Course grained low power design flow using UPF

Increased system complexity has led to the substitution of the traditional bottom-up design flow by systematic hierarchical design flow. The main motivation behind the evolution of such an approach is the increasing difficulty in hardware realization of complex systems. With decreasing channel lengths, few key problems such as timing closure, design sign-off, routing complexity, signal integrity, and power dissipation arise in the design flows. Specifically, minimizing power dissipation is critical in several high-end processors. In high-end processors, the design complexity contributes to the overall dynamic power while the decreasing transistor size results in static power dissipation. This research aims at optimizing the design flow for power and timing using the unified power format (UPF). UPF provides a strategic format to specify power-aware design information at every stage in the flow. The low power reduction techniques enforced in this research are multi-voltage, multi-threshold voltage (Vth), and power gating with state retention. An inherent design challenge addressed in this research is the choice of power optimization techniques as the flow advances from synthesis to physical design. A top-down digital design flow for a 32 bit MIPS RISC processor has been implemented with and without UPF synthesis flow for 65nm technology. The UPF synthesis is implemented with two voltages, 1.08V and 0.864V (Multi-VDD). Area, power and timing metrics are analyzed for the flows developed. Power savings of about 20 % are achieved in the design flow with \u27multi-threshold\u27 power technique compared to that of the design flow with no low power techniques employed. Similarly, 30 % power savings are achieved in the design flow with the UPF implemented when compared to that of the design flow with \u27multi-threshold\u27 power technique employed. Thus, a cumulative power savings of 42% has been achieved in a complete power efficient design flow (UPF) compared to that of the generic top-down standard flow with no power saving techniques employed. This is substantiated by the low voltage operation of modules in the design, reduction in clock switching power by gating clocks in the design and extensive use of HVT and LVT standard cells for implementation. The UPF synthesis flow saw the worst timing slack and more area when compared to those of the `multi-threshold\u27 or the generic flow. Percentage increase in the area with UPF is approximately 15%; a significant source for this increase being the additional power controlling logic added

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Layer assignment and routing optimization for advanced technologies

As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to achieve timing closure for VLSI design. Since a complete design flow consists of several phases, such as logic synthesis, placement, and routing, interconnect synthesis plays an important role which includes buffer insertion/sizing and timing-driven routing. Although progress has been achieved by many advanced routing techniques, the following aspects can be exploited sufficiently for further improvement: (1) incremental layer assignment for timing optimization; (2) signal routing with the requirement of regularity; (3) power-efficient optical-electrical interconnect paradigm. Thus, to perform the layer assignment and routing optimization for advanced technologies, an automated routing engine in a global view is essential to benefit the interconnect design while satisfying specific requirements. This dissertation proposes a set of algorithms and methodology on layer assignment and routing optimization for advanced technologies. The research includes two timing-driven incremental layer assignment approaches, synergistic topology generation and routing synthesis for signal groups, and optical-electrical routing design for power efficiency. For incremental layer assignment, most of the conventional approaches target via minimization but neglect the timing issues. Meanwhile, via delays are ignored but should be considered in emerging technology nodes. Then two timing-driven incremental layer assignment frameworks are proposed, where all the nets are solved simultaneously with the integration of via delays: (1) optimization of the total sum of net delays and reduction of slew violations; (2) minimization of critical path timing in selected nets. For on-chip signal routing, the bundled bits in one group may have different pin locations, but they have to be routed in a regular manner by sharing common topologies. Very few previous works target inter-bit regularity via multi-layer topology selection. Furthermore, the routability and wire-length of the signal bits should also be optimized. Then an advanced synergistic routing engine is promoted, which is able to not only control routability and wire-length but also guide each bit routing intelligently for design regularity. For optical-electrical co-design routing, optical interconnect shows its advantage due to the dominance of bandwidth-distance-power properties. The previous works lack a detailed exploration of optical-electrical co-design for on-chip interconnects. During the transmission, signal quality can be affected by various loss sources and Electrical to Optical (EO)/Optical to Electrical (OE) conversion overheads should also be considered. Then a power-efficient routing flow for on-chip signals is presented, where optical connections can collaborate with electrical wires seamlessly. The effectiveness of proposed algorithms and techniques is demonstrated in this dissertation. These approaches are able to achieve the improvements regarding specific metrics and eventually benefit the routing flow.Electrical and Computer Engineerin

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

A framework for fine-grain synthesis optimization of operational amplifiers

This thesis presents a cell-level framework for Operational Amplifiers Synthesis (OASYN) coupling both circuit design and layout. For circuit design, the tool applies a corner-driven optimization, accounting for on-chip performance variations. By exploring the process, voltage, and temperature variations space, the tool extracts design worst case solution. The tool undergoes sensitivity analysis along with Pareto-optimality to achieve required specifications. For layout phase, OASYN generates a DRC proved automated layout based on a sized circuit-level description. Morata et al. (1996) introduced an elegant representation of block placement called sequence pair for general floorplans (SP). Like TCG and BSG, but unlike O-tree, B*tree, and CBL, SP is P-admissible. Unlike SP, TCG supports incremental update during operation and keeps the information of the boundary modules as well as their relative positions in the representation. Block placement algorithms that are based on SP use heuristic optimization algorithms, e.g., simulated annealing where generation of large number of sequence pairs are required. Therefore a fast algorithm is needed to generate sequence pairs after each solution perturbation. The thesis presents a new simple and efficient O(n) runtime algorithm for fast realization of incremental update for cost evaluation. The algorithm integrates sequence pair and transitive closure graph advantages into TCG-S* a superior topology update scheme which facilitates the search for optimum desired floorplan. Experiments show that TCG-S* is better than existing works in terms of area utilization and convergence speed. Routing-aware placement is implemented in OASYN, handling symmetry constraints, e.g., interdigitization, common centroid, along with congestion elimination and the enhancement of placement routability

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

A Physical Implementation with Custom Low Power Extensions of a Reconfigurable Hardware Fabric

The primary focus of this thesis is on the physical implementation of the SuperCISC Reconfigurable Hardware Fabric (RHF). The SuperCISC RHF provides a fast time to market solution that approximates the benefits of an ASIC (Application Specific Integrated Circuit) while retaining the design flow of an embedded software system. The fabric which consists of computational ALU stripes and configurable multiplexer based interconnect stripes has been implemented in the IBM 0.13um CMOS process using Cadence SoC Encounter. As the entire hardware fabric utilizes a combinational flow, glitching power consumption is a potential problem inherent to the fabric. A CMOS thyristor based programmable delay element has been designed in the IBM 0.13um CMOS process, to minimize the glitch power consumed in the hardware fabric. The delay element was characterized for use in the IBM standard cell library to synthesize standard cell ASIC designs requiring this capability such as the SuperCISC fabric. The thesis also introduces a power-gated memory solution, which can be used to increase the size of an EEPROM memory for use in SoC style applications. A macromodel of the EEPROM has been used to model the erase, program and read characteristics of the EEPROM. This memory is designed for use in the fabric for storing encryption keys, etc

Methodology and Ecosystem for the Design of a Complex Network ASIC

Performance of HPC systems has risen steadily. While the 10 Petaflop/s barrier has been breached in the year 2011 the next large step into the exascale era is expected sometime between the years 2018 and 2020. The EXTOLL project will be an integral part in this venture. Originally designed as a research project on FPGA basis it will make the transition to an ASIC to improve its already excelling performance even further. This transition poses many challenges that will be presented in this thesis. Nowadays, it is not enough to look only at single components in a system. EXTOLL is part of complex ecosystem which must be optimized overall since everything is tightly interwoven and disregarding some aspects can cause the whole system either to work with limited performance or even to fail. This thesis examines four different aspects in the design hierarchy and proposes efficient solutions or improvements for each of them. At first it takes a look at the design implementation and the differences between FPGA and ASIC design. It introduces a methodology to equip all on-chip memory with ECC logic automatically without the user’s input and in a transparent way so that the underlying code that uses the memory does not have to be changed. In the next step the floorplanning process is analyzed and an iterative solution is worked out based on physical and logical constraints of the EXTOLL design. Besides, a work flow for collaborative design is presented that allows multiple users to work on the design concurrently. The third part concentrates on the high-speed signal path from the chip to the connector and how it is affected by technological limitations. All constraints are analyzed and a package layout for the EXTOLL chip is proposed that is seen as the optimal solution. The last part develops a cost model for wafer and package level test and raises technological concerns that will affect the testing methodology. In order to run testing internally it proposes the development of a stand-alone test platform that is able to test packaged EXTOLL chips in every aspect