Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer

A novel high-precision vacuum microelectronic accelerometer has been successfully fabricated and tested in our laboratory. This accelerometer has unique advantages of high sensitivity, fast response, and anti-radiation stability. It is a prototype intended for navigation applications and is required to feature micro-g resolution. This paper briefly describes the structure and working principle of our vacuum microelectronic accelerometer, and the mathematical model is also established. The performances of the accelerometer system are discussed after Matlab modeling. The results show that, the dynamic response of the accelerometer system is significantly improved by choosing appropriate parameters of signal detecting circuit, and the signal detecting circuit is designed. In order to attain good linearity and performance, the closed-loop control mode is adopted. Weak current detection technology is studied, and integral T-style feedback network is used in I/V conversion, which will eliminate high-frequency noise at the front of the circuit. According to the modeling parameters, the low-pass filter is designed. This circuit is simple, reliable, and has high precision. Experiments are done and the results show that the vacuum microelectronic accelerometer exhibits good linearity over -1 g to +1 g, an output sensitivity of 543 mV/g, and a nonlinearity of 0.94 %

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book

System design of a low-power three-axis underdamped MEMS accelerometer with simultaneous electrostatic damping control

Recently, consumer electronics industry has known a spectacular growth that would have not been possible without pushing the integration barrier further and further. Micro Electro Mechanical Systems (MEMS) inertial sensors (e.g. accelerometers, gyroscopes) provide high performance, low power, low die cost solutions and are, nowadays, embedded in most consumer applications. In addition, the sensors fusion has become a new trend and combo sensors are gaining growing popularity since the co-integration of a three-axis MEMS accelerometer and a three-axis MEMS gyroscope provides complete navigation information. The resulting device is an Inertial measurement unit (IMU) able to sense multiple Degrees of Freedom (DoF). Nevertheless, the performances of the accelerometers and the gyroscopes are conditioned by the MEMS cavity pressure: the accelerometer is usually a damped system functioning under an atmospheric pressure while the gyroscope is a highly resonant system. Thus, to conceive a combo sensor, aunique low cavity pressure is required. The integration of both transducers within the same low pressure cavity necessitates a method to control and reduce the ringing phenomena by increasing the damping factor of the MEMS accelerometer. Consequently, the aim of the thesis is the design of an analog front-end interface able to sense and control an underdamped three-axis MEMSaccelerometer. This work proposes a novel closed-loop accelerometer interface achieving low power consumption The design challenge consists in finding a trade-off between the sampling frequency, the settling time and the circuit complexity since the sensor excitation plates are multiplexed between the measurement and the damping phases. In this context, a patenteddamping sequence (simultaneous damping) has been conceived to improve the damping efficiency over the state of the art approach performances (successive damping). To investigate the feasibility of the novel electrostatic damping control architecture, several mathematical models have been developed and the settling time method is used to assess the damping efficiency. Moreover, a new method that uses the multirate signal processing theory and allows the system stability study has been developed. This very method is used to conclude on the loop stability for a certain sampling frequency and loop gain value. Next, a 0.18μm CMOS implementation of the entire accelerometer signal chain is designed and validated

Low-Power and Programmable Analog Circuitry for Wireless Sensors

Embedding networks of secure, wirelessly-connected sensors and actuators will help us to conscientiously manage our local and extended environments. One major challenge for this vision is to create networks of wireless sensor devices that provide maximal knowledge of their environment while using only the energy that is available within that environment. In this work, it is argued that the energy constraints in wireless sensor design are best addressed by incorporating analog signal processors. The low power-consumption of an analog signal processor allows persistent monitoring of multiple sensors while the device\u27s analog-to-digital converter, microcontroller, and transceiver are all in sleep mode. This dissertation describes the development of analog signal processing integrated circuits for wireless sensor networks. Specific technology problems that are addressed include reconfigurable processing architectures for low-power sensing applications, as well as the development of reprogrammable biasing for analog circuits

Low-Power and Programmable Analog Circuitry for Wireless Sensors

Embedding networks of secure, wirelessly-connected sensors and actuators will help us to conscientiously manage our local and extended environments. One major challenge for this vision is to create networks of wireless sensor devices that provide maximal knowledge of their environment while using only the energy that is available within that environment. In this work, it is argued that the energy constraints in wireless sensor design are best addressed by incorporating analog signal processors. The low power-consumption of an analog signal processor allows persistent monitoring of multiple sensors while the device\u27s analog-to-digital converter, microcontroller, and transceiver are all in sleep mode. This dissertation describes the development of analog signal processing integrated circuits for wireless sensor networks. Specific technology problems that are addressed include reconfigurable processing architectures for low-power sensing applications, as well as the development of reprogrammable biasing for analog circuits

Advanced Theoretical and Computational Methods for Complex Materials and Structures

The broad use of composite materials and shell structural members with complex geometries in technologies related to various branches of engineering has gained increased attention from scientists and engineers for the development of even more refined approaches and investigation of their mechanical behavior. It is well known that composite materials are able to provide higher values of strength stiffness, and thermal properties, together with conferring reduced weight, which can affect the mechanical behavior of beams, plates, and shells, in terms of static response, vibrations, and buckling loads. At the same time, enhanced structures made of composite materials can feature internal length scales and non-local behaviors, with great sensitivity to different staking sequences, ply orientations, agglomeration of nanoparticles, volume fractions of constituents, and porosity levels, among others. In addition to fiber-reinforced composites and laminates, increased attention has been paid in literature to the study of innovative components such as functionally graded materials (FGMs), carbon nanotubes (CNTs), graphene nanoplatelets, and smart constituents. Some examples of smart applications involve large stroke smart actuators, piezoelectric sensors, shape memory alloys, magnetostrictive and electrostrictive materials, as well as auxetic components and angle-tow laminates. These constituents can be included in the lamination schemes of smart structures to control and monitor the vibrational behavior or the static deflection of several composites. The development of advanced theoretical and computational models for composite materials and structures is a subject of active research and this is explored here for different complex systems, including their static, dynamic, and buckling responses; fracture mechanics at different scales; the adhesion, cohesion, and delamination of materials and interfaces

From RF-Microsystem Technology to RF-Nanotechnology

The RF microsystem technology is believed to introduce a paradigm switch in the wireless revolution. Although only few companies are to date doing successful business with RF-MEMS, and on a case-by-case basis, important issues need yet to be addressed in order to maximize yield and performance stability and hence, outperform alternative competitive technologies (e.g. ferroelectric, SoS, SOI,…). Namely the behavior instability associated to: 1) internal stresses of the free standing thin layers (metal and/or dielectric) and 2) the mechanical contact degradation, be it ohmic or capacitive, which may occur due to low forces, on small areas, and while handling severe current densities.The investigation and understanding of these complex scenario, has been the core of theoretical and experimental investigations carried out in the framework of the research activity that will be presented here. The reported results encompass activities which go from coupled physics (multiphysics) modeling, to the development of experimental platforms intended to tackles the underlying physics of failure. Several original findings on RF-MEMS reliability in particular with respect to the major failure mechanisms such as dielectric charging, metal contact degradation and thermal induced phenomena have been obtained. The original use of advanced experimental setup (surface scanning microscopy, light interferometer profilometry) has allowed the definition of innovative methodology capable to isolate and separately tackle the different degradation phenomena under arbitrary working conditions. This has finally permitted on the one hand to shed some light on possible optimization (e.g. packaging) conditions, and on the other to explore the limits of microsystem technology down to the nanoscale. At nanoscale indeed many phenomena take place and can be exploited to either enhance conventional functionalities and performances (e.g. miniaturization, speed or frequency) or introduce new ones (e.g. ballistic transport). At nanoscale, moreover, many phenomena exhibit their most interesting properties in the RF spectrum (e.g. micromechanical resonances). Owing to the fact that today’s minimum manufacturable features have sizes comparable with the fundamental technological limits (e.g. surface roughness, metal grain size, …), the next generation of smart systems requires a switching paradigm on how new miniaturized components are conceived and fabricated. In fact endowed by superior electrical and mechanical performances, novel nanostructured materials (e.g. carbon based, as carbon nanotube (CNT) and graphene) may provide an answer to this endeavor. Extensively studied in the DC and in the optical range, the studies engaged in LAAS have been among the first to target microwave and millimiterwave transport properties in carbon-based material paving the way toward RF nanodevices. Preliminary modeling study performed on original test structures have highlighted the possibility to implement novel functionalities such as the coupling between the electromagnetic (RF) and microelectromechanical energy in vibrating CNT (toward the nanoradio) or the high speed detection based on ballistic transport in graphene three-terminal junction (TTJ). At the same time these study have contributed to identify the several challenges still laying ahead such as the development of adequate design and modeling tools (ballistic/diffusive, multiphysics and large scale factor) and practical implementation issues such as the effects of material quality and graphene-metal contact on the electrical transport. These subjects are the focus of presently on-going and future research activities and may represent a cornerstone of future wireless applications from microwave up to the THz range

DEVELOPMENT OF PIEZORESISTIVE SILICON NANOWIRES (SINWS) AND THE APPLICATIONS IN NEMS TECHNOLOGY.

Ph.DDOCTOR OF PHILOSOPH