Performance and power optimization in VLSI physical design

As VLSI technology enters the nanoscale regime, a great amount of efforts have been made to reduce interconnect delay. Among them, buffer insertion stands out as an effective technique for timing optimization. A dramatic rise in on-chip buffer density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates are buffers. In this thesis, three buffer insertion algorithms are presented for the procedure of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under the dynamic programming framework and runs in provably linear time for multiple buffer types due to two novel techniques: restrictive cost bucketing and efficient delay update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter time and the buffered tree has better timing. The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce via variation and signal distortion in twisted differential line. In addition, a new buffer insertion technique is proposed to synchronize the transmitted signals, thus further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new approaches. In contrast, only a 100MHz signal can be reliably transmitted using a single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45% as witnessed in our simulation. The fourth chapter proposes a buffer insertion and gate sizing algorithm for million plus gates. The algorithm takes a combinational circuit as input instead of individual nets and greatly reduces the buffer and gate cost of the entire circuit. The algorithm has two main features: 1) A circuit partition technique based on the criticality of the primary inputs, which provides the scalability for the algorithm, and 2) A linear programming formulation of non-linear delay versus cost tradeoff, which formulates the simultaneous buffer insertion and gate sizing into linear programming problem. Experimental results on ISCAS85 circuits show that even without the circuit partition technique, the new algorithm achieves 17X speedup compared with path based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9% gate cost, 5.8% total cost and results in less circuit delay

Performance and power optimization in VLSI physical design

As VLSI technology enters the nanoscale regime, a great amount of efforts have been made to reduce interconnect delay. Among them, buffer insertion stands out as an effective technique for timing optimization. A dramatic rise in on-chip buffer density has been witnessed. For example, in two recent IBM ASIC designs, 25% gates are buffers. In this thesis, three buffer insertion algorithms are presented for the procedure of performance and power optimization. The second chapter focuses on improving circuit performance under inductance effect. The new algorithm works under the dynamic programming framework and runs in provably linear time for multiple buffer types due to two novel techniques: restrictive cost bucketing and efficient delay update. The experimental results demonstrate that our linear time algorithm consistently outperforms all known RLC buffering algorithms in terms of both solution quality and runtime. That is, the new algorithm uses fewer buffers, runs in shorter time and the buffered tree has better timing. The third chapter presents a method to guarantee a high fidelity signal transmission in global bus. It proposes a new redundant via insertion technique to reduce via variation and signal distortion in twisted differential line. In addition, a new buffer insertion technique is proposed to synchronize the transmitted signals, thus further improving the effectiveness of the twisted differential line. Experimental results demonstrate a 6GHz signal can be transmitted with high fidelity using the new approaches. In contrast, only a 100MHz signal can be reliably transmitted using a single-end bus with power/ground shielding. Compared to conventional twisted differential line structure, our new techniques can reduce the magnitude of noise by 45% as witnessed in our simulation. The fourth chapter proposes a buffer insertion and gate sizing algorithm for million plus gates. The algorithm takes a combinational circuit as input instead of individual nets and greatly reduces the buffer and gate cost of the entire circuit. The algorithm has two main features: 1) A circuit partition technique based on the criticality of the primary inputs, which provides the scalability for the algorithm, and 2) A linear programming formulation of non-linear delay versus cost tradeoff, which formulates the simultaneous buffer insertion and gate sizing into linear programming problem. Experimental results on ISCAS85 circuits show that even without the circuit partition technique, the new algorithm achieves 17X speedup compared with path based algorithm. In the meantime, the new algorithm saves 16.0% buffer cost, 4.9% gate cost, 5.8% total cost and results in less circuit delay

Phase Synchronization in Railway Timetables

Timetable construction belongs to the most important optimization problems in public transport. Finding optimal or near-optimal timetables under the subsidiary conditions of minimizing travel times and other criteria is a targeted contribution to the functioning of public transport. In addition to efficiency (given, e.g., by minimal average travel times), a significant feature of a timetable is its robustness against delay propagation. Here we study the balance of efficiency and robustness in long-distance railway timetables (in particular the current long-distance railway timetable in Germany) from the perspective of synchronization, exploiting the fact that a major part of the trains run nearly periodically. We find that synchronization is highest at intermediate-sized stations. We argue that this synchronization perspective opens a new avenue towards an understanding of railway timetables by representing them as spatio-temporal phase patterns. Robustness and efficiency can then be viewed as properties of this phase pattern

Effects of buffer insertion on the average/peak power ratio in CMOS VLSI digital circuits

The buffer insertion has been a mechanism widely used to increase the performances of advanced VLSI digital circuits and systems. The driver or repeater used to this purpose has effect on the timing characteristics on the signal on the wire, as propagation delay, signal integrity, transition time, among others. The power concerns related to buffering have also received much attention, because of the low power requirements of modern integrated systems. In the same way, the buffer insertion has strong impact on the reliability of synchronous systems, since the suited distribution of clock requires reduced or controlled clock-skew, being the buffer and wire sizing, a crucial aspect. In a different way, buffer insertion has been also used to reduce noise generation, especially in heavily loaded nets, since the inclusion of buffers help to desynchronize signal transitions. However, the inclusion of buffers of inverters to improve one or more of these characteristics have often negative effect on another parameters, as it happens in the average and peak of supply current. Mainly, the inclusion of a buffer to reduce noise (peak power), via desynchronizing transitions, could introduce more dynamic consumption, but reducing the short-circuit current because of the increment of signal slope. Thus, the average/peak current optimization can be considered a design trade-off. In this paper, the mechanism to obtain an average/peak power optimization procedure are presented. Selected examples show the feasibility of minimizing switching noise with negligible impact on average power consumption.MEC TEC2004-01509 DOCJunta de Andalucía TIC2006-635 Project

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Design considerations for a monolithic, GaAs, dual-mode, QPSK/QASK, high-throughput rate transceiver

A monolithic, GaAs, dual mode, quadrature amplitude shift keying and quadrature phase shift keying transceiver with one and two billion bits per second data rate is being considered to achieve a low power, small and ultra high speed communication system for satellite as well as terrestrial purposes. Recent GaAs integrated circuit achievements are surveyed and their constituent device types are evaluated. Design considerations, on an elemental level, of the entire modem are further included for monolithic realization with practical fabrication techniques. Numerous device types, with practical monolithic compatability, are used in the design of functional blocks with sufficient performances for realization of the transceiver

Acoustic echo and noise canceller for personal hands-free video IP phone

This paper presents implementation and evaluation of a proposed acoustic echo and noise canceller (AENC) for videotelephony-enabled personal hands-free Internet protocol (IP) phones. This canceller has the following features: noise-robust performance, low processing delay, and low computational complexity. The AENC employs an adaptive digital filter (ADF) and noise reduction (NR) methods that can effectively eliminate undesired acoustic echo and background noise included in a microphone signal even in a noisy environment. The ADF method uses the step-size control approach according to the level of disturbance such as background noise; it can minimize the effect of disturbance in a noisy environment. The NR method estimates the noise level under an assumption that the noise amplitude spectrum is constant in a short period, which cannot be applied to the amplitude spectrum of speech. In addition, this paper presents the method for decreasing the computational complexity of the ADF process without increasing the processing delay to make the processing suitable for real-time implementation. The experimental results demonstrate that the proposed AENC suppresses echo and noise sufficiently in a noisy environment; thus, resulting in natural-sounding speech

56+ Gb/s serial transmission using duo-binary signaling

In this paper we present duobinary signaling as an alternative for signaling schemes like PAM4 and Ensemble NRZ that are currently being considered as ways to achieve data rates of 56 Gb/s over copper. At the system level, the design includes a custom transceiver ASIC. The transmitter is capable of equalizing 56 Gb/s non-return to zero (NRZ) signals into a duobinary response at the output of the channel. The receiver includes dedicated hardware to decode the duobinary signal. This transceiver is used to demonstrate error-free transmission for different PCB channel lengths including a state-of-the-art Megtron 6 backplane demonstrator

Microwave monolithic integrated circuit development for future spaceborne phased array antennas

The development of fully monolithic gallium arsenide (GaAs) receive and transmit modules suitable for phased array antenna applications in the 30/20 gigahertz bands is presented. Specifications and various design approaches to achieve the design goals are described. Initial design and performance of submodules and associated active and passive components are presented. A tradeoff study summary is presented highlighting the advantages of distributed amplifier approach compared to the conventional single power source designs