In this work, similar circuit topology is used to transform a preexisting on-chip SRAM into a PUF, which further reduces the area in (1) with no robustness penalty. In this thesis, we also explore techniques for power management circuit design. Energy harvesting is an essential functionality in an IoT sensor node, where battery replacement is cost-prohibitive or impractical. Yet, existing energy-harvesting power management units (EH PMU) suffer from efficiency loss in the two-step voltage conversion: harvester-to-battery and battery-to-load. We propose an EH PMU architecture with hybrid energy storage, where a capacitor is introduced in addition to the battery to serve as an intermediate energy buffer to minimize the battery involvement in the system energy flow. Test-case measurements show as much as a 2.2× improvement in the end-to-end energy efficiency. In contrast, with the drastically reduced power consumption of IoT nodes that operates in the sub-threshold regime, adaptive dynamic voltage scaling (DVS) for supply-voltage margin removal, fully on-chip integration and high power conversion efficiency (PCE) are required in PMU designs. We present a PMU–load co-design based on a fully integrated switched-capacitor DC-DC converter (SC-DC) and hybrid error/replica-based regulation for a fully digital PMU control. The PMU is integrated with a neural spike processor (NSP) that achieves a record-low power consumption of 0.61 µW for 96 channels. A tunable replica circuit is added to assist the error regulation and prevent loss of regulation. With automatic energy-robustness co-optimization, the PMU can set the SC-DC’s optimal conversion ratio and switching frequency. The PMU achieves a PCE of 77.7% (72.2%) at VIN = 0.6 V (1 V) and at the NSP’s margin-free operating point

Cross-Layer Optimization for Power-Efficient and Robust Digital Circuits and Systems

With the increasing digital services demand, performance and power-efficiency become vital requirements for digital circuits and systems. However, the enabling CMOS technology scaling has been facing significant challenges of device uncertainties, such as process, voltage, and temperature variations. To ensure system reliability, worst-case corner assumptions are usually made in each design level. However, the over-pessimistic worst-case margin leads to unnecessary power waste and performance loss as high as 2.2x. Since optimizations are traditionally confined to each specific level, those safe margins can hardly be properly exploited. To tackle the challenge, it is therefore advised in this Ph.D. thesis to perform a cross-layer optimization for digital signal processing circuits and systems, to achieve a global balance of power consumption and output quality. To conclude, the traditional over-pessimistic worst-case approach leads to huge power waste. In contrast, the adaptive voltage scaling approach saves power (25% for the CORDIC application) by providing a just-needed supply voltage. The power saving is maximized (46% for CORDIC) when a more aggressive voltage over-scaling scheme is applied. These sparsely occurred circuit errors produced by aggressive voltage over-scaling are mitigated by higher level error resilient designs. For functions like FFT and CORDIC, smart error mitigation schemes were proposed to enhance reliability (soft-errors and timing-errors, respectively). Applications like Massive MIMO systems are robust against lower level errors, thanks to the intrinsically redundant antennas. This property makes it applicable to embrace digital hardware that trades quality for power savings.Comment: 190 page

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Methods to improve the reliability and resiliency of near/sub-threshold digital circuits

Energy consumption is one of the primary bottlenecks to both large and small scale modern compute platforms. Reducing the operating voltage of digital circuits to voltages where the supply voltage is near or below the threshold of the transistors has recently gained attention as a method to reduce the energy required for computations by as much as 6 times. However, when operating at near/sub-threshold voltages (where the supply voltage is near or below the threshold of the transistors), imperfections in transistor manufacturing, changes in temperature, and other difficult-to-predict factors cause wide variations in the timing of Complementary Metal-Oxide Semiconductor (CMOS) circuits due to an increased sensitivity at lower voltages. These increased variations result in poor aggregate performance and cause increased rates of error occurrence in computation. This work introduces several new methods to improve the reliability of near/sub-threshold circuits. The first is a design automation technique that is used to aid in low-voltage digital standard cell synthesis. Second, two circuit-level techniques are also introduced that aim to improve the reliability and resiliency of digital circuits by means of completion/error detection. These techniques are shown to improve speed and lower energy consumption at low overheads compared to previous methods. Most importantly, these circuit-level methods are specifically designed to operate at low voltages and can themselves tolerate variations and operation in harsh environments. Finally, a test-chip prototype designed in 65nm-CMOS demonstrates the practicality and feasibility of a proposed current sensing error detector

Voltage drop tolerance by adaptive voltage scaling using clock-data compensation

Proyecto de Graduación (Maestría en Ingeniería en Electrónica) Instituto Tecnológico de Costa Rica, Escuela de Ingeniería Electrónica, 2019.El ruido de alta frecuencia en la red de alimentación compromete el rendimiento y la eficiencia energética de los sistemas electrónicos con microprocesadores, restringiendo la frecuencia máxima de operación de los sistemas y disminuyendo la confiabilidad de los dispositivos. La frecuencia máxima será determinada por la ruta de datos más crítica (la ruta de datos más lenta). De esta manera, es necesario configurar una banda de guarda para tolerar caídas de voltaje sin tener ningún problema de ejecución, pero sacrificando el rendimiento eléctrico. Este trabajo evalúa el impacto de la caída de voltaje en el rendimiento de los circuitos CMOS de alta densidad, estableciendo un conjunto de casos de prueba que contienen diferentes configuraciones de circuitos. Se desarrolló una técnica adaptable y escalable para mejorar la tolerancia a la caída de voltaje en los circuitos CMOS a través del escalado adaptativo, aprovechando el efecto de compensación de datos del reloj. La solución propuesta se validó aplicándola a diferentes casos de prueba en una tecnología FinFet-CMOS a nivel de simulación del diseño físico.High-frequency power supply noise compromises performance and energy efficiency of microprocessor-based products, restricting the maximum frequency of operation for electronic systems and decreasing device reliability. The maximum frequency is going to be determine by the most critical data path (the slowest data path). In this way, a guard band needs to be set in order to tolerate voltage drops without having any execution problem, but leading to a performance reduction. This work evaluates the impact of voltage drop in the performance of CMOS circuits by establishing a set of test cases containing different circuit configurations. An adaptive and scalable technique is proposed to enhance voltage drop tolerance in CMOS circuits through adaptive scaling, taking advantage of the clock-data compensation effect. The proposed solution is validated by applying it to different test cases in a FinFet CMOS technology at a post-layout simulation level