450 research outputs found
VLSI Revisited - Revival in Japan
This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government - through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors, Hitachi, Sony, Toshiba, Elpida, Renesas, Sematech, VLSI, JESSI, MEDEA, ASPLA, MIRAI, innovation system
VLSI REVISITED – REVIVAL IN JAPAN
This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government – through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors; Hitachi; Sony; Toshiba; Elpida; Renesas; Sematech; VLSI; JESSI; MEDEA; ASPLA; MIRAI; innovation system
Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip
The sustained demand for faster, more powerful chips has been met by the
availability of chip manufacturing processes allowing for the integration of increasing
numbers of computation units onto a single die. The resulting outcome,
especially in the embedded domain, has often been called SYSTEM-ON-CHIP
(SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC).
MPSoC design brings to the foreground a large number of challenges, one of
the most prominent of which is the design of the chip interconnection. With a
number of on-chip blocks presently ranging in the tens, and quickly approaching
the hundreds, the novel issue of how to best provide on-chip communication
resources is clearly felt.
NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable
answer to this design concern. By bringing large-scale networking concepts to
the on-chip domain, they guarantee a structured answer to present and future
communication requirements. The point-to-point connection and packet switching
paradigms they involve are also of great help in minimizing wiring overhead
and physical routing issues. However, as with any technology of recent inception,
NoC design is still an evolving discipline. Several main areas of interest
require deep investigation for NoCs to become viable solutions:
• The design of the NoC architecture needs to strike the best tradeoff among
performance, features and the tight area and power constraints of the onchip
domain.
• Simulation and verification infrastructure must be put in place to explore,
validate and optimize the NoC performance.
• NoCs offer a huge design space, thanks to their extreme customizability in
terms of topology and architectural parameters. Design tools are needed
to prune this space and pick the best solutions.
• Even more so given their global, distributed nature, it is essential to evaluate
the physical implementation of NoCs to evaluate their suitability for
next-generation designs and their area and power costs.
This dissertation performs a design space exploration of network-on-chip architectures,
in order to point-out the trade-offs associated with the design of
each individual network building blocks and with the design of network topology
overall. The design space exploration is preceded by a comparative analysis
of state-of-the-art interconnect fabrics with themselves and with early networkon-
chip prototypes. The ultimate objective is to point out the key advantages
that NoC realizations provide with respect to state-of-the-art communication
infrastructures and to point out the challenges that lie ahead in order to make
this new interconnect technology come true. Among these latter, technologyrelated
challenges are emerging that call for dedicated design techniques at all
levels of the design hierarchy. In particular, leakage power dissipation, containment
of process variations and of their effects. The achievement of the above
objectives was enabled by means of a NoC simulation environment for cycleaccurate
modelling and simulation and by means of a back-end facility for the
study of NoC physical implementation effects. Overall, all the results provided
by this work have been validated on actual silicon layout
Always-On 674uW @ 4GOP/s Error Resilient Binary Neural Networks with Aggressive SRAM Voltage Scaling on a 22nm IoT End-Node
Binary Neural Networks (BNNs) have been shown to be robust to random
bit-level noise, making aggressive voltage scaling attractive as a power-saving
technique for both logic and SRAMs. In this work, we introduce the first fully
programmable IoT end-node system-on-chip (SoC) capable of executing
software-defined, hardware-accelerated BNNs at ultra-low voltage. Our SoC
exploits a hybrid memory scheme where error-vulnerable SRAMs are complemented
by reliable standard-cell memories to safely store critical data under
aggressive voltage scaling. On a prototype in 22nm FDX technology, we
demonstrate that both the logic and SRAM voltage can be dropped to 0.5Vwithout
any accuracy penalty on a BNN trained for the CIFAR-10 dataset, improving
energy efficiency by 2.2X w.r.t. nominal conditions. Furthermore, we show that
the supply voltage can be dropped to 0.42V (50% of nominal) while keeping more
than99% of the nominal accuracy (with a bit error rate ~1/1000). In this
operating point, our prototype performs 4Gop/s (15.4Inference/s on the CIFAR-10
dataset) by computing up to 13binary ops per pJ, achieving 22.8 Inference/s/mW
while keeping within a peak power envelope of 674uW - low enough to enable
always-on operation in ultra-low power smart cameras, long-lifetime
environmental sensors, and insect-sized pico-drones.Comment: Submitted to ISICAS2020 journal special issu
The impact of design techniques in the reduction of power consumption of SoCs Multimedia
Orientador: Guido Costa Souza de AraújoDissertação (mestrado) - Universidade Estadual de Campinas, Instituto de ComputaçãoResumo: A indústria de semicondutores sempre enfrentou fortes demandas em resolver problema de dissipação de calor e reduzir o consumo de energia em dispositivos. Esta tendência tem sido intensificada nos últimos anos com o movimento de sustentabilidade ambiental. A concepção correta de um sistema eletrônico de baixo consumo de energia é um problema de vários nÃveis de complexidade e exige estratégias sistemáticas na sua construção. Fora disso, a adoção de qualquer técnica de redução de energia sempre está vinculada com objetivos especiais e provoca alguns impactos no projeto. Apesar dos projetistas conheçam bem os impactos de forma qualitativa, as detalhes quantitativas ainda são incógnitas ou apenas mantidas dentro do 'know-how' das empresas. Neste trabalho, de acordo com resultados experimentais baseado num plataforma de SoC1 industrial, tentamos quantificar os impactos derivados do uso de técnicas de redução de consumo de energia. Nos concentramos em relacionar o fator de redução de energia de cada técnica aos impactos em termo de área, desempenho, esforço de implementação e verificação. Na ausência desse tipo de dados, que relacionam o esforço de engenharia com as metas de consumo de energia, incertezas e atrasos serão frequentes no cronograma de projeto. Esperamos que este tipo de orientações possam ajudar/guiar os arquitetos de projeto em selecionar as técnicas adequadas para reduzir o consumo de energia dentro do alcance de orçamento e cronograma de projetoAbstract: The semiconductor industry has always faced strong demands to solve the problem of heat dissipation and reduce the power consumption in electronic devices. This trend has been increased in recent years with the action of environmental sustainability. The correct conception of an electronic system for low power consumption is an issue with multiple levels of complexities and requires systematic approaches in its construction. However, the adoption of any technique for reducing the power consumption is always linked with some specific goals and causes some impacts on the project. Although the designers know well that these impacts can affect the design in a quality aspect, the quantitative details are still unkown or just be kept inside the company's know-how. In this work, according to the experimental results based on an industrial SoC2 platform, we try to quantify the impacts of the use of low power techniques. We will relate the power reduction factor of each technique to the impact in terms of area, performance, implementation and verification effort. In the absence of such data, which relates the engineering effort to the goals of power consumption, uncertainties and delays are frequent. We hope that such guidelines can help/guide the project architects in selecting the appropriate techniques to reduce the power consumption within the limit of budget and project scheduleMestradoCiência da ComputaçãoMestre em Ciência da Computaçã
Thermal-Aware Networked Many-Core Systems
Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors.
This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast
A Construction Kit for Efficient Low Power Neural Network Accelerator Designs
Implementing embedded neural network processing at the edge requires
efficient hardware acceleration that couples high computational performance
with low power consumption. Driven by the rapid evolution of network
architectures and their algorithmic features, accelerator designs are
constantly updated and improved. To evaluate and compare hardware design
choices, designers can refer to a myriad of accelerator implementations in the
literature. Surveys provide an overview of these works but are often limited to
system-level and benchmark-specific performance metrics, making it difficult to
quantitatively compare the individual effect of each utilized optimization
technique. This complicates the evaluation of optimizations for new accelerator
designs, slowing-down the research progress. This work provides a survey of
neural network accelerator optimization approaches that have been used in
recent works and reports their individual effects on edge processing
performance. It presents the list of optimizations and their quantitative
effects as a construction kit, allowing to assess the design choices for each
building block separately. Reported optimizations range from up to 10'000x
memory savings to 33x energy reductions, providing chip designers an overview
of design choices for implementing efficient low power neural network
accelerators
- …