An On-line BIST RAM Architecture with Self Repair Capabilities

The emerging field of self-repair computing is expected to have a major impact on deployable systems for space missions and defense applications, where high reliability, availability, and serviceability are needed. In this context, RAM (random access memories) are among the most critical components. This paper proposes a built-in self-repair (BISR) approach for RAM cores. The proposed design, introducing minimal and technology-dependent overheads, can detect and repair a wide range of memory faults including: stuck-at, coupling, and address faults. The test and repair capabilities are used on-line, and are completely transparent to the external user, who can use the memory without any change in the memory-access protocol. Using a fault-injection environment that can emulate the occurrence of faults inside the module, the effectiveness of the proposed architecture in terms of both fault detection and repairing capability was verified. Memories of various sizes have been considered to evaluate the area-overhead introduced by this proposed architectur

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Strategies for Optimising DRAM Repair

Dynamic Random Access Memories (DRAM) are large complex devices, prone to defects during manufacture. Yield is improved by the provision of redundant structures used to repair these defects. This redundancy is often implemented by the provision of excess memory capacity and programmable address logic allowing the replacement of faulty cells within the memory array. As the memory capacity of DRAM devices has increased, so has the complexity of their redundant structures, introducing increasingly complex restrictions and interdependencies upon the use of this redundant capacity. Currently redundancy analysis algorithms solving the problem of optimally allocating this redundant capacity must be manually customised for each new device. Compromises made to reduce the complexity, and human error, reduce the efficacy of these algorithms. This thesis develops a methodology for automating the customisation of these redundancy analysis algorithms. Included are: a modelling language describing the redundant structures (including the restrictions and interdependencies placed upon their use), algorithms manipulating this model to generate redundancy analysis algorithms, and methods for translating those algorithms into executable code. Finally these concepts are used to develop a prototype software tool capable of generating redundancy analysis algorithms customised for a specified device

Ultra Reliable Computing Systems

For high security and safety applications as well as general purpose applications, it is necessary to have ultra reliable computing systems. This dissertation describes our system of self-testable and self-repairable digital devices, especially, EPLDs (Electrically Programmable Logic Devices). In addition to significantly improving the reliability of digital systems, our self-healing and re-configurable system design with added repair capability can also provide higher yields, lower testing costs, and faster time-to-market for the semiconductor industry. The digital system in our approach is composed of blocks, which realize combinational and sequential circuits using GALs (Generic Array Logic Devices). We describe three techniques for fault-locating and fault-repairing in these devices. The methodology we used for evaluation of these methods and a comparison with devices that have no self-repair capability was simulation of the self-repair algorithms. Our simulations show that the lifetime for a GAL-based EPLD that uses our multiple self-repairing methods is longer than the lifetime of a GAL-based EPLD that uses a single self-repair method or no self-repair method. Specifically, our work demonstrates that the lifetime of a GAL can be increased by adding extra columns in the AND array of a GAL and extra output ORs in a GAL. It also gives information on how many extra columns and extra ORs a GAL needs and which self-repairing method should be used to guarantee a given lifetime. Thus, we can estimate an ideal point, where the maximum reliability can be reached with the minimum cost