Compact CMOS Current Conveyor for Integrated NEMS Resonators

Peer reviewe

A Compact and Low-Power CMOS Circuit for Fully-Integrated NEMS Resonators

Peer reviewe

Enhancement of an indium phosphide resonator sensor microsystem through the development of an adaptive feedback circuit and electrospray deposition

Cantilever resonator sensor enhancement through the development of an adaptive feedback circuit and the use of electrospray deposition is presented. The feedback system adapts to a wide range of resonators by implementing a hill climbing algorithm, locking onto the cantilever's resonance condition. Eight different cantilever-based sensors (Length=40-75μm), resonating at 201.0kHz to 592.1kHz, with a minimum standard deviation of 11.8Hz, corresponding to a mass resolution limit of 123fg for the device, have been dynamically detected using a single circuit. Electrospray deposition of thin-films on multiple substrate materials and released microstructures has been performed. An average deposition rate of 9.5±5nm/min was achieved with an average surface roughness of 4.5nm on a 197nm thick film. This technology will enable a post-processing method for depositing absorbing layers for sensing applications. With the development of these two technologies, the practical functionality of a chip-scale sensor microsystem will be more readily realized

Integrated Microsystems for Wireless Sensing Applications

Personal health monitoring is being considered the future of a sustainable health care system. Biosensing platforms are a very important component of this system. Real-time and accurate sensing is essential for the success of personal health care model. Currently, there are many efforts going on to make these sensors practical and more useful for such measurements. Implantable sensors are considered the most widely applicable and most reliable sensors for such accurate health monitoring applications. However, macroscopic (cm scale) size has proved to be a limiting factor for successful use of these systems for long time and in large numbers. This work is focused to resolve the issues related with miniaturizing these devices to a microscopic (mm scale) size scale which can minimize many practical difficulties associated with their larger counterparts currently. To accomplish this goal of miniaturization while retaining or even improving on the necessary capabilities for such sensing platforms, an integrated approach is presented which focuses on system-level miniaturization using standard fabrication procedures. First, it is shown that a completely integrated and wireless system is the best solution to achieve desired miniaturization without sacrificing the functionality of the system. Hence, design and implementation of the different components comprising the complete system needs to be done according to the requirements of the overall integrated system. This leads to the need of on-chip functional sensors, integrated wireless power supply, integrated wireless communication and integrated control system for realization of such system. In this work, different options for implementation of each of these subsystems are compared and an optimal solution is presented for each subsystem. For such complex systems, it is imperative to use a standard fabrication process which can provide the required functionality for all subsystems at smallest possible size scale. Complementary Metal Oxide Semiconductor (CMOS) process is the most appropriate of the technologies in this regard and has enabled incredible miniaturization of the computing industry. It also provides options for designing different subsystems on the same platform in a monolithic process with very high yield. This choice then leads to actual designs of subsystems in the CMOS technology using different possible methods. Careful comparison of these subsystems provides insights into different design adjustments that are made until the desired functions are achieved at the desired size scale. Integration of all these compatible subsystems in the same platform is shown to provide the smallest possible sensing platform to date. The completely wireless system can measure a host of different important analyte and can transmit the data to an external device which can use it for appropriate purpose. Results on measurements in phosphate buffer solution, blood serum and whole blood along with wireless communication in real biological tissues are provided. Specific examples of glucose and DNA sensors are presented and the use for many other relevant applications is also proposed. Finally, insights into animal model studies and future directions of the research are discussed. </p

EUROSENSORS XVII : book of abstracts

Fundação Calouste Gulbenkien (FCG).Fundação para a Ciência e a Tecnologia (FCT)

Semi-automatic liquid filling system using NodeMCU as an integrated Iot Learning tool

Computer programming and IoT are the key skills required in Industrial Revolution 4.0 (IR4.0). The industry demand is very high and therefore related students in this field should grasp adequate knowledge and skill in college or university prior to employment. However, learning technology related subject without applying it to an actual hardware can pose difficulty to relate the theoretical knowledge to problems in real application. It is proven that learning through hands-on activities is more effective and promotes deeper understanding of the subject matter (He et al. in Integrating Internet of Things (IoT) into STEM undergraduate education: Case study of a modern technology infused courseware for embedded system course. Erie, PA, USA, pp 1–9 (2016)). Thus, to fulfill the learning requirement, an integrated learning tool that combines learning of computer programming and IoT control for an industrial liquid filling system model is developed and tested. The integrated learning tool uses NodeMCU, Blynk app and smartphone to enable the IoT application. The system set-up is pre-designed for semi-automation liquid filling process to enhance hands-on learning experience but can be easily programmed for full automation. Overall, it is a user and cost friendly learning tool that can be developed by academic staff to aid learning of IoT and computer programming in related education levels and field

Compact CMOS current conveyor for integrated NEMS resonators

A fully integrated nanoelectromechanical system (NEMS) resonator together with a compact built-in complementary metal-oxide-semiconductor (CMOS) interfacing circuitry is presented. The proposed low-power second generation current conveyor circuit allows measuring the mechanical frequency response of the nanocantilever structure in the megahertz range. Detailed experimental results at different DC biasing conditions and pressure levels are presented for a real mixed electromechanical system integrated through a combination of in-house standard CMOS technology and nanodevice post-processing based on nanostencil lithography. The proposed readout circuit can be adapted to operate the nanocantilever in closed loop as a stand-alone oscillator

Proceedings of the 2018 Canadian Society for Mechanical Engineering (CSME) International Congress

Published proceedings of the 2018 Canadian Society for Mechanical Engineering (CSME) International Congress, hosted by York University, 27-30 May 2018