Oil and Gas flow Anomaly Detection on offshore naturally flowing wells using Deep Neural Networks

Dissertation presented as the partial requirement for obtaining a Master's degree in Data Science and Advanced Analytics, specialization in Data ScienceThe Oil and Gas industry, as never before, faces multiple challenges. It is being impugned for being dirty, a pollutant, and hence the more demand for green alternatives. Nevertheless, the world still has to rely heavily on hydrocarbons, since it is the most traditional and stable source of energy, as opposed to extensively promoted hydro, solar or wind power. Major operators are challenged to produce the oil more efficiently, to counteract the newly arising energy sources, with less of a climate footprint, more scrutinized expenditure, thus facing high skepticism regarding its future. It has to become greener, and hence to act in a manner not required previously. While most of the tools used by the Hydrocarbon E&P industry is expensive and has been used for many years, it is paramount for the industry’s survival and prosperity to apply predictive maintenance technologies, that would foresee potential failures, making production safer, lowering downtime, increasing productivity and diminishing maintenance costs. Many efforts were applied in order to define the most accurate and effective predictive methods, however data scarcity affects the speed and capacity for further experimentations. Whilst it would be highly beneficial for the industry to invest in Artificial Intelligence, this research aims at exploring, in depth, the subject of Anomaly Detection, using the open public data from Petrobras, that was developed by experts. For this research the Deep Learning Neural Networks, such as Recurrent Neural Networks with LSTM and GRU backbones, were implemented for multi-class classification of undesirable events on naturally flowing wells. Further, several hyperparameter optimization tools were explored, mainly focusing on Genetic Algorithms as being the most advanced methods for such kind of tasks. The research concluded with the best performing algorithm with 2 stacked GRU and the following vector of hyperparameters weights: [1, 47, 40, 14], which stand for timestep 1, number of hidden units 47, number of epochs 40 and batch size 14, producing F1 equal to 0.97%. As the world faces many issues, one of which is the detrimental effect of heavy industries to the environment and as result adverse global climate change, this project is an attempt to contribute to the field of applying Artificial Intelligence in the Oil and Gas industry, with the intention to make it more efficient, transparent and sustainable

Effects of Air Pollution, Temperature and Moisture Content on Copper and Silver Corrosions and the Reliability of Data Center Equipment

The effects of moisture content, temperature, and pollutant mixture on atmospheric corrosion of copper and silver were investigated by exposing test specimens to different environmental conditions, followed by surface characterization using the coulometric reduction, Scanning Electron Microscopy, and Energy Dispersive Spectrometry (SEM/EDS). Printed circuit board test cards (PCBs) with bare copper were also used to investigate the effects of voltage bias on the PCBs on the corrosion rate. The test specimens were exposed to mixed flowing gases (MFG) environment with eight different combinations of the following five pollutants at the fixed concentration levels: 60 ppb O3, 80 ppb NO2, 40 ppb SO2, 2 ppb Cl2, and 10 ppb H2S. Temperature and relative humidity (RH) were varied from a reference condition (21°C and 50% RH which is within the current ASHRAE-recommended thermal envelope) to a higher value (28°C, 70% RH, or 80% RH) to increase the moisture content of the test environment. Test results revealed the dominating effect of Cl2 on copper corrosion and that of H2S on silver corrosion. Increasing the moisture content at 21°C caused more severe corrosion of copper when Cl2 was present, but not for silver. When the temperature was increased from 21°C to 28°C at 50% RH, it reduced the corrosion of copper, but not for silver. Voltage-biased PCBs had less effect on corrosion than PCBs without the voltage bias. A mechanistic model based on the multi-ion transport and chemical reactions was also proposed to predict the corrosion of copper due to Cl2-containing pollutant mixtures. The model\u27s prediction of the effects of temperature and RH agreed well with the experimental results. These findings provided the basis for possible expansion of the ASHRAE-recommended thermal envelope for data centers when Cl2 and H2S are not present and limiting the thermal envelope when Cl2 or H2S is present. They also improved the understanding of the corrosion mechanisms for the copper when Cl2 is present in the data center environment

Effects Of Air Pollution, Temperature And Moisture Content On Copper And Silver Corrosions And The Reliability Of Data Center Equipment

The effects of moisture content, temperature, and pollutant mixture on atmospheric corrosion of copper and silver were investigated by exposing test specimens to different environmental conditions, followed by surface characterization using the coulometric reduction, Scanning Electron Microscopy, and Energy Dispersive Spectrometry (SEM/EDS). Printed circuit board test cards (PCBs) with bare copper were also used to investigate the effects of voltage bias on the PCBs on the corrosion rate. The test specimens were exposed to mixed flowing gases (MFG) environment with eight different combinations of the following five pollutants at the fixed concentration levels: 60 ppb O3, 80 ppb NO2, 40 ppb SO2, 2 ppb Cl2, and 10 ppb H2S. Temperature and relative humidity (RH) were varied from a reference condition (21°C and 50% RH which is within the current ASHRAE-recommended thermal envelope) to a higher value (28°C, 70% RH, or 80% RH) to increase the moisture content of the test environment. Test results revealed the dominating effect of Cl2 on copper corrosion and that of H2S on silver corrosion. Increasing the moisture content at 21°C caused more severe corrosion of copper when Cl2 was present, but not for silver. When the temperature was increased from 21°C to 28°C at 50% RH, it reduced the corrosion of copper, but not for silver. Voltage-biased PCBs had less effect on corrosion than PCBs without the voltage bias. A mechanistic model based on the multi-ion transport and chemical reactions was also proposed to predict the corrosion of copper due to Cl2-containing pollutant mixtures. The model’s prediction of the effects of temperature and RH agreed well with the experimental results. These findings provided the basis for possible expansion of the ASHRAE-recommended thermal envelope for data centers when Cl2 and H2S are not present and limiting the thermal envelope when Cl2 or H2S is present. They also improved the understanding of the corrosion mechanisms for the copper when Cl2 is present in the data center environment

CREEP CORROSION OVER PLASTIC ENCAPSULATED MICROCIRCUIT PACKAGES WITH NOBLE METAL PRE-PLATED LEADFRAMES

Field failures were observed to be caused by the bridging of corrosion products across lead fingers. This phenomenon was identified as creep corrosion and was the motivation for this work. This dissertation advances the state of knowledge on the creep corrosion process and the strategies for mitigation. A range of plastic encapsulated packages with noble metal pre-plated leadframes, from different vendors, with different package attributes, were used in this study. Creep corrosion on the mold compound surface was reproduced in an accelerated manner using mixed flowing gas (MFG) testing in laboratory conditions. Of the three most widely-used industry-standard MFG testing conditions, Telcordia Outdoor was found to be the most effective environment to induce and promote creep corrosion over the mold compound; Battelle Class III environment can also induce the similar effects of creep corrosion on mold compound, but in a limited rate on selective packages; Telcordia Indoor was found to induce no creep corrosion on the mold compound over a 30 day test time. In both Telcordia Outdoor and Battelle Class III environments, packages attributes and applied pre-conditionings were found to have no significant influence on the creep corrosion effect. Creep corrosion over the mold compound showed a dendritic formation. The thickness of the corrosion product layer on the mold compound tended to increase with increased exposure time. Creep corrosion products were electrically conductive and were able to bridge the adjacent leads, thereby causing electrical shorts. The corrosion products were found to consist primarily of copper oxides, copper chlorides, and copper sulfides. No distinct differences in corrosion products composition was observed on the lead versus the mold compound surfaces. Conformal coating was identified as an effective mitigation strategy to eliminate creep corrosion on noble metal pre-plated leadframe packages

Smart Control for Home Water Heater Saving

Existing gas or electric water heaters can become inefficient through the overheating of water and through parasitic heat loss. These inefficiencies are able to be solved by monitoring when a home uses hot water. AquAdapt is a smart sensor which is capable of attaching to any existing residential gas or electric water heater. By constantly monitoring the temperature change of a home water heater, the first law of thermodynamics can be used to relate temperature change to the amount of hot water leaving the water heater. Utilizing this information, a schedule can be generated to optimize the heating of home hot water. Regulating the on-off state of a water heater based on the household’s learned usage pattern, allows AquAdapt to reduce residential water heating energy consumption by up to 33%. With a final product cost of $60, the return on investment of AquAdapt is estimated to be 8 months

Improved micro-contact resistance model that considers material deformation, electron transport and thin film characteristics

This paper reports on an improved analytic model forpredicting micro-contact resistance needed for designing microelectro-mechanical systems (MEMS) switches. The originalmodel had two primary considerations: 1) contact materialdeformation (i.e. elastic, plastic, or elastic-plastic) and 2) effectivecontact area radius. The model also assumed that individual aspotswere close together and that their interactions weredependent on each other which led to using the single effective aspotcontact area model. This single effective area model wasused to determine specific electron transport regions (i.e. ballistic,quasi-ballistic, or diffusive) by comparing the effective radius andthe mean free path of an electron. Using this model required thatmicro-switch contact materials be deposited, during devicefabrication, with processes ensuring low surface roughness values(i.e. sputtered films). Sputtered thin film electric contacts,however, do not behave like bulk materials and the effects of thinfilm contacts and spreading resistance must be considered. Theimproved micro-contact resistance model accounts for the twoprimary considerations above, as well as, using thin film,sputtered, electric contact

NASA patent abstracts bibliography: A continuing bibliography. Section 1: Abstracts (supplement 23)

Abstracts are cited for 129 patents and patent applications introduced into the NASA scientific and technical information system during the period January 1983 through June 1983. Each entry consists of a citation, an abstract, and in most cases, a key illustration selected from the patent or patent application

The Conference on High Temperature Electronics

The status of and directions for high temperature electronics research and development were evaluated. Major objectives were to (1) identify common user needs; (2) put into perspective the directions for future work; and (3) address the problem of bringing to practical fruition the results of these efforts. More than half of the presentations dealt with materials and devices, rather than circuits and systems. Conference session titles and an example of a paper presented in each session are (1) User requirements: High temperature electronics applications in space explorations; (2) Devices: Passive components for high temperature operation; (3) Circuits and systems: Process characteristics and design methods for a 300 degree QUAD or AMP; and (4) Packaging: Presently available energy supply for high temperature environment

Towards integrating chalcogenide based phase change memory with silicon microelectronics

The continued dominance of floating gate technology as the premier non-volatile memory (NVM) technology is expected to hit a roadblock due to issues associated with its inability to catch up with CMOS scaling. The uncertain future of floating gate memory has led to a host of unorthodox NVM technologies to surface as potential heirs. Among the mix is phase change memory (PCM), which is a non-volatile, resistance variable, memory technology wherein the state of the memory bit is defined by the resistance of the memory material. This research study examines novel, bilayer chalcogenide based materials composed of Ge-chalcogenide (GeTe or Ge2Se3) and Sn-chalcogenide (SnTe or SnSe) for phase change memory applications and explores their integration with CMOS technology. By using a layered arrangement, it is possible to induce phase change response in materials, which normally do not exhibit such behavior, and thus form new materials which may have lower threshold voltage and programming current requirements. Also, through the incorporation of a metal containing layer, the phase transition characteristics of the memory layer can be tailored in order to obtain in-situ, a material with optimized phase change properties. Using X-ray diffraction (XRD) and time resolved XRD, it has been demonstrated that stacked phase change memory films exhibit both structural and compositional dependency with annealing temperature. The outcome of the structural transformation of the bottom layer, is an annealing temperature dependent residual stress. By the incorporation of a Sn layer, the phase transition characteristics of Ge-chalcogenide thin films can be tuned. Clear evidence of thermally induced Ge, Sn and chalcogen inter-diffusion, has been discerned via transmission electron microscopy and parallel electron energy loss spectroscopy. The presence of Al2O3 as capping layer has been found to mitigate volatilization and metallic Sn phase separation at high temperatures. Two terminal PCM cells employing these bilayers have been designed, fabricated and tested. All devices exhibit threshold switching and memory switching behavior. By the application of suitable voltage programming pulses, RESET state switching can be accomplished in these devices, thus demonstrating single bit memory functionality. A process for integrating bilayer PCM technology with 2 µm CMOS has been designed and developed. The baseline RIT CMOS process has been modified to incorporate 12 levels of photolithography, 3 levels of metal and the addition of PCM as a BEOL process. On electrical testing, NMOS connected PCM devices exhibit switching behavior. The effect of the state (SET/RESET) of the series connected PCM cell on the drain current of the NMOS has also been investigated. It is determined that threshold switching of the PCM cell is essential in order to observe any change in MOS drain current with variation in drain voltage. Thus, successful integration of bilayer PCM with CMOS has been demonstrated

NASA patent abstracts bibliography: A continuing bibliography. Section 1: Abstracts (supplement 14)

Abstracts are cited for 213 patents and applications for patent introduced into the NASA scientific and technical information system during the period of July 1978 through December 1978. Each entry consists of a citation, an abstract, and in most cases, a key illustration selected from the patent or application for patent