Design automation and analysis of three-dimensional integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.Includes bibliographical references (p. 165-176).This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration. By stacking individual components, dice, or whole wafers using a high-density electromechanical interconnect, three-dimensional integration can achieve scalability and performance exceeding that of conventional fabrication technologies. There are two main contributions of this thesis. The first is a computer-aided design flow for the digital components of a three-dimensional integrated circuit (3-D IC). This flow primarily consists of two software tools: PR3D, a placement and routing tool for custom 3-D ICs based on standard cells, and 3-D Magic, a tool for designing, editing, and testing physical layout characteristics of 3-D ICs. The second contribution of this thesis is a performance analysis of the digital components of 3-D ICs. We use the above tools to determine the extent to which 3-D integration can improve timing, energy, and thermal performance. In doing so, we verify the estimates of stochastic computational models for 3-D IC interconnects and find that the models predict the optimal 3-D wire length to within 20% accuracy. We expand upon this analysis by examining how 3-D technology factors affect the optimal wire length that can be obtained. Our ultimate analysis extends this work by directly considering timing and energy in 3-D ICs. In all cases we find that significant performance improvements are possible. In contrast, thermal performance is expected to worsen with the use of 3-D integration. We examine precisely how thermal behavior scales in 3-D integration and determine quantitatively how the temperature may be controlled during the circuit placement process. We also show how advanced packaging(cont.) technologies may be leveraged to maintain acceptable die temperatures in 3-D ICs. Finally, we explore two issues for the future of 3-D integration. We determine how technology scaling impacts the effect of 3-D integration on circuit performance. We also consider how to improve the performance of digital components in a mixed-signal 3-D integrated circuit. We conclude with a look towards future 3-D IC design tools.by Shamik Das.Ph.D

Compiling and optimizing spreadsheets for FPGA and multicore execution

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007."September 2007."Includes bibliographical references (p. 102-104).A major barrier to developing systems on multicore and FPGA chips is an easy-to-use development environment. This thesis presents the RhoZeta spreadsheet compiler and Catalyst optimization system for programming multiprocessors and FPGAs. Any spreadsheet frontend may be extended to work with RhoZeta's multiple interpreters and behavioral abstraction mechanisms. RhoZeta synchronizes a variety of cell interpreters acting on a global memory space. RhoZeta can also compile a group of cells to multithreaded C or Verilog. The result is an easy-to-use interface for programming multicore microprocessors and FPGAs. A spreadsheet environment presents parallelism and locality issues of modem hardware directly to the user and allows for a simple global memory synchronization model. Catalyst is a spreadsheet graph rewriting system based on performing behaviorally invariant guarded atomic actions while a system is being interpreted by RhoZeta. A number of optimization macros were developed to perform speculation, resource sharing and propagation of static assignments through a circuit. Parallelization of a 64-bit serial leading-zero-counter is demonstrated with Catalyst. Fault tolerance macros were also developed in Catalyst to protect against dynamic faults and to offset costs associated with testing semiconductors for static defects. A model for partitioning, placing and profiling spreadsheet execution in a heterogeneous hardware environment is also discussed. The RhoZeta system has been used to design several multithreaded and FPGA applications including a RISC emulator and a MIDI controlled modular synthesizer.by Amir Hirsch.M.Eng

Predicting power scalability in a reconfigurable platform

This thesis focuses on the evolution of digital hardware systems. A reconfigurable platform is proposed and analysed based on thin-body, fully-depleted silicon-on-insulator Schottky-barrier transistors with metal gates and silicide source/drain (TBFDSBSOI). These offer the potential for simplified processing that will allow them to reach ultimate nanoscale gate dimensions. Technology CAD was used to show that the threshold voltage in TBFDSBSOI devices will be controllable by gate potentials that scale down with the channel dimensions while remaining within appropriate gate reliability limits. SPICE simulations determined that the magnitude of the threshold shift predicted by TCAD software would be sufficient to control the logic configuration of a simple, regular array of these TBFDSBSOI transistors as well as to constrain its overall subthreshold power growth. Using these devices, a reconfigurable platform is proposed based on a regular 6-input, 6-output NOR LUT block in which the logic and configuration functions of the array are mapped onto separate gates of the double-gate device. A new analytic model of the relationship between power (P), area (A) and performance (T) has been developed based on a simple VLSI complexity metric of the form ATσ = constant. As σ defines the performance “return” gained as a result of an increase in area, it also represents a bound on the architectural options available in power-scalable digital systems. This analytic model was used to determine that simple computing functions mapped to the reconfigurable platform will exhibit continuous power-area-performance scaling behavior. A number of simple arithmetic circuits were mapped to the array and their delay and subthreshold leakage analysed over a representative range of supply and threshold voltages, thus determining a worse-case range for the device/circuit-level parameters of the model. Finally, an architectural simulation was built in VHDL-AMS. The frequency scaling described by σ, combined with the device/circuit-level parameters predicts the overall power and performance scaling of parallel architectures mapped to the array

The deep space network

Progress is reported in flight project support, tracking and data acquisition research and technology, network engineering, hardware and software implementation, and operations. The functions and facilities of the Deep Space Network are emphasized

Thermal aware design techniques for multiprocessor architectures in three dimensions

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 28-11-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Manufacturing of three dimensional integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.Includes bibliographical references (p. 221-231).Along with scaling down in size, novel materials have been introduced into the semiconductor industry to enable continued improvements in performance and cost as predicted by Moore's law. It has become important now more than ever to include an environmental impact evaluation of future technologies, before they are introduced into manufacturing, in order to identify potentially environmentally harmful materials or processes and understand their implications, costs, and mitigation requirements. In this thesis, we introduce a methodology to compare alternative options on the environmental axis, along with the cost and performance axes, in order to create environmentally aware and benign technologies. This methodology also helps to identify potential performance and cost issues in novel technologies by taking a transparent and bottoms-up assessment approach. This methodology is applied to the evaluation of the MIT 3D IC technology in comparison to a standard CMOS 2D IC approach. Both options are compared on all three axes - performance, cost and environmental impact.(cont.) The "handle wafer" unit process in the existing 3D IC technology, which is a crucial process for back-to-face integration, is found to have a large environmental impact because of its use of thick metal sacrificial layers and high energy consumption. We explore three different handle wafer options, between-die channel, oxide release layer, and alternative low-temperature permanent bonding. The first two approaches use a chemical handle wafer release mechanism; while the third explores solid liquid inter-diffusion (SLID) bonding using copper-indium at 2000C. Preliminary results for copper-indium bonding indicate that a sub-micron thick multi-layer copper-indium stack, when bonded to a 300 nm thick copper film results in large voids in the bonding interface primarily due to rough as-deposited films. Finally, we conduct an overall assessment of these and other proposed handle wafer technologies. The overall assessment shows that but the oxide release layer approach appears promising; however, each process option has its strength and weaknesses, which need to be understood and pursued accordingly.by Ajay Somani.Ph.D

Photoluminescene properties of silicon nanocrystallites

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.Includes bibliographical references.by Arun A. Seraphin.Ph.D