Radiation Tolerant Electronics, Volume II

Research on radiation tolerant electronics has increased rapidly over the last few years, resulting in many interesting approaches to model radiation effects and design radiation hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation hardened electronics for space applications, high-energy physics experiments such as those on the large hadron collider at CERN, and many terrestrial nuclear applications, including nuclear energy and safety management. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their ionizing radiation susceptibility has raised many exciting challenges, which are expected to drive research in the coming decade.After the success of the first Special Issue on Radiation Tolerant Electronics, the current Special Issue features thirteen articles highlighting recent breakthroughs in radiation tolerant integrated circuit design, fault tolerance in FPGAs, radiation effects in semiconductor materials and advanced IC technologies and modelling of radiation effects

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

Resilience of an embedded architecture using hardware redundancy

In the last decade the dominance of the general computing systems market has being replaced by embedded systems with billions of units manufactured every year. Embedded systems appear in contexts where continuous operation is of utmost importance and failure can be profound. Nowadays, radiation poses a serious threat to the reliable operation of safety-critical systems. Fault avoidance techniques, such as radiation hardening, have been commonly used in space applications. However, these components are expensive, lag behind commercial components with regards to performance and do not provide 100% fault elimination. Without fault tolerant mechanisms, many of these faults can become errors at the application or system level, which in turn, can result in catastrophic failures. In this work we study the concepts of fault tolerance and dependability and extend these concepts providing our own definition of resilience. We analyse the physics of radiation-induced faults, the damage mechanisms of particles and the process that leads to computing failures. We provide extensive taxonomies of 1) existing fault tolerant techniques and of 2) the effects of radiation in state-of-the-art electronics, analysing and comparing their characteristics. We propose a detailed model of faults and provide a classification of the different types of faults at various levels. We introduce an algorithm of fault tolerance and define the system states and actions necessary to implement it. We introduce novel hardware and system software techniques that provide a more efficient combination of reliability, performance and power consumption than existing techniques. We propose a new element of the system called syndrome that is the core of a resilient architecture whose software and hardware can adapt to reliable and unreliable environments. We implement a software simulator and disassembler and introduce a testing framework in combination with ERA’s assembler and commercial hardware simulators

A digital polar transmitter for multi-band OFDM Ultra-WideBand

Linear power amplifiers used to implement the Ultra-Wideband standard must be backed off from optimum power efficiency to meet the standard specifications and the power efficiency suffers. The problem of low efficiency can be mitigated by polar modulation. Digital polar architectures have been employed on numerous wireless standards like GSM, EDGE, and WLAN, where the fractional bandwidths achieved are only about 1%, and the power levels achieved are often in the vicinity of 20 dBm. Can the architecture be employed on wireless standards with low-power and high fractional bandwidth requirements and yet achieve good power efficiency? To answer these question, this thesis studies the application of a digital polar transmitter architecture with parallel amplifier stages for UWB. The concept of the digital transmitter is motivated and inspired by three factors. First, unrelenting advances in the CMOS technology in deep-submicron process and the prevalence of low-cost Digital Signal processing have resulted in the realization of higher level of integration using digitally intensive approaches. Furthermore, the architecture is an evolution of polar modulation, which is known for high power efficiency in other wireless applications. Finally, the architecture is operated as a digital-to-analog converter which circumvents the use of converters in conventional transmitters. Modeling and simulation of the system architecture is performed on the Agilent Advanced Design System Ptolemy simulation platform. First, by studying the envelope signal, we found that envelope clipping results in a reduction in the peak-to-average power ratio which in turn improves the error vector magnitude performance (figure of merit for the study). In addition, we have demonstrated that a resolution of three bits suffices for the digital polar transmitter when envelope clipping is performed. Next, this thesis covers a theoretical derivation for the estimate of the error vector magnitude based on the resolution, quantization and phase noise errors. An analysis on the process variations - which result in gain and delay mismatches - for a digital transmitter architecture with four bits ensues. The above studies allow RF designers to estimate the number of bits required and the amount of distortion that can be tolerated in the system. Next, a study on the circuit implementation was conducted. A DPA that comprises 7 parallel RF amplifiers driven by a constant RF phase-modulated signal and 7 cascode transistors (individually connected in series with the bottom amplifiers) digitally controlled by a 3-bit digitized envelope signal to reconstruct the UWB signal at the output. Through the use of NFET models from the IBM 130-nm technology, our simulation reveals that our DPA is able to achieve an EVM of - 22 dB. The DPA simulations have been performed at 3.432 GHz centre frequency with a channel bandwidth of 528 MHz, which translates to a fractional bandwidth of 15.4%. Drain efficiencies of 13.2/19.5/21.0% have been obtained while delivering -1.9/2.5/5.5 dBm of output power and consuming 5/9/17 mW of power. In addition, we performed a yield analysis on the digital polar amplifier, based on unit-weighted and binary-weighted architecture, when gain variations are introduced in all the individual stages. The dynamic element matching method is also introduced for the unit-weighted digital polar transmitter. Monte Carlo simulations reveal that when the gain of the amplifiers are allowed to vary at a mean of 1 with a standard deviation of 0.2, the binary-weighted architecture obtained a yield of 79%, while the yields of the unit-weighted architectures are in the neighbourhood of 95%. Moreover, the dynamic element matching technique demonstrates an improvement in the yield by approximately 3%. Finally, a hardware implementation for this architecture based on software-defined arbitrary waveform generators is studied. In this section, we demonstrate that the error vector magnitude results obtained with a four-stage binary-weighted digital polar transmitter under ideal combining conditions fulfill the European Computer Manufacturers Association requirements. The proposed experimental setup, believed to be the first ever attempted, confirm the feasibility of a digital polar transmitter architecture for Ultra-Wideband. In addition, we propose a number of power combining techniques suitable for the hardware implementation. Spatial power combining, in particular, shows a high potential for the digital polar transmitter architecture. The above studies demonstrate the feasibility of the digital polar architecture with good power efficiency for a wideband wireless standard with low-power and high fractional bandwidth requirements

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Algorithms for Verification of Analog and Mixed-Signal Integrated Circuits

Over the past few decades, the tremendous growth in the complexity of analog and mixed-signal (AMS) systems has posed great challenges to AMS verification, resulting in a rapidly growing verification gap. Existing formal methods provide appealing completeness and reliability, yet they suffer from their limited efficiency and scalability. Data oriented machine learning based methods offer efficient and scalable solutions but do not guarantee completeness or full coverage. Additionally, the trend towards shorter time to market for AMS chips urges the development of efficient verification algorithms to accelerate with the joint design and testing phases. This dissertation envisions a hierarchical and hybrid AMS verification framework by consolidating assorted algorithms to embrace efficiency, scalability and completeness in a statistical sense. Leveraging diverse advantages from various verification techniques, this dissertation develops algorithms in different categories. In the context of formal methods, this dissertation proposes a generic and comprehensive model abstraction paradigm to model AMS content with a unifying analog representation. Moreover, an algorithm is proposed to parallelize reachability analysis by decomposing AMS systems into subsystems with lower complexity, and dividing the circuit's reachable state space exploration, which is formulated as a satisfiability problem, into subproblems with a reduced number of constraints. The proposed modeling method and the hierarchical parallelization enhance the efficiency and scalability of reachability analysis for AMS verification. On the subject of learning based method, the dissertation proposes to convert the verification problem into a binary classification problem solved using support vector machine (SVM) based learning algorithms. To reduce the need of simulations for training sample collection, an active learning strategy based on probabilistic version space reduction is proposed to perform adaptive sampling. An expansion of the active learning strategy for the purpose of conservative prediction is leveraged to minimize the occurrence of false negatives. Moreover, another learning based method is proposed to characterize AMS systems with a sparse Bayesian learning regression model. An implicit feature weighting mechanism based on the kernel method is embedded in the Bayesian learning model for concurrent quantification of influence of circuit parameters on the targeted specification, which can be efficiently solved in an iterative method similar to the expectation maximization (EM) algorithm. Besides, the achieved sparse parameter weighting offers favorable assistance to design analysis and test optimization

Solid State Circuits Technologies

The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book