Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

Interconnect optimizations for nanometer VLSI design

textAs the semiconductor technology scales into deeper sub-micron domain, billions of transistors can be used on a single system-on-chip (SOC) makes interconnection optimization more important roughly for two reasons. First, congestion, power, timing in routing and buffering requirements make inter- connection optimization more and more challenging. Second, gate delay get- ting shorter while the RC delay gets longer due to scaling. Study of interconnection construction and optimization algorithms in real industry flows and designs ends up with interesting findings. One used to be overlooked but very important and practical problem is how to utilize over- the-block routing resources intelligently. Routing over large IP blocks needs special attention as there is almost no way to insert buffers inside hard IP blocks, which can lead to unsolvable slew/timing violations. In current design flows we have seen, the routing resources over the IP blocks were either dealt as routing blockages leading to a significant waste, or simply treated in the same way as outside-the-block routing resources, which would violate the slew constraints and thus fail buffering. To handle that, this work proposes a novel buffering-aware over-the- block rectilinear Steiner minimum tree (BOB-RSMT) algorithm which helps reclaim the “wasted” over-the-block routing resources while meeting user-specified slew constraints. Proposed algorithm incrementally and efficiently migrates initial tree structures with buffering-awareness to meet slew constraints while minimizing wire-length. Moreover, due to the fact that timing optimization is important for the VLSI design, in this work, timing-driven over-the-block rectilinear Steiner tree (TOB-RST) is also studied to optimize critical paths. This proposed TOB-RST algorithm can be used in routing or post-routing stage to provide high-quality topologies to help close timing. Then a follow-up problem emerges: how to accomplish the whole routing with over-the-block routing resources used properly. Utilizing over-the- block routing resources could dramatically improve the routing solution, yet require special attention, since the slew, affected by different RC on different metal layers, must be constrained by buffering and is easily violated. Moreover, even of all nets are slew-legalized, the routing solution could still suffer from heavy congestion problem. A new global router, BOB-Router, is to solve the over-the-block global routing problem through minimizing overflows, wire-length and via count simultaneously without violating slew constraints. Based on my completed works, BOB-RSMT and BOB-Router tremendously improve the overall routing and buffering quality. Experimental results show that proposed over-the-block rectilinear Steiner tree construction and routing completely satisfies the slew constraints and significantly outperforms the obstacle-avoiding rectilinear Steiner tree construction and routing in terms of wire-length, via count and overflows.Electrical and Computer Engineerin

The edge-disjoint path problem on random graphs by message-passing

We present a message-passing algorithm to solve the edge disjoint path problem (EDP) on graphs incorporating under a unique framework both traffic optimization and path length minimization. The min-sum equations for this problem present an exponential computational cost in the number of paths. To overcome this obstacle we propose an efficient implementation by mapping the equations onto a weighted combinatorial matching problem over an auxiliary graph. We perform extensive numerical simulations on random graphs of various types to test the performance both in terms of path length minimization and maximization of the number of accommodated paths. In addition, we test the performance on benchmark instances on various graphs by comparison with state-of-the-art algorithms and results found in the literature. Our message-passing algorithm always outperforms the others in terms of the number of accommodated paths when considering non trivial instances (otherwise it gives the same trivial results). Remarkably, the largest improvement in performance with respect to the other methods employed is found in the case of benchmarks with meshes, where the validity hypothesis behind message-passing is expected to worsen. In these cases, even though the exact message-passing equations do not converge, by introducing a reinforcement parameter to force convergence towards a sub optimal solution, we were able to always outperform the other algorithms with a peak of 27% performance improvement in terms of accommodated paths. On random graphs, we numerically observe two separated regimes: one in which all paths can be accommodated and one in which this is not possible. We also investigate the behaviour of both the number of paths to be accommodated and their minimum total length.Comment: 14 pages, 8 figure

Using ant colony optimization for routing in microprocesors

Power consumption is an important constraint on VLSI systems. With the advancement in technology, it is now possible to pack a large range of functionalities into VLSI devices. Hence it is important to find out ways to utilize these functionalities with optimized power consumption. This work focuses on curbing power consumption at the design stage. This work emphasizes minimizing active power consumption by minimizing the load capacitance of the chip. Capacitance of wires and vias can be minimized using Ant Colony Optimization (ACO) algorithms. ACO provides a multi agent framework for combinatorial optimization problems and hence is used to handle multiple constraints of minimizing wire-length and vias to achieve the goal of minimizing capacitance and hence power consumption. The ACO developed here is able to achieve an 8% reduction of wire-length and 7% reduction in vias thereby providing a 7% reduction in total capacitance, compared to other state of the art routers

Graphics Processing Unit-Based Computer-Aided Design Algorithms for Electronic Design Automation

The electronic design automation (EDA) tools are a specific set of software that play important roles in modern integrated circuit (IC) design. These software automate the design processes of IC with various stages. Among these stages, two important EDA design tools are the focus of this research: floorplanning and global routing. Specifically, the goal of this study is to parallelize these two tools such that their execution time can be significantly shortened on modern multi-core and graphics processing unit (GPU) architectures. The GPU hardware is a massively parallel architecture, enabling thousands of independent threads to execute concurrently. Although a small set of EDA tools can benefit from using GPU to accelerate their speed, most algorithms in this field are designed with the single-core paradigm in mind. The floorplanning and global routing algorithms are among the latter, and difficult to render any speedup on the GPU due to their inherent sequential nature. This work parallelizes the floorplanning and global routing algorithm through a novel approach and results in significant speedups for both tools implemented on the GPU hardware. Specifically, with a complete overhaul of solution space and design space exploration, a GPU-based floorplanning algorithm is able to render 4-166X speedup, while achieving similar or improved solutions compared with the sequential algorithm. The GPU-based global routing algorithm is shown to achieve significant speedup against existing state-of-the-art routers, while delivering competitive solution quality. Importantly, this parallel model for global routing renders a stable solution that is independent from the level of parallelism. In summary, this research has shown that through a design paradigm overhaul, sequential algorithms can also benefit from the massively parallel architecture. The findings of this study have a positive impact on the efficiency and design quality of modern EDA design flow

Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits

The main objective of this research is to predict the wirelength, area, delay, and power of multi-granularity three-dimensional integrated circuits (3D ICs), to develop physical design methodologies and algorithms for the design of multi-granularity 3D ICs, and to investigate the impact of through-silicon vias (TSVs) on the quality of 3D ICs. This dissertation supports these objectives by addressing six research topics. The first pertains to analytical models that predict the interconnects of multi-granularity 3D ICs, and the second focuses on the development of analytical models of the capacitive coupling of TSVs. The third and the fourth topics present design methodologies and algorithms for the design of gate- and block-level 3D ICs, and the fifth topic pertains to the impact of TSVs on the quality of 3D ICs. The final topic addresses topography variation in 3D ICs. The first section of this dissertation presents TSV-aware interconnect prediction models for multi-granularity 3D ICs. As previous interconnect prediction models for 3D ICs did not take TSV area into account, they were not capable of predicting many important characteristics of 3D ICs related to TSVs. This section will present several previous interconnect prediction models that have been improved so that the area occupied by TSVs is taken into account. The new models show numerous important predictions such as the existence of the number of TSVs minimizing wirelength. The second section presents fast estimation of capacitive coupling of TSVs and wires. Since TSV-to-TSV and TSV-to-wire coupling capacitance is dependent on their relative locations, fast estimation of the coupling capacitance of a TSV is essential for the timing optimization of 3D ICs. Simulation results show that the analytical models presented in this section are sufficiently accurate for use at various design steps that require the computation of TSV capacitance. The third and fourth sections present design methodologies and algorithms for gate- and block-level 3D ICs. One of the biggest differences in the design of 2D and 3D ICs is that the latter requires TSV insertion. Since no widely-accepted design methodology designates when, where, and how TSVs are inserted, this work develops and presents several design methodologies for gate- and block-level 3D ICs and physical design algorithms supporting them. Simulation results based on GDSII-level layouts validate the design methodologies and present evidence of their effectiveness. The fifth section explores the impact of TSVs on the quality of 3D ICs. As TSVs become smaller, devices are shrinking, too. Since the relative size of TSVs and devices is more critical to the quality of 3D ICs than the absolute size of TSVs and devices, TSVs and devices should be taken into account in the study of the impact of TSVs on the quality of 3D ICs. In this section, current and future TSVs and devices are combined to produce 3D IC layouts and the impact of TSVs on the quality of 3D ICs is investigated. The final section investigates topography variation in 3D ICs. Since landing pads fabricated in the bottommost metal layer are attached to TSVs, they are larger than TSVs, so they could result in serious topography variation. Therefore, topography variation, especially in the bottommost metal layer, is investigated and two layout optimization techniques are applied to a global placement algorithm that minimizes the topography variation of the bottommost metal layer of 3D ICs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Mukhopadhyay, Saiba

Shortest Paths and Steiner Trees in VLSI Routing

Routing is one of the major steps in very-large-scale integration (VLSI) design. Its task is to find disjoint wire connections between sets of points on a chip, subject to numerous constraints. This problem is solved in a two-stage approach, which consists of so-called global and detailed routing steps. For each set of metal components to be connected, global routing reduces the search space by computing corridors in which detailed routing sequentially determines the desired connections as shortest paths. In this thesis, we present new theoretical results on Steiner trees and shortest paths, the two main mathematical concepts in routing. In the practical part, we give computational results of BonnRoute, a VLSI routing tool developed at the Research Institute for Discrete Mathematics at the University of Bonn. Interconnect signal delays are becoming increasingly important in modern chip designs. Therefore, the length of paths or direct delay measures should be taken into account when constructing rectilinear Steiner trees. We consider the problem of finding a rectilinear Steiner minimum tree (RSMT) that --- as a secondary objective --- minimizes a signal delay related objective. Given a source we derive some structural properties of RSMTs for which the weighted sum of path lengths from the source to the other terminals is minimized. Also, we present an exact algorithm for constructing RSMTs with weighted sum of path lengths as secondary objective, and a heuristic for various secondary objectives. Computational results for industrial designs are presented. We further consider the problem of finding a shortest rectilinear Steiner tree in the plane in the presence of rectilinear obstacles. The Steiner tree is allowed to run over obstacles; however, if it intersects an obstacle, then no connected component of the induced subtree must be longer than a given fixed length. This kind of length restriction is motivated by its application in VLSI routing where a large Steiner tree requires the insertion of repeaters which must not be placed on top of obstacles. We show that there are optimal length-restricted Steiner trees with a special structure. In particular, we prove that a certain graph (called augmented Hanan grid) always contains an optimal solution. Based on this structural result, we give an approximation scheme for the special case that all obstacles are of rectangular shape or are represented by at most a constant number of edges. Turning to the shortest paths problem, we present a new generic framework for Dijkstra's algorithm for finding shortest paths in digraphs with non-negative integral edge lengths. Instead of labeling individual vertices, we label subgraphs which partition the given graph. Much better running times can be achieved if the number of involved subgraphs is small compared to the order of the original graph and the shortest path problems restricted to these subgraphs is computationally easy. As an application we consider the VLSI routing problem, where we need to find millions of shortest paths in partial grid graphs with billions of vertices. Here, the algorithm can be applied twice, once in a coarse abstraction (where the labeled subgraphs are rectangles), and once in a detailed model (where the labeled subgraphs are intervals). Using the result of the first algorithm to speed up the second one via goal-oriented techniques leads to considerably reduced running time. We illustrate this with the routing program BonnRoute on leading-edge industrial chips. Finally, we present computational results of BonnRoute obtained on real-world VLSI chips. BonnRoute fulfills all requirements of modern VLSI routing and has been used by IBM and its customers over many years to produce more than one thousand different chips. To demonstrate the strength of BonnRoute as a state-of-the-art industrial routing tool, we show that it performs excellently on all traditional quality measures such as wire length and number of vias, but also on further criteria of equal importance in the every-day work of the designer