1,700 research outputs found
An On-line BIST RAM Architecture with Self Repair Capabilities
The emerging field of self-repair computing is expected to have a major impact on deployable systems for space missions and defense applications, where high reliability, availability, and serviceability are needed. In this context, RAM (random access memories) are among the most critical components. This paper proposes a built-in self-repair (BISR) approach for RAM cores. The proposed design, introducing minimal and technology-dependent overheads, can detect and repair a wide range of memory faults including: stuck-at, coupling, and address faults. The test and repair capabilities are used on-line, and are completely transparent to the external user, who can use the memory without any change in the memory-access protocol. Using a fault-injection environment that can emulate the occurrence of faults inside the module, the effectiveness of the proposed architecture in terms of both fault detection and repairing capability was verified. Memories of various sizes have been considered to evaluate the area-overhead introduced by this proposed architectur
Investigations into the feasibility of an on-line test methodology
This thesis aims to understand how information coding and the protocol that it
supports can affect the characteristics of electronic circuits. More specifically, it
investigates an on-line test methodology called IFIS (If it Fails It Stops) and its
impact on the design, implementation and subsequent characteristics of circuits
intended for application specific lC (ASIC) technology.
The first study investigates the influences of information coding and protocol on the
characteristics of IFIS systems. The second study investigates methods of circuit
design applicable to IFIS cells and identifies theĀ· technique possessing the
characteristics most suitable for on-line testing. The third study investigates the
characteristics of a 'real-life' commercial UART re-engineered using the techniques
resulting from the previous two studies. The final study investigates the effects of the
halting properties endowed by the protocol on failure diagnosis within IFIS systems.
The outcome of this work is an identification and characterisation of the factors that
influence behaviour, implementation costs and the ability to test and diagnose IFIS
designs
Submicron Systems Architecture Project : Semiannual Technical Report
The Mosaic C is an experimental fine-grain multicomputer
based on single-chip nodes. The Mosaic C chip includes 64KB of fast dynamic RAM,
processor, packet interface, ROM for bootstrap and self-test, and a two-dimensional selftimed
router. The chip architecture provides low-overhead and low-latency handling of
message packets, and high memory and network bandwidth. Sixty-four Mosaic chips are
packaged by tape-automated bonding (TAB) in an 8 x 8 array on circuit boards that can, in
turn, be arrayed in two dimensions to build arbitrarily large machines. These 8 x 8 boards are
now in prototype production under a subcontract with Hewlett-Packard. We are planning
to construct a 16K-node Mosaic C system from 256 of these boards. The suite of Mosaic
C hardware also includes host-interface boards and high-speed communication cables. The
hardware developments and activities of the past eight months are described in section 2.1.
The programming system that we are developing for the Mosaic C is based on the
same message-passing, reactive-process, computational model that we have used with earlier
multicomputers, but the model is implemented for the Mosaic in a way that supports finegrain
concurrency. A process executes only in response to receiving a message, and may in
execution send messages, create new processes, and modify its persistent variables before
it either exits or becomes dormant in preparation for receiving another message. These
computations are expressed in an object-oriented programming notation, a derivative of
C++ called C+-. The computational model and the C+- programming notation are
described in section 2.2. The Mosaic C runtime system, which is written in C+-, provides
automatic process placement and highly distributed management of system resources. The
Mosaic C runtime system is described in section 2.3
Design for pre-bond testability in 3D integrated circuits
In this dissertation we propose several DFT techniques specific to 3D
stacked IC systems. The goal has explicitly been to create techniques that
integrate easily with existing IC test systems. Specifically, this means
utilizing scan- and wrapper-based techniques, two foundations
of the digital IC test industry.
First, we describe a general test architecture for 3D ICs. In this
architecture, each tier of a 3D design is wrapped in test control logic that
both manages tier test
pre-bond and integrates the tier into the large test architecture post-bond.
We describe a new kind of boundary scan to provide the necessary test control
and observation of the partial circuits, and we propose
a new design methodology for test hardcore that ensures both pre-bond functionality
and post-bond optimality. We present the application of these techniques to
the 3D-MAPS test vehicle, which has proven their effectiveness.
Second, we extend these DFT techniques to circuit-partitioned designs. We find
that boundary scan design is generally sufficient, but that some 3D designs require
special DFT treatment. Most importantly, we demonstrate that the functional
partitioning inherent in 3D design can potentially decrease the total test cost
of verifying a circuit.
Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm
co-designs the pre-bond and post-bond wrappers to simultaneously minimize test
time and routing cost. On average, our algorithm utilizes over 90% of the wires
in both the pre-bond and post-bond wrappers.
Finally, we look at the 3D vias themselves to develop a low-cost, high-volume
pre-bond test methodology appropriate for production-level test. We describe
the shorting probes methodology, wherein large test probes are used to contact
multiple small 3D vias. This technique is an all-digital test method that
integrates seamlessly into existing test flows. Our
experimental results demonstrate two key facts: neither the large capacitance
of the probe tips nor the process variation in the 3D vias and the probe tips
significantly hinders the testability of the circuits.
Taken together, this body of work defines a complete test methodology for
testing 3D ICs pre-bond, eliminating one of the key hurdles to the
commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka
Identifying worst case test vectors for FPGA exposed to total ionization dose using design for testability techniques
Electronic devices often operate in harsh environments which contain a variation of radiation sources. Radiation may cause different kinds of damage to proper operation of the devices. Their sources can be found in terrestrial environments, or in extra-terrestrial environments like in space, or in man-made radiation sources like nuclear reactors, biomedical devices and high energy particles physics experiments equipment. Depending on the operation environment of the device, the radiation resultant effect manifests in several forms like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). TID effect causes an increase in the delay and the leakage current of CMOS circuits which may damage the proper operation of the integrated circuit. To ensure proper operation of these devices under radiation, thorough testing must be made especially in critical applications like space and military applications. Although the standard which describes the procedure for testing electronic devices under radiation emphasizes the use of worst case test vectors (WCTVs), they are never used in radiation testing due to the difficulty of generating these vectors for circuits under test. For decades, design for testability (DFT) has been the best choice for test engineers to test digital circuits in industry. It has become a very mature technology that can be relied on. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Surprisingly, however, radiation testing has not yet made use of this reliable technology. In this thesis, a novel methodology is proposed to extend the usage of DFT to generate WCTVs for delay failure in Flash based field programmable gate arrays (FPGAs) exposed to total ionizing dose (TID). The methodology is validated using MicroSemi ProASIC3 FPGA and cobalt 60 facility
An Experimental Study of the Effect of Shared Information on Pilot/Controller Re-Route Negotiation
Airāground data link systems are being developed to enable pilots and air traffic controllers to
share information more fully. The sharing of information is generally expected to enhance their
shared situation awareness and foster more collaborative decision making.
An exploratory, part-task simulator experiment is described which evaluates the extent to which
shared information may lead pilots and controllers to cooperate or compete when negotiating
route amendments. The results indicate an improvement in situation awareness for pilots and
controllers and a willingness to work cooperatively.
Independent of data link considerations, the experiment also demonstrates the value of providing
controllers with a good-quality weather representation on their plan view displays. Observed
improvements in situation awareness and separation assurance are discussed. It is argued that
deployment of this relatively simple, low-risk addition to the plan view displays be accelerated.the National Aeronautics and Space Administration Ames
Research Center under grant NAG 2-716 and by The Analytical Sciences Corporation (TASC) as
part of the FAA Center of Excellence in Operations Research
Analysis and Test of the Effects of Single Event Upsets Affecting the Configuration Memory of SRAM-based FPGAs
SRAM-based FPGAs are increasingly relevant in a growing number of safety-critical application fields, ranging from automotive to aerospace. These application fields are characterized by a harsh radiation environment that can cause the occurrence of Single Event Upsets (SEUs) in digital devices. These faults have particularly adverse effects on SRAM-based FPGA systems because not only can they temporarily affect
the behaviour of the system by changing the contents of flip-flops or memories, but they can also permanently change the functionality implemented by the system itself, by changing the content of the configuration memory. Designing safety-critical applications requires accurate methodologies to evaluate the systemās sensitivity to SEUs as early as possible during the design process. Moreover it is necessary to detect the occurrence of SEUs during the system life-time. To this purpose test patterns should be generated during the design process, and then applied to the inputs of the system during its operation. In this thesis we propose a set of software tools that could be used by designers of SRAM-based FPGA safety-critical applications to assess the sensitivity to SEUs of the system and to generate test patterns for in-service testing. The main feature of these tools is that they implement a model of SEUs affecting the configuration bits controlling the logic and routing resources of an FPGA device that has been demonstrated to be much more accurate than the classical stuck-at and open/short models, that are
commonly used in the analysis of faults in digital devices. By keeping this accurate
fault model into account, the proposed tools are more accurate than similar academic and commercial tools today available for the analysis of faults in digital circuits, that do not take into account the features of the FPGA technology..
In particular three tools have been designed and developed: (i) ASSESS: Accurate Simulator of SEuS affecting the configuration memory of SRAM-based FPGAs, a simulator of SEUs affecting the configuration memory of an SRAM-based FPGA system
for the early assessment of the sensitivity to SEUs; (ii) UA2TPG: Untestability Analyzer
and Automatic Test Pattern Generator for SEUs Affecting the Configuration Memory of SRAM-based FPGAs, a static analysis tool for the identification of the untestable SEUs and for the automatic generation of test patterns for in-service testing of the 100% of the testable SEUs; and (iii) GABES: Genetic Algorithm Based Environment for SEU Testing in SRAM-FPGAs, a Genetic Algorithm-based Environment for the generation of an optimized set of test patterns for in-service testing of SEUs. The proposed tools have been applied to some circuits from the ITCā99 benchmark. The results obtained from these experiments have been compared with results
obtained by similar experiments in which we considered the stuck-at fault model, instead
of the more accurate model for SEUs. From the comparison of these experiments we have been able to verify that the proposed software tools are actually more accurate than similar tools today available. In particular the comparison between results obtained using ASSESS with those obtained by fault injection has shown that the proposed fault simulator has an average error of 0:1% and a maximum error of 0:5%, while using a stuck-at fault simulator the average error with respect of the fault injection experiment has been 15:1% with a maximum error of 56:2%. Similarly the comparison between the results obtained using UA2TPG for the accurate SEU model, with the results obtained for stuck-at faults has shown an average difference of untestability of 7:9% with a maximum of 37:4%. Finally the comparison between
fault coverages obtained by test patterns generated for the accurate model of SEUs and the fault coverages obtained by test pattern designed for stuck-at faults, shows that the former detect the 100% of the testable faults, while the latter reach an average fault coverage of 78:9%, with a minimum of 54% and a maximum of 93:16%
- ā¦