720 research outputs found
Circuit design and analysis for on-FPGA communication systems
On-chip communication system has emerged as a prominently important subject in Very-Large-
Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects.
Interconnects often dictates the system performance, and, therefore, research for new
methodologies and system architectures that deliver high-performance communication services
across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable
Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication.
Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable
fabrics, switches and the specific routing architecture also introduce additional latency
and bandwidth degradation further hindering intra-chip communication performance.
Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs.
Communication with programmable interconnect received little attention and is inadequately understood.
This thesis is among the first to research on-chip communication systems that are built on
top of programmable fabrics and proposes methodologies to maximize the interconnect throughput
performance. There are three major contributions in this thesis: (i) an analysis of on-chip
interconnect fringing, which degrades the bandwidth of communication channels due to routing
congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly
improves the interconnect throughput by exploiting the fundamental electrical characteristics
of the reconfigurable interconnect structures. This new scheme can potentially mitigate
the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide
adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime
optimization for route planning and dynamic routing which, effectively utilizes the in-silicon
bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new
methodologies and concepts are proposed to enhance the on-FPGA communication throughput
performance that is of vital importance in new technology processes
Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip
The sustained demand for faster, more powerful chips has been met by the
availability of chip manufacturing processes allowing for the integration of increasing
numbers of computation units onto a single die. The resulting outcome,
especially in the embedded domain, has often been called SYSTEM-ON-CHIP
(SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC).
MPSoC design brings to the foreground a large number of challenges, one of
the most prominent of which is the design of the chip interconnection. With a
number of on-chip blocks presently ranging in the tens, and quickly approaching
the hundreds, the novel issue of how to best provide on-chip communication
resources is clearly felt.
NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable
answer to this design concern. By bringing large-scale networking concepts to
the on-chip domain, they guarantee a structured answer to present and future
communication requirements. The point-to-point connection and packet switching
paradigms they involve are also of great help in minimizing wiring overhead
and physical routing issues. However, as with any technology of recent inception,
NoC design is still an evolving discipline. Several main areas of interest
require deep investigation for NoCs to become viable solutions:
• The design of the NoC architecture needs to strike the best tradeoff among
performance, features and the tight area and power constraints of the onchip
domain.
• Simulation and verification infrastructure must be put in place to explore,
validate and optimize the NoC performance.
• NoCs offer a huge design space, thanks to their extreme customizability in
terms of topology and architectural parameters. Design tools are needed
to prune this space and pick the best solutions.
• Even more so given their global, distributed nature, it is essential to evaluate
the physical implementation of NoCs to evaluate their suitability for
next-generation designs and their area and power costs.
This dissertation performs a design space exploration of network-on-chip architectures,
in order to point-out the trade-offs associated with the design of
each individual network building blocks and with the design of network topology
overall. The design space exploration is preceded by a comparative analysis
of state-of-the-art interconnect fabrics with themselves and with early networkon-
chip prototypes. The ultimate objective is to point out the key advantages
that NoC realizations provide with respect to state-of-the-art communication
infrastructures and to point out the challenges that lie ahead in order to make
this new interconnect technology come true. Among these latter, technologyrelated
challenges are emerging that call for dedicated design techniques at all
levels of the design hierarchy. In particular, leakage power dissipation, containment
of process variations and of their effects. The achievement of the above
objectives was enabled by means of a NoC simulation environment for cycleaccurate
modelling and simulation and by means of a back-end facility for the
study of NoC physical implementation effects. Overall, all the results provided
by this work have been validated on actual silicon layout
Floorplan-Aware High Performance NoC Design
Las actuales arquitecturas de m�ltiples n�cleos como los chip multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) han adoptado a las redes dentro del chip (NoC) como elemento -ptimo para la inter-conexi-n de los diversos elementos de dichos sistemas. En este sentido, fabricantes de CMPs y MPSoCs han adoptado NoCs sencillas, generalmente con una topolog'a en malla o anillo, ya que son suficientes para satisfacer las necesidades de los sistemas actuales. Sin embargo a medida que los requerimientos del sistema -- baja latencia y alto rendimiento -- se hacen m�s exigentes, estas redes tan simples dejan de ser una soluci-n real. As', la comunidad investigadora ha propuesto y analizado NoCs m�s complejas. No obstante, estas soluciones son m�s dif'ciles de implementar -- especialmente los enlaces largos -- haciendo que este tipo de topolog'as complejas sean demasiado costosas o incluso inviables.
En esta tesis, presentamos una metodolog'a de dise-o que minimiza la p�rdida de prestaciones de la red debido a su implementaci-n real. Los principales problemas que se encuentran al implementar una NoC son los conmutadores y los enlaces largos. En esta tesis, el conmutador se ha hecho modular, es decir, formado como uni-n de m-dulos m�s peque-os. En nuestro caso, los m-dulos son id�nticos, donde cada m-dulo es capaz de arbitrar, conmutar, y almacenar los mensajes que le llegan. Posteriormente, flexibilizamos la colocaci-n de estos m-dulos en el chip, permitiendo que m-dulos de un mismo conmutador est�n distribuidos por el chip.
Esta metodolog'a de dise-o la hemos aplicado a diferentes escenarios. Primeramente, hemos introducido nuestro conmutador modular en NoCs con topolog'as conocidas como la malla 2D. Los resultados muestran como la modularidad y la distribuci-n del conmutador reducen la latencia y el consumo de potencia de la red.
En segundo lugar, hemos utilizado nuestra metodolog'a de dise-o para implementar un crossbar distribuidRoca Pérez, A. (2012). Floorplan-Aware High Performance NoC Design [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/17844Palanci
The future of computing beyond Moore's Law.
Moore's Law is a techno-economic model that has enabled the information technology industry to double the performance and functionality of digital electronics roughly every 2 years within a fixed cost, power and area. Advances in silicon lithography have enabled this exponential miniaturization of electronics, but, as transistors reach atomic scale and fabrication costs continue to rise, the classical technological driver that has underpinned Moore's Law for 50 years is failing and is anticipated to flatten by 2025. This article provides an updated view of what a post-exascale system will look like and the challenges ahead, based on our most recent understanding of technology roadmaps. It also discusses the tapering of historical improvements, and how it affects options available to continue scaling of successors to the first exascale machine. Lastly, this article covers the many different opportunities and strategies available to continue computing performance improvements in the absence of historical technology drivers. This article is part of a discussion meeting issue 'Numerical algorithms for high-performance computational science'
Analysis of asynchronous routers for network-on-chip applications
Asynchronous circuit design has been conventionally regarded as a valid alternative to synchronous logic due to its potential for low consumption of resources, power and delay. This includes areas such as the communication infrastructure of modern multi core processors, the so-called Network-on-Chip (NoC) paradigm on which this thesis focus on. In recent times, the transistor downscaling and the increasing clock frequencies have pushed synchronous design to high static power and delay. As a result, the interest for asynchronous integrated routers and links has re-emerged, especially in fields with ultra-low power requirements such as embedded systems. In this thesis, we construct an asynchronous router using Verilog code based on architectures found in the literature. We analyze the functionality of each of the building blocks and verify the operation of the implemented routing algorithm and arbitration mechanism. In the future, the results obtained here are expected to enable a complete implementation of the router in Verilog and its posterior analysis of its scalability
Introduction to FPGA design
This paper presents an introduction to digital hardware design using Field Programmable Gate Arrays (FPGAs). After a historical introduction and a quick overview of digital design, the internal structure of a generic FPGA is discussed. We then describe the design flow, i.e., the steps needed to go from design idea to actual working hardware. Digital signal processing is an important area where FPGAs have found many applications in recent years. Therefore a complete section is devoted to this subject. The paper finishes with a discussion of important peripheral concepts essential for success in any project involving FPGAs
Elastic bundles :modelling and architecting asynchronous circuits with granular rigidity
PhD ThesisIntegrated Circuit (IC) designs these days are predominantly System-on-Chips (SoCs).
The complexity of designing a SoC has increased rapidly over the years due to growing
process and environmental variations coupled with global clock distribution di culty.
Moreover, traditional synchronous design is not apt to handle the heterogeneous timing
nature of modern SoCs. As a countermeasure, the semiconductor industry witnessed
a strong revival of asynchronous design principles. A new paradigm of digital circuits
emerged, as a result, namely mixed synchronous-asynchronous circuits. With a wave
of recent innovations in synchronous-asynchronous CAD integration, this paradigm is
showing signs of commercial adoption in future SoCs mainly due to the scope for reuse
of synchronous functional blocks and IP cores, and the co-existence of synchronous and
asynchronous design styles in a common EDA framework.
However, there is a lack of formal methods and tools to facilitate mixed synchronousasynchronous
design. In this thesis, we propose a formal model based on Petri nets with
step semantics to describe these circuits behaviourally. Implication of this model in the
veri cation and synthesis of mixed synchronous-asynchronous circuits is studied. Till
date, this paradigm has been mainly explored on the basis of Globally Asynchronous
Locally Synchronous (GALS) systems. Despite decades of research, GALS design has
failed to gain traction commercially. To understand its drawbacks, a simulation framework
characterising the physical and functional aspects of GALS SoCs is presented.
A novel method for synthesising mixed synchronous-asynchronous circuits with varying
levels of rigidity is proposed. Starting with a high-level data ow model of a system which
is intrinsically asynchronous, the key idea is to introduce rigidity of chosen granularity
levels in the model without changing functional behaviour. The system is then partitioned
into functional blocks of synchronous and asynchronous elements before being transformed
into an equivalent circuit which can be synthesised using standard EDA tools
Embedded dynamic programming networks for networks-on-chip
PhD ThesisRelentless technology downscaling and recent technological advancements
in three dimensional integrated circuit (3D-IC) provide a promising
prospect to realize heterogeneous system-on-chip (SoC) and homogeneous
chip multiprocessor (CMP) based on the networks-onchip
(NoCs) paradigm with augmented scalability, modularity and
performance. In many cases in such systems, scheduling and managing
communication resources are the major design and implementation
challenges instead of the computing resources. Past research
efforts were mainly focused on complex design-time or simple heuristic
run-time approaches to deal with the on-chip network resource
management with only local or partial information about the network.
This could yield poor communication resource utilizations and amortize
the benefits of the emerging technologies and design methods.
Thus, the provision for efficient run-time resource management in
large-scale on-chip systems becomes critical. This thesis proposes a
design methodology for a novel run-time resource management infrastructure
that can be realized efficiently using a distributed architecture,
which closely couples with the distributed NoC infrastructure. The
proposed infrastructure exploits the global information and status
of the network to optimize and manage the on-chip communication
resources at run-time.
There are four major contributions in this thesis. First, it presents a
novel deadlock detection method that utilizes run-time transitive closure
(TC) computation to discover the existence of deadlock-equivalence
sets, which imply loops of requests in NoCs. This detection scheme,
TC-network, guarantees the discovery of all true-deadlocks without
false alarms in contrast to state-of-the-art approximation and heuristic
approaches. Second, it investigates the advantages of implementing
future on-chip systems using three dimensional (3D) integration and
presents the design, fabrication and testing results of a TC-network
implemented in a fully stacked three-layer 3D architecture using a
through-silicon via (TSV) complementary metal-oxide semiconductor
(CMOS) technology. Testing results demonstrate the effectiveness
of such a TC-network for deadlock detection with minimal computational
delay in a large-scale network. Third, it introduces an adaptive
strategy to effectively diffuse heat throughout the three dimensional
network-on-chip (3D-NoC) geometry. This strategy employs a dynamic
programming technique to select and optimize the direction of data
manoeuvre in NoC. It leads to a tool, which is based on the accurate
HotSpot thermal model and SystemC cycle accurate model, to simulate
the thermal system and evaluate the proposed approach. Fourth, it
presents a new dynamic programming-based run-time thermal management
(DPRTM) system, including reactive and proactive schemes, to
effectively diffuse heat throughout NoC-based CMPs by routing packets
through the coolest paths, when the temperature does not exceed
chip’s thermal limit. When the thermal limit is exceeded, throttling is
employed to mitigate heat in the chip and DPRTM changes its course
to avoid throttled paths and to minimize the impact of throttling on
chip performance.
This thesis enables a new avenue to explore a novel run-time resource
management infrastructure for NoCs, in which new methodologies
and concepts are proposed to enhance the on-chip networks for
future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)
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Packaging challenges and reliability performance of compound semiconductor focal plane arrays
The development of new high-performance Focal Plane Arrays (FPAs) for imaging systems is driven by advances in photodetector material growth and processing, readout integrated circuits and IR detector chip hybridisation/packaging. The hybridisation of the IR detector chip and the readout integrated circuit (ROIC) through flip-chip bonding is a key packaging challenge for pixel arrays with very small indium bumps and 10-30 m pitch sizes. This paper details the development and use of finite element models that can be used to assess and optimise the compression bonding process, and can enable insights into the impact of chip misalignment on the resulting flip-chip quality and the bonding equipment placement accuracy requirements for a given FPA specification. In addition, the fatigue performance of the indium interconnects of different fine pitch FPAs is evaluated and compared. The modelling results point that high quality interconnects and robust, defects-free assembly require micrometre placement accuracy. It is also possible that indium joints of higher resolution, larger size FPAs accumulate less damage under cryogenic temperature cycling compared to less dense, smaller in size, focal plane arrays
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