Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.Includes bibliographical references (p. 84-87).Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power dissipation, along with an improved form factor and portability. One of the most recent novel and promising wafer bonding approaches to realizing 3DIC is Low Temperature Thermocompression (LTTC) bonding using copper (Cu) as the bonding interface material. This thesis investigates the LTTC bonding approach in terms of its technological implications in contrast to other conventional bonding approaches. The various technological aspects pertaining to LTTC are comprehensively explored and analyzed. In addition to this, the commercialization potential for this technology is also studied and the economic viability of this process in production is critically evaluated using suitable cost models. Based on the technological and economic outlook, the potential for commercialization of LTTC is gauged.by Raghavan Nagarajan.M.Eng

Enabling Capillary Self-Assembly for Microsystem Integration

Efficient and precise assembly of very-large quantities of sub-millimeter-sized devices onto pre-processed substrates is presently a key frontier for microelectronics, in its aspiration to large-scale mass production of devices with new functionalities and applications (e.g. thin dies embedded into flexible substrates, 3D microsystem integration). In this perspective, on the one hand established pick&place assembly techniques may be unsuitable, due to a trade-off between throughput and placement accuracy and to difficulties in predictably handling very-small devices. On the other hand, self-assembly processes are massively parallel, may run unsupervised and allow contactless manipulation of objects. The convergence between robotic assembly and self-assembly, epitomized by capillarity-enhanced flip-chip assembly, can therefore enable an ideal technology meeting short-to-medium-term electronic packaging and assembly needs. The objective of this thesis is bridging the gap between academic proofs-of- concept of capillary self-assembly and its industrial application. Our work solves several issues relevant to capillary self-assembly of thin dies onto preprocessed substrates. Very-different phenomena and aspects of both scientific and technological interest coexist in such a broad context. They were tackled both experimentally and theoretically. After a critical review of the state-of-the-art in microsystem integration, a complete quasi-static study of lateral capillary meniscus forces is presented. Our experimental setup enables also a novel method to measure the contact angle of liquids. Recessed binding sites are introduced to obtain perfectly-conformal fluid dip-coating of patterned surfaces, which enables the effective and robust coding of geometrical information into binding sites to direct the assembly of parts. A general procedure to establish solder-mediated electro-mechanical interconnections between parts and substrate is validated. Smart surface chemistries are invoked to solve the issue of mutual adhesion between parts during the capillary self-assembly process. Two chemical kinetic-inspired analytic models of fluidic self-assembly are presented and criticized to introduce a novel agent-based model of the process. The latter approach allows realistic simulations by taking into account spatial factors and collision dynamics. Concluding speculations propose envisioned solutions to residual open issues and further perspectives for this field of rapidly-growing importance

Liquid cooled micro-scale gradient system for magnetic resonance

Schaltbare magnetische Feldgradientspulen sind ein geeignetes Werkzeug für die Modulation der Kernspinpräzession in der gepulsten Kernspinresonanzspektroskopie und Bildgebung. Die Magnetresonanztomographie von mikroskopischen Proben benötigt starke, schnell schaltbare Magnetfeldgradienten, um diffusionsbedingte Artefakte zu unterdrücken, Suszeptibilitätseffekte abzuschwächen und um die Messzeit zu verkürzen. Verschiedene Techniken können eingesetzt werden, um eine hohe Gradientenintensität zu erreichen, wie zum Beispiel die Erhöhung der Stromstärke oder die Steigerung der Windungsdichte der Feldspule. Ein weiterer, geeigneter technischer Ansatz besteht darin, die Gradientenspulen näher an der Probe zu platzieren. Als Konsequenz wird aber die durch die Joule-Erwärmung verursachte Wärmeentwicklung zu einem zentralen Problem. In dieser Arbeit wird ein neuartiges Design, ein Mikroherstellungsprozess und eine Kernspin-Evaluierung eines Feldgradientenchips präsentiert. Die Gradientenspulen wurden besonders hoch miniaturisiert und durch den Einsatz von verbesserten und neuartigen Strukturierungsverfahren entwickelt. Zuerst wird ein Fertigungsverfahren zur Herstellung einer kompakten Hochfrequenzspule vorgestellt. Durch den Einsatz einer maskenlosen Rückseitenlithographie konnte die Prozesskomplexität reduziert werden. Dieses Verfahren wurde durch Tintenstrahldruck mit Nanopartikeln realisiert, wobei die gedruckten Strukturen selbst als lithographische Maske für die Herstellung einer galvanischen Form dienen. Somit werden die Seitenwände der galvanischen Form durch die gedruckte Seed-Schicht optimal selbst ausgerichtet. Dies ermöglichte eine anisotrope Galvanisierung, um eine höhere elektrische Leitfähigkeit der gedruckten Leiterbahnen zu erzielen. Aus den Erkenntnissen der ausgearbeiteten Herstellungsprozesse wurde ein optimiertes Spulendesign für ein-axiale sowie drei-axiale linearen Gradientenchips entwickelt. Die einachsige lineare $z$-Gradientenspule wurde mit der Stream-Function-Methode berechnet, wobei die Optimierung darauf abgestimmt wurde, eine minimale Verlustleistung zu erzielen. Die Gradientenspulen wurden auf zwei Doppellagen implementiert, die mittels Cu-Galvanik in Kombination mit fotodefinierbaren Trockenfilm-Laminaten aufgebracht wurden. Bei dem hier vorgestellten Herstellungsverfahren diente die erste Metallisierungschicht gleichzeitig dazu, Widerstands-Temperaturdetektoren zu integrieren. Um niederohmige Spulen zu realisieren wurde der Galvanisierungsprozess soweit angepasst, um eine hohe Schichtdicke zu erzielen. Die Chipstruktur beinhaltet ein aktives Kühlsystem, um dem Aufheizen der Spulen entgegenzuwirken. Thermographische Aufnahmen in Kombination mit den eingebetteten Temperatursensoren ermöglichen es, die Erhitzung der Spule zu analysieren, um die Strombelastbarkeit zu ermitteln. Die Gradientenspule wurde mit einer Hochfrequenz-Mikrospule in einer Flip-Chip-Konfiguration zusammengebaut, und mit diesem Aufbau wurde ein eindimensionales Kernspinexperiment durchgeführt. Es wurde eine Gradienteneffizienz von 3.15 $T\,m^{−1}\,A^{−1}$ bei einer Profillänge von 1.2 $mm$ erreicht

Self-Assembly from Milli- to Nanoscales: Methods and Applications

The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final packaging step is often necessary to integrate all components of a heterogeneous microsystem on a common substrate. Robotic pick-and-place, although accurate and reliable at larger scales, is a serial process that downscales unfavorably due to stiction problems, fragility and sheer number of components. Self-assembly, on the other hand, is parallel and can be used for device sizes ranging from millimeters to nanometers. In this review, the state-of-the-art in methods and applications for self-assembly is reviewed. Methods for assembling three-dimensional (3D) MEMS structures out of two-dimensional (2D) ones are described. The use of capillary forces for folding 2D plates into 3D structures, as well as assembling parts onto a common substrate or aggregating parts to each other into 2D or 3D structures, is discussed. Shape matching and guided assembly by magnetic forces and electric fields are also reviewed. Finally, colloidal self-assembly and DNA-based self-assembly, mainly used at the nanoscale, are surveyed, and aspects of theoretical modeling of stochastic assembly processes are discussed

Development of Advanced Nanomanufacturing: 3D Integration and High Speed Directed Self-assembly

Development of nanoscience and nanotechnology requires rapid and robust nanomanufacturing processes to produce nanoscale materials, structures and devices. The dissertation aims to contribute to two major challenging and attractive topics in nanomanufacturing. Firstly, this research develops fabrication techniques for three dimensional (3D) structures and integrates them into functional devices and systems. Secondly, a novel process is proposed and studied for rapid and efficient manipulation of nanomaterials using a directed self-assembly process. The study begins with the development of nanoimprint lithography for nanopatterning and fabrication of 3D multilayer polymeric structures in the micro- and nano-scale, by optimizing the layer-transfer and transfer-bonding techniques. These techniques allow the integration of microfluidic and photonic systems in a single chip for achieving ultracompact lab-on-a-chip concept. To exemplify the integration capability, a monolithic fluorescence detection system is proposed and the approaches to design and fabricate the components, such as a tunable optical filter and optical antennas are addressed. The nanoimprint lithography can also be employed to prepare nanopatterned polymer structures as a template to guide the self-assembly process of nanomaterials, such as single-walled carbon nanotubes (SWNTs). By introducing the surface functionalization, electric field and ultrasonic agitation into the process, we develop a rapid and robust approach for effective placement and alignment of SWNTs. These nanomanufacturing processes are successfully developed and will provide a pathway to the full realization of the lab-on-a-chip concept and significantly contribute to the applications of nanomaterials

Scalable processing and integration of 2D materials and devices

Due to its truly two dimensional (2D) character and its particular lattice, single layer graphene (SLG) possesses exceptional properties: it is semimetallic, transparent, strong yet flexible... Complementary features such as the insulating character of hexagonal boron nitride (h-BN) and semiconducting properties of transition metal dichalcogenides (TMDs) enable the whole spectrum of electronic devices to be built with combinations of these 2D materials. Due to this and the ease of exfoliation with a sticky tape, a vast amount of research was sparked. The mechanical exfoliation method, however, is only suitable for novel or proof-of-concept devices. The trend nowadays in electronics is towards transparent, lightweight, flexible, embedded smart devices and sensors in everyday objects such as windows and mirrors, garments, windshields, car seats, parachutes...These demands are already met inherently by these new materials, thus the challenges remaining are within their synthesis, deposition and processing, where more scalable ways of production and device fabrication need to be developed. This thesis explores innovative approaches using established techniques that aim to bridge the gap between proof-of-concept devices and real applications of 2D materials in future commercial level technologies. Methods to create graphene and engineer its properties are employed with a special focus on scalability and adaptability towards the industry. These graphene materials have been processed using pioneering schemes to create different optoelectronic devices and sensors. The techniques employed here for synthesis, transfer and deposition, device processing and characterization of graphene and derivatives, are suitable for their use in large manufacturing and mass-production. Depending on the application envisaged, different materials are used and optimize in order to balance good performance, cost-effectiveness and suitability/scalability of the process for the specific target the device was designed for

Atomic-Scale Insights into Light Emitting Diode

In solid-state lightning, GaN-based vertical LED technology has attracted tremendous attention because its luminous efficacy has surpassed the traditional lightning technologies, even the 2014 Nobel Prize in Physics was awarded for the invention of efficient blue LEDs, which enabled eco-friendly and energy-saving white lighting sources. Despite today’s GaN-based blue VLEDs can produce IQE of 90% and EQE of 70-80%, still there exist a major challenge of efficiency droop. Nonetheless, state-of-the-art material characterization and failure analysis tools are inevitable to address that issue. In this context, although LEDs have been characterized by different microscopy techniques, they are still limited to either its semiconductor or active layer, which mainly contributes towards the IQE. This is also one of the reason that today’s LEDs IQE exceeded above 80% but EQE of 70-80% remains. Therefore, to scrutinize the efficiency droop issue, this work focused on developing a novel strategy to investigate key layers of the LED structure, which play the critical role in enhancing the EQE = IQE x LEE factors. Based on that strategy, wafer bonding, reflection, GaN-Ag interface, MQWs and top-textured layers have been systematically investigated under the powerful advanced microscopy techniques of SEM-based TKD/EDX/EBSD, AC-STEM, AFM, Raman spectroscopy, XRD, and PL. Further, based on these correlative microscopy results, optimization suggestions are given for performance enhancement in the LEDs. The objective of this doctoral research is to perform atomic-scale characterization on the VLED layers/interfaces to scrutinize their surface topography, grain morphology, chemical composition, interfacial diffusion, atomic structure and carrier localization mechanism in quest of efficiency droop and reliability issues. The outcome of this research advances in understanding LED device physics, which will facilitate standardization in its design for better smart optoelectronics products

Glioma on Chips Analysis of glioma cell guidance and interaction in microfluidic-controlled microenvironment enabled by machine learning

In biosystems, chemical and physical fields established by gradients guide cell migration, which is a fundamental phenomenon underlying physiological and pathophysiological processes such as development, morphogenesis, wound healing, and cancer metastasis. Cells in the supportive tissue of the brain, glia, are electrically stimulated by the local field potentials from neuronal activities. How the electric field may influence glial cells is yet fully understood. Furthermore, the cancer of glia, glioma, is not only the most common type of brain cancer, but the high-grade form of it (glioblastoma) is particularly aggressive with cells migrating into the surrounding tissues (infiltration) and contribute to poor prognosis. In this thesis, I investigate how electric fields in the microenvironment can affect the migration of glioblastoma cells using a versatile microsystem I have developed. I employ a hybrid microfluidic design to combine poly(methylmethacrylate) (PMMA) and poly(dimethylsiloxane) (PDMS), two of the most common materials for microfluidic fabrication. The advantages of the two materials can be complemented while disadvantages can be mitigated. The hybrid microfluidics have advantages such as versatile 3D layouts in PMMA, high dimensional accuracy in PDMS, and rapid prototype turnaround by facile bonding between PMMA and PDMS using a dual-energy double sided tape. To accurately analyze label-free cell migration, a machine learning software, Usiigaci, is developed to automatically segment, track, and analyze single cell movement and morphological changes under phase contrast microscopy. The hybrid microfluidic chip is then used to study the migration of glioblastoma cell models, T98G and U-251MG, in electric field (electrotaxis). The influence of extracellular matrix and chemical ligands on glioblastoma electrotaxis are investigated. I further test if voltage-gated calcium channels are involved in glioblastoma electrotaxis. The electrotaxes of glioblastoma cells are found to require optimal laminin extracellular matrices and depend on different types of voltage-gated calcium channels, voltage-gated potassium channels, and sodium transporters. A reversiblysealed hybrid microfluidic chip is developed to study how electric field and laminar shear can condition confluent endothelial cells and if the biomimetic conditions affect glioma cell adhesion to them. It is found that glioma/endothelial adhesion is mediated by the Ang1/Tie2 signaling axis and adhesion of glioma is slightly increased to endothelial cells conditioned with shear flow and moderate electric field. In conclusion, robust and versatile hybrid microsystems are employed for studying glioma biology with emphasis on cell migration. The hybrid microfluidic tools can enable us to elucidate fundamental mechanisms in the field of the tumor biology and regenerative medicine.Okinawa Institute of Science and Technology Graduate Universit