High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Towards Faster Data Transfer by Spoof Plasmonics

With the emergence of complex architectures in modern electronics such as multi-chip modules, the increasing electromagnetic cross-talk in the circuitry causes a serious issue for high-speed, reliable data transfer among the chips. This thesis aims at developing a cross-talk resilient communication technology by utilizing a special form of electromagnetic mode, called spoof surface plasmon polariton for information transfer. The technique is based on the fact that a metal wire with periodic sub-wavelength patterns can support the propagation of confined electromagnetic mode, which can suppress cross-talk noise among the adjacent channels; and thus outperform conventional electrical interconnects in a parallel, high channel density data-bus. My developed model shows that, with 1 THz carrier frequency, the optimal design of cross-talk resilient spoof plasmon data-bus would allow each channel to support as high as 300 Gbps data, the bandwidth density can reach 1 Tbps per millimeter width of data-bus, and the digital pulse modulated carrier can travel more than 5 mm distance on the substrate. I have demonstrated that spoof plasmonic interconnects, comprised of patterned metallic conductors, can simultaneously accommodate electronic TEM mode, which is superior in cross-talk suppression at low-frequencies; and spoof plasmon mode, which is superior at high-frequencies. The research work is divided into two complementary parts: developing a theory for electromagnetic property analysis of spoof plasmon waveguide, and manipulating these properties for high-speed data transfer. Based on the theory developed, I investigated the complex interplay among various figure-of-merits of data transfer in spoof plasmonics, such as bandwidth density, propagation loss, thermal noise, speed of modulation, etc. My developed model predicts that with the availability of 1 THz carrier, the bit-error-rate of spoof plasmon data bus, subject to thermal noise would be $sim10^{-8}$ while the Shannon information capacity of the bus would be $10$ Tbps/mm. The model also predicts that, by proper designing of the modulator, it can be possible to alter the transmission property of the waveguide over one-fifth ($1/5$) of the spoof plasmon band which spans from DC frequency to the frequency of spoof plasmon resonance. To exemplify, if the spoof plasmon resonance is set at $1$ THz, then we can achieve more than $200$ Gbps speed of modulation with a very high extinction ratio, assuming the switching latency of the transistors at our disposal is negligible to the time-resolution of interest. We envision spoof plasmonic interconnects to constitute the next generation communication technology that will be transferring data at hundreds of Gigabit per second (Gbps) speed among different chips on a multi-chip module (MCM) carrier or system-on-chip (SoC) packaging.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/163041/1/srjoy_1.pd

Doctor of Philosophy

dissertationCommunication surpasses computation as the power and performance bottleneck in forthcoming exascale processors. Scaling has made transistors cheap, but on-chip wires have grown more expensive, both in terms of latency as well as energy. Therefore, the need for low energy, high performance interconnects is highly pronounced, especially for long distance communication. In this work, we examine two aspects of the global signaling problem. The first part of the thesis focuses on a high bandwidth asynchronous signaling protocol for long distance communication. Asynchrony among intellectual property (IP) cores on a chip has become necessary in a System on Chip (SoC) environment. Traditional asynchronous handshaking protocol suffers from loss of throughput due to the added latency of sending the acknowledge signal back to the sender. We demonstrate a method that supports end-to-end communication across links with arbitrarily large latency, without limiting the bandwidth, so long as line variation can be reliably controlled. We also evaluate the energy and latency improvements as a result of the design choices made available by this protocol. The use of transmission lines as a physical interconnect medium shows promise for deep submicron technologies. In our evaluations, we notice a lower energy footprint, as well as vastly reduced wire latency for transmission line interconnects. We approach this problem from two sides. Using field solvers, we investigate the physical design choices to determine the optimal way to implement these lines for a given back-end-of-line (BEOL) stack. We also approach the problem from a system designer's viewpoint, looking at ways to optimize the lines for different performance targets. This work analyzes the advantages and pitfalls of implementing asynchronous channel protocols for communication over long distances. Finally, the innovations resulting from this work are applied to a network-on-chip design example and the resulting power-performance benefits are reported

Exploration and Design of High Performance Variation Tolerant On-Chip Interconnects

Siirretty Doriast

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects

Design Techniques for Energy-Quality Scalable Digital Systems

Energy efficiency is one of the key design goals in modern computing. Increasingly complex tasks are being executed in mobile devices and Internet of Things end-nodes, which are expected to operate for long time intervals, in the orders of months or years, with the limited energy budgets provided by small form-factor batteries. Fortunately, many of such tasks are error resilient, meaning that they can toler- ate some relaxation in the accuracy, precision or reliability of internal operations, without a significant impact on the overall output quality. The error resilience of an application may derive from a number of factors. The processing of analog sensor inputs measuring quantities from the physical world may not always require maximum precision, as the amount of information that can be extracted is limited by the presence of external noise. Outputs destined for human consumption may also contain small or occasional errors, thanks to the limited capabilities of our vision and hearing systems. Finally, some computational patterns commonly found in domains such as statistics, machine learning and operational research, naturally tend to reduce or eliminate errors. Energy-Quality (EQ) scalable digital systems systematically trade off the quality of computations with energy efficiency, by relaxing the precision, the accuracy, or the reliability of internal software and hardware components in exchange for energy reductions. This design paradigm is believed to offer one of the most promising solutions to the impelling need for low-energy computing. Despite these high expectations, the current state-of-the-art in EQ scalable design suffers from important shortcomings. First, the great majority of techniques proposed in literature focus only on processing hardware and software components. Nonetheless, for many real devices, processing contributes only to a small portion of the total energy consumption, which is dominated by other components (e.g. I/O, memory or data transfers). Second, in order to fulfill its promises and become diffused in commercial devices, EQ scalable design needs to achieve industrial level maturity. This involves moving from purely academic research based on high-level models and theoretical assumptions to engineered flows compatible with existing industry standards. Third, the time-varying nature of error tolerance, both among different applications and within a single task, should become more central in the proposed design methods. This involves designing “dynamic” systems in which the precision or reliability of operations (and consequently their energy consumption) can be dynamically tuned at runtime, rather than “static” solutions, in which the output quality is fixed at design-time. This thesis introduces several new EQ scalable design techniques for digital systems that take the previous observations into account. Besides processing, the proposed methods apply the principles of EQ scalable design also to interconnects and peripherals, which are often relevant contributors to the total energy in sensor nodes and mobile systems respectively. Regardless of the target component, the presented techniques pay special attention to the accurate evaluation of benefits and overheads deriving from EQ scalability, using industrial-level models, and on the integration with existing standard tools and protocols. Moreover, all the works presented in this thesis allow the dynamic reconfiguration of output quality and energy consumption. More specifically, the contribution of this thesis is divided in three parts. In a first body of work, the design of EQ scalable modules for processing hardware data paths is considered. Three design flows are presented, targeting different technologies and exploiting different ways to achieve EQ scalability, i.e. timing-induced errors and precision reduction. These works are inspired by previous approaches from the literature, namely Reduced-Precision Redundancy and Dynamic Accuracy Scaling, which are re-thought to make them compatible with standard Electronic Design Automation (EDA) tools and flows, providing solutions to overcome their main limitations. The second part of the thesis investigates the application of EQ scalable design to serial interconnects, which are the de facto standard for data exchanges between processing hardware and sensors. In this context, two novel bus encodings are proposed, called Approximate Differential Encoding and Serial-T0, that exploit the statistical characteristics of data produced by sensors to reduce the energy consumption on the bus at the cost of controlled data approximations. The two techniques achieve different results for data of different origins, but share the common features of allowing runtime reconfiguration of the allowed error and being compatible with standard serial bus protocols. Finally, the last part of the manuscript is devoted to the application of EQ scalable design principles to displays, which are often among the most energy- hungry components in mobile systems. The two proposals in this context leverage the emissive nature of Organic Light-Emitting Diode (OLED) displays to save energy by altering the displayed image, thus inducing an output quality reduction that depends on the amount of such alteration. The first technique implements an image-adaptive form of brightness scaling, whose outputs are optimized in terms of balance between power consumption and similarity with the input. The second approach achieves concurrent power reduction and image enhancement, by means of an adaptive polynomial transformation. Both solutions focus on minimizing the overheads associated with a real-time implementation of the transformations in software or hardware, so that these do not offset the savings in the display. For each of these three topics, results show that the aforementioned goal of building EQ scalable systems compatible with existing best practices and mature for being integrated in commercial devices can be effectively achieved. Moreover, they also show that very simple and similar principles can be applied to design EQ scalable versions of different system components (processing, peripherals and I/O), and to equip these components with knobs for the runtime reconfiguration of the energy versus quality tradeoff