A 90 nm CMOS 16 Gb/s Transceiver for Optical Interconnects

Interconnect architectures which leverage high-bandwidth optical channels offer a promising solution to address the increasing chip-to-chip I/O bandwidth demands. This paper describes a dense, high-speed, and low-power CMOS optical interconnect transceiver architecture. Vertical-cavity surface-emitting laser (VCSEL) data rate is extended for a given average current and corresponding reliability level with a four-tap current summing FIR transmitter. A low-voltage integrating and double-sampling optical receiver front-end provides adequate sensitivity in a power efficient manner by avoiding linear high-gain elements common in conventional transimpedance-amplifier (TIA) receivers. Clock recovery is performed with a dual-loop architecture which employs baud-rate phase detection and feedback interpolation to achieve reduced power consumption, while high-precision phase spacing is ensured at both the transmitter and receiver through adjustable delay clock buffers. A prototype chip fabricated in 1 V 90 nm CMOS achieves 16 Gb/s operation while consuming 129 mW and occupying 0.105 mm^2

A 6.0-mW 10.0-Gb/s Receiver With Switched-Capacitor Summation DFE

A low-power receiver with a one-tap decision feedback equalization (DFE) was fabricated in 90-nm CMOS technology. The speculative equalization is performed using switched-capacitor-based addition at the front-end sample-hold circuit. In order to further reduce the power consumption, an analog multiplexer is used in the speculation technique implementation. A quarter-rate-clocking scheme facilitates the use of low-power front-end circuitry and CMOS clock buffers. The receiver was tested over channels with different levels of ISI. The signaling rate with BER<10^-12 was significantly increased with the use of DFE for short- to medium-distance PCB traces. At 10-Gb/s data rate, the receiver consumes less than 6.0 mW from a 1.0-V supply. This includes the power consumed in all quarter-rate clock buffers, but not the power of a clock recovery loop. The input clock phase and the DFE taps are adjusted externally

Phase and amplitude pre-emphasis techniques for low-power serial links

A novel approach to equalization of high-speed serial links combines both amplitude pre-emphasis to correct for intersymbol interference and phase pre-emphasis to compensate for deterministic jitter, in particular, data-dependent jitter. Phase pre-emphasis augments the performance of low power transmitters in bandwidth-limited channels. The transmitter circuit is implemented in a 90-nm bulk CMOS process and reduces power consumption by pushing CMOS static logic to the output stage, a 4:1 output multiplexer. The received signal jitter over a cable is reduced from 16.15 ps to 10.29 ps with only phase pre-emphasis at the transmitter. The jitter is reduced by 3.6 ps over an FR-4 backplane interconnect. A transmitter without phase pre-emphasis consumes 18 mW of power at 6Gb/s and 600mVpp output swing, a power budget of 3mW/Gb/s, while a transmitter with phase pre-emphasis consumes 24mW, a budget of 4 mW/Gb/s

Integrated Transversal Equalizers in High-Speed Fiber-Optic Systems

Intersymbol interference (ISI) caused by intermodal dispersion in multimode fibers is the major limiting factor in the achievable data rate or transmission distance in high-speed multimode fiber-optic links for local area networks applications. Compared with optical-domain and other electrical-domain dispersion compensation methods, equalization with transversal filters based on distributed circuit techniques presents a cost-effective and low-power solution. The design of integrated distributed transversal equalizers is described in detail with focus on delay lines and gain stages. This seven-tap distributed transversal equalizer prototype has been implemented in a commercial 0.18-µm SiGe BiCMOS process for 10-Gb/s multimode fiber-optic links. A seven-tap distributed transversal equalizer reduces the ISI of a 10-Gb/s signal after 800 m of 50-µm multimode fiber from 5 to 1.38 dB, and improves the bit-error rate from about 10^-5 to less than 10^-12

Design of Energy-Efficient A/D Converters with Partial Embedded Equalization for High-Speed Wireline Receiver Applications

As the data rates of wireline communication links increases, channel impairments such as skin effect, dielectric loss, fiber dispersion, reflections and cross-talk become more pronounced. This warrants more interest in analog-to-digital converter (ADC)-based serial link receivers, as they allow for more complex and flexible back-end digital signal processing (DSP) relative to binary or mixed-signal receivers. Utilizing this back-end DSP allows for complex digital equalization and more bandwidth-efficient modulation schemes, while also displaying reduced process/voltage/temperature (PVT) sensitivity. Furthermore, these architectures offer straightforward design translation and can directly leverage the area and power scaling offered by new CMOS technology nodes. However, the power consumption of the ADC front-end and subsequent digital signal processing is a major issue. Embedding partial equalization inside the front-end ADC can potentially result in lowering the complexity of back-end DSP and/or decreasing the ADC resolution requirement, which results in a more energy-effcient receiver. This dissertation presents efficient implementations for multi-GS/s time-interleaved ADCs with partial embedded equalization. First prototype details a 6b 1.6GS/s ADC with a novel embedded redundant-cycle 1-tap DFE structure in 90nm CMOS. The other two prototypes explain more complex 6b 10GS/s ADCs with efficiently embedded feed-forward equalization (FFE) and decision feedback equalization (DFE) in 65nm CMOS. Leveraging a time-interleaved successive approximation ADC architecture, new structures for embedded DFE and FFE are proposed with low power/area overhead. Measurement results over FR4 channels verify the effectiveness of proposed embedded equalization schemes. The comparison of fabricated prototypes against state-of-the-art general-purpose ADCs at similar speed/resolution range shows comparable performances, while the proposed architectures include embedded equalization as well

Temporal and spatial combining for 5G mmWave small cells

This chapter proposes the combination of temporal processing through Rake combining based on direct sequence-spread spectrum (DS-SS), and multiple antenna beamforming or antenna spatial diversity as a possible physical layer access technique for fifth generation (5G) small cell base stations (SBS) operating in the millimetre wave (mmWave) frequencies. Unlike earlier works in the literature aimed at previous generation wireless, the use of the beamforming is presented as operating in the radio frequency (RF) domain, rather than the baseband domain, to minimise power expenditure as a more suitable method for 5G small cells. Some potential limitations associated with massive multiple input-multiple output (MIMO) for small cells are discussed relating to the likely limitation on available antennas and resultant beamwidth. Rather than relying, solely, on expensive and potentially power hungry massive MIMO (which in the case of a SBS for indoor use will be limited by a physically small form factor) the use of a limited number of antennas, complimented with Rake combining, or antenna diversity is given consideration for short distance indoor communications for both the SBS) and user equipment (UE). The proposal’s aim is twofold: to solve eroded path loss due to the effective antenna aperture reduction and to satisfy sensitivity to blockages and multipath dispersion in indoor, small coverage area base stations. Two candidate architectures are proposed. With higher data rates, more rigorous analysis of circuit power and its effect on energy efficiency (EE) is provided. A detailed investigation is provided into the likely design and signal processing requirements. Finally, the proposed architectures are compared to current fourth generation long term evolution (LTE) MIMO technologies for their anticipated power consumption and EE

Performance of electronic dispersion compensator for 10Gb/s multimode fiber links

In high-speed optical links, electronic compensation circuits can be utilized to greatly improve the data transmission performance limited by fiber dispersion. In this paper, we develop a full link model, including multimode fibers, optical/electronics/optical components, clock-and-data recovery and electronic compensation circuits. The performance of various electronic compensation techniques, such as feed-forward equalizer and decision feedback equalizer for optical multimode fiber is investigated and numerically evaluated. Finally, a comparison of the performance of each compensation techniques and a proposal of optimal equalizer circuit implementation, achieving a 10-Gb/s transmission over 1-km standard multimode fiber are presented

Analysis and Design of High Speed Serial Interfaces for Automotive Applications

The demand for an enriched end-user experience and increased performance in next generation electronic applications is never ending, and it is a common trend for a wide spectrum of applications owing to different markets, like computing, mobile communication and automotive. For this reason High Speed Serial Interface have become widespread components for nowadays electronics with a constant demand for power reduction and data rate increase. In the frame of gigabit serial systems, the work discussed in this thesis develops in two directions: on one hand, the aim is to support the continuous data rate increase with the development of novel link modeling approaches that will be employed for system level evaluation and as support in the design and characterization phases. On the other hand, the design considerations and challenges in the implementation of the transmitter, one of the most delicate blocks for the signal integrity performance of the link, are central. The first part of the activity regarding link performance predictions lead to the development of an enhanced statistical simulation approach, capable to account for the transmitter waveform shape in the ISI analysis, a characteristic that is missed by the available state-ofthe- art simulation approaches. The proposed approach has been extensively tested by comparison with traditional simulation approaches (Spice-like simulators) and validated against experimental characterization of a test system, with satisfactory results. The second part of the activity consists in the design of a high speed transmitter in a deeply scaled CMOS technology, spanning from the concept of the circuit, its implementation and characterization. Targets of the design are to achieve a data rate of 5 Gb/s with a minimum voltage swing of 800 mV, thus doubling the data rate of the current transmitter implementation, and reduce the power dissipation adopting a voltage mode architecture. The experimental characterization of the fabricated lot draws a twofold picture, with some of the performance figures showing a very good qualitative and quantitative agreement with pre-silicon simulations, and others revealing a poor performance level, especially for the eye diagram. Investigation of the root causes by the analysis of the physical silicon design, of the bonding scheme of the prototypes and of the pre-silicon simulations is reported. Guidelines for the redesign of the circuit are also given.Nel panorama delle applicazioni elettroniche il miglioramento delle performance di un prodotto da una generazione alla successiva ha lo scopo di offrire all\u2019utilizzatore finale nuove funzioni e migliorare quelle esistenti. Negli ultimi anni grazie al costante avanzamento della tecnologia integrata, si \ue8 assistito ad un enorme sviluppo della capacit\ue0 computazionale dei dispositivi in tutti i segmenti di mercato, quali ad esempio l\u2019information technology, la comunicazione mobile e l\u2019automotive. La conseguente necessit\ue0 di mettere in comunicazione dispostivi diversi all\u2019interno della stessa applicazione e di traferire grosse quantit\ue0 di dati ha provocato una capillare diffusione delle interfacce seriali ad alta velocit\ue0, o High Speed Serial Interfaces (HSSIs). La necessit\ue0 di ridurre il consumo di potenza e aumentare il bit rate per questo tipo di applicazioni \ue8 diventata dunque un ambito di ricerca di estremo interesse. Il lavoro discusso in questa tesi si colloca nell\u2019ambito della trasmissione di dati seriali a bit rate superiori ad 1Gb/s e si sviluppa in due direzioni: da un lato, a sostegno del continuo aumento del bit rate nelle nuove generazioni di interfacce, \ue8 stato affrontato lo sviluppo di nuovi approcci di modellazione del sistema, che possano essere impiegati nella valutazione delle prestazioni dell\u2019interfaccia e a supporto delle fasi di progettazione e di caratterizzazione. Dall\u2019altro lato, si \ue8 focalizzata l\u2019attenzione sulle sfide e sulle problematiche inerenti il progetto di uno dei blocchi pi\uf9 delicati per le prestazioni del sistema, il trasmettitore. La prima parte della tesi ha come oggetto lo sviluppo di un approccio di simulazione statistico innovativo, in grado di includere nell\u2019analisi degli effetti dell\u2019interferenza di intersimbolo anche la forma d\u2019onda prodotta all\u2019uscita del trasmettitore, una caratteristica che non \ue8 presente in altri approcci di simulazione proposti in letteratura. La tecnica proposta \ue8 ampiamente testata mediante il confronto con approcci di simulazione tradizionali (di tipo Spice) e mediante il confronto con la caratterizzazione sperimentale di un sistema di test, con risultati pienamente soddisfacenti. La seconda parte dell\u2019attivit\ue0 riguarda il progetto di un trasmettitore integrato high speed in tecnologia CMOS a 40nm e si estende dallo studio di fattibilit\ue0 del circuito fino alla sua realizzazione e caratterizzazione. Gli obiettivi riguardano il raggiungimento di un bit rate pari a 5 Gb/s, raddoppiando cos\uec il bit rate dell\u2019attuale implementazione, e di una tensione differenziale di uscita minima di 800mV (picco-picco) riducendo allo stesso tempo la potenza dissipata mediante l\u2019adozione di una architettura Voltage Mode. I risultati sperimentali ottenuti dal primo lotto fabbricato non delineano un quadro univoco: alcune performance mostrano un ottimo accordo qualitativo e quantitativo con le simulazioni pre-fabbricazione, mentre prestazioni non soddisfacenti sono state ottenute in particolare per il diagramma ad occhio. Grazie all\u2019analisi del layout del prototipo, del bonding tra silicio e package e delle simulazioni pre-fabbricazione \ue8 stato possibile risalire ai fattori responsabili del degrado delle prestazioni rispetto alla previsioni pre-fabbricazione, permettendo inoltre di delineare le linee guida da seguire nella futura progettazione di un nuovo prototipo