A design flow for performance planning : new paradigms for iteration free synthesis

In conventional design, higher levels of synthesis produce a netlist, from which layout synthesis builds a mask specification for manufacturing. Timing anal ysis is built into a feedback loop to detect timing violations which are then used to update specifications to synthesis. Such iteration is undesirable, and for very high performance designs, infeasible. The problem is likely to become much worse with future generations of technology. To achieve a non-iterative design flow, early synthesis stages should use wire planning to distribute delays over the functional elements and interconnect, and layout synthesis should use its degrees of freedom to realize those delays

Layer assignment and routing optimization for advanced technologies

As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to achieve timing closure for VLSI design. Since a complete design flow consists of several phases, such as logic synthesis, placement, and routing, interconnect synthesis plays an important role which includes buffer insertion/sizing and timing-driven routing. Although progress has been achieved by many advanced routing techniques, the following aspects can be exploited sufficiently for further improvement: (1) incremental layer assignment for timing optimization; (2) signal routing with the requirement of regularity; (3) power-efficient optical-electrical interconnect paradigm. Thus, to perform the layer assignment and routing optimization for advanced technologies, an automated routing engine in a global view is essential to benefit the interconnect design while satisfying specific requirements. This dissertation proposes a set of algorithms and methodology on layer assignment and routing optimization for advanced technologies. The research includes two timing-driven incremental layer assignment approaches, synergistic topology generation and routing synthesis for signal groups, and optical-electrical routing design for power efficiency. For incremental layer assignment, most of the conventional approaches target via minimization but neglect the timing issues. Meanwhile, via delays are ignored but should be considered in emerging technology nodes. Then two timing-driven incremental layer assignment frameworks are proposed, where all the nets are solved simultaneously with the integration of via delays: (1) optimization of the total sum of net delays and reduction of slew violations; (2) minimization of critical path timing in selected nets. For on-chip signal routing, the bundled bits in one group may have different pin locations, but they have to be routed in a regular manner by sharing common topologies. Very few previous works target inter-bit regularity via multi-layer topology selection. Furthermore, the routability and wire-length of the signal bits should also be optimized. Then an advanced synergistic routing engine is promoted, which is able to not only control routability and wire-length but also guide each bit routing intelligently for design regularity. For optical-electrical co-design routing, optical interconnect shows its advantage due to the dominance of bandwidth-distance-power properties. The previous works lack a detailed exploration of optical-electrical co-design for on-chip interconnects. During the transmission, signal quality can be affected by various loss sources and Electrical to Optical (EO)/Optical to Electrical (OE) conversion overheads should also be considered. Then a power-efficient routing flow for on-chip signals is presented, where optical connections can collaborate with electrical wires seamlessly. The effectiveness of proposed algorithms and techniques is demonstrated in this dissertation. These approaches are able to achieve the improvements regarding specific metrics and eventually benefit the routing flow.Electrical and Computer Engineerin

A Solder-Defined Computer Architecture for Backdoor and Malware Resistance

This research is about securing control of those devices we most depend on for integrity and confidentiality. An emerging concern is that complex integrated circuits may be subject to exploitable defects or backdoors, and measures for inspection and audit of these chips are neither supported nor scalable. One approach for providing a “supply chain firewall” may be to forgo such components, and instead to build central processing units (CPUs) and other complex logic from simple, generic parts. This work investigates the capability and speed ceiling when open-source hardware methodologies are fused with maker-scale assembly tools and visible-scale final inspection. The author has designed, and demonstrated in simulation, a 36-bit CPU and protected memory subsystem that use only synchronous static random access memory (SRAM) and trivial glue logic integrated circuits as components. The design presently lacks preemptive multitasking, ability to load firmware into the SRAMs used as logic elements, and input/output. Strategies are presented for adding these missing subsystems, again using only SRAM and trivial glue logic. A load-store architecture is employed with four clock cycles per instruction. Simulations indicate that a clock speed of at least 64 MHz is probable, corresponding to 16 million instructions per second (16 MIPS), despite the architecture containing no microprocessors, field programmable gate arrays, programmable logic devices, application specific integrated circuits, or other purchased complex logic. The lower speed, larger size, higher power consumption, and higher cost of an “SRAM minicomputer,” compared to traditional microcontrollers, may be offset by the fully open architecture—hardware and firmware—along with more rigorous user control, reliability, transparency, and auditability of the system. SRAM logic is also particularly well suited for building arithmetic logic units, and can implement complex operations such as population count, a hash function for associative arrays, or a pseudorandom number generator with good statistical properties in as few as eight clock cycles per 36-bit word processed. 36-bit unsigned multiplication can be implemented in software in 47 instructions or fewer (188 clock cycles). A general theory is developed for fast SRAM parallel multipliers should they be needed

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Complex VLSI Feature Comparison for Commercial Microelectronics Verification

Shortcomings in IC verification make for glaring vulnerabilities in the form of hardware backdoors, or extraneous operation modes that allow unauthorized, undetected access. The DARPA TRUST program addressed the need for verification of untrusted circuits using industry-standard and custom software. The process developed under TRUST and implemented at the AFRL Mixed Signal Design Center has not been tested using real-world circuits outside of the designated TRUST test cases. This research demonstrates the potential of applying software designed for TRUST test articles on microchips from questionable sources. A specific process is developed for both transistor-level library cell verification and gate-level circuit verification. The relative effectiveness and scalability of the process are assessed

Energy Efficient VLSI Circuits for MIMO-WLAN

Mobile communication - anytime, anywhere access to data and communication services - has been continuously increasing since the operation of the first wireless communication link by Guglielmo Marconi. The demand for higher data rates, despite the limited bandwidth, led to the development of multiple-input multiple-output (MIMO) communication which is often combined with orthogonal frequency division multiplexing (OFDM). Together, these two techniques achieve a high bandwidth efficiency. Unfortunately, techniques such as MIMO-OFDM significantly increase the signal processing complexity of transceivers. While fast improvements in the integrated circuit (IC) technology enabled to implement more signal processing complexity per chip, large efforts had and have to be done for novel algorithms as well as for efficient very large scaled integration (VLSI) architectures in order to meet today's and tomorrow's requirements for mobile wireless communication systems. In this thesis, we will present architectures and VLSI implementations of complete physical (PHY) layer application specific integrated circuits (ASICs) under the constraints imposed by an industrial wireless communication standard. Contrary to many other publications, we do not elaborate individual components of a MIMO-OFDM communication system stand-alone, but in the context of the complete PHY layer ASIC. We will investigate the performance of several MIMO detectors and the corresponding preprocessing circuits, being integrated into the entire PHY layer ASIC, in terms of achievable error-rate, power consumption, and area requirement. Finally, we will assemble the results from the proposed PHY layer implementations in order to enhance the energy efficiency of a transceiver. To this end, we propose a cross-layer optimization of PHY layer and medium access control (MAC) layer

A study on hardware design for high performance artificial neural network by using FPGA and NoC

制度:新 ; 報告番号:甲3421号 ; 学位の種類:博士(工学) ; 授与年月日:2011/9/15 ; 早大学位記番号:新574

Federal Register

Daily publication of the U.S. Office of the Federal Register contains rules and regulations, proposed legislation and rule changes, and other notices, including "Presidential proclamations and Executive Orders, Federal agency documents having general applicability and legal effect, documents required to be published by act of Congress, and other Federal agency documents of public interest" (p. ii). Table of Contents starts on page iii

Regulations to Respond to the Potential Benefits and Perils of SelfDriving Cars Analysis and Recommendations for Advancing Equity and Environmental Sustainability

The mobility system in the United States is unsafe, inequitable, and environmentally destructive. Most Americans rely on personally owned, individually occupied, and gas-powered cars—a status quo that leads to tens of thousands of people dying each year in collisions, creates barriers to employment and other opportunities for people of color and people with low incomes, and maintains a resource intensive transportation system that contributes to climate change and spurs sprawling land uses that destroy ecologies. Autonomous vehicles (AVs)—self-driving cars that can travel along publicly accessible streets some or all of the time without human involvement—could help mitigate these problems, if they are implemented in a thoughtful, well-regulated manner. However, if deployed haphazardly with inadequate oversight and regulation, they could produce even worse inequities than those caused by the current system.To evaluate the current landscape for AV deployment and use in the United States, we conducted a study focusing on automobile-sized AVs designed for passenger use as opposed to other types of AVs that could be used for public transit service or freight. Through a scholarship review, a scan of legislation nationwide, and interviews with stakeholders, we examine key potential benefits that AVs could generate, as well as the problems they could exacerbate. Carefully designed regulations could help ensure that these new technologies improve access to mobility and reduce pollution