279 research outputs found

    Two-dimensional placement compaction using an evolutionary approach: a study

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    The placement problem of two-dimensional objects over planar surfaces optimizing given utility functions is a combinatorial optimization problem. Our main drive is that of surveying genetic algorithms and hybrid metaheuristics in terms of final positioning area compaction of the solution. Furthermore, a new hybrid evolutionary approach, combining a genetic algorithm merged with a non-linear compaction method is introduced and compared with referenced literature heuristics using both randomly generated instances and benchmark problems. A wide variety of experiments is made, and the respective results and discussions are presented. Finally, conclusions are drawn, and future research is defined

    Global Approaches for Facility Layout and VLSI Floorplanning

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    This paper summarizes recent advances in the global solution of several relevant facility layout problems

    Global Approaches for Facility Layout and VLSI Floorplanning

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    This paper summarizes recent advances in the global solution of several relevant facility layout problems

    Energy Efficient Network Generation for Application Specific NoC

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    Networks-on-Chip is emerging as a communication platform for future complex SoC designs, composed of a large number of homogenous or heterogeneous processing resources. Most SoC platforms are customized to the domainspecific requirements of their applications, which communicate in a specific, mostly irregular way. The specific but often diverse communication requirements among cores of the SoC call for the design of application-specific network of SoC for improved performance in terms of communication energy, latency, and throughput. In this work, we propose a methodology for the design of customized irregular network architecture of SoC. The proposed method exploits priori knowledge of the application2019;s communication characteristic to generate an energy optimized network and corresponding routing tables

    Optimal Solution for VLSI Physical Design Automation Using Hybrid Genetic Algorithm

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    In Optimization of VLSI Physical Design, area minimization and interconnect length minimization is an important objective in physical design automation of very large scale integration chips. The objective of minimizing the area and interconnect length would scale down the size of integrated chips. To meet the above objective, it is necessary to find an optimal solution for physical design components like partitioning, floorplanning, placement, and routing. This work helps to perform the optimization of the benchmark circuits with the above said components of physical design using hierarchical approach of evolutionary algorithms. The goal of minimizing the delay in partitioning, minimizing the silicon area in floorplanning, minimizing the layout area in placement, minimizing the wirelength in routing has indefinite influence on other criteria like power, clock, speed, cost, and so forth. Hybrid evolutionary algorithm is applied on each of its phases to achieve the objective. Because evolutionary algorithm that includes one or many local search steps within its evolutionary cycles to obtain the minimization of area and interconnect length. This approach combines a hierarchical design like genetic algorithm and simulated annealing to attain the objective. This hybrid approach can quickly produce optimal solutions for the popular benchmarks

    Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

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    Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

    Design synthesis for dynamically reconfigurable logic systems

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    Dynamic reconfiguration of logic circuits has been a research problem for over four decades. While applications using logic reconfiguration in practical scenarios have been demonstrated, the design of these systems has proved to be a difficult process demanding the skills of an experienced reconfigurable logic design expert. This thesis proposes an automatic synthesis method which relieves designers of some of the difficulties associated with designing partially dynamically reconfigurable systems. A new design abstraction model for reconfigurable systems is proposed in order to support design exploration using the presented method. Given an input behavioural model, a technology server and a set of design constraints, the method will generate a reconfigurable design solution in the form of a 3D floorplan and a configuration schedule. The approach makes use of genetic algorithms. It facilitates global optimisation to accommodate multiple design objectives common in reconfigurable system design, while making realistic estimates of configuration overheads and of the potential for resource sharing between configurations. A set of custom evolutionary operators has been developed to cope with a multiple-objective search space. Furthermore, the application of a simulation technique verifying the lll results of such an automatic exploration is outlined in the thesis. The qualities of the proposed method are evaluated using a set of benchmark designs taking data from a real reconfigurable logic technology. Finally, some extensions to the proposed method and possible research directions are discussed

    TSV placement optimization for liquid cooled 3D-ICs with emerging NVMs

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    Three dimensional integrated circuits (3D-ICs) are a promising solution to the performance bottleneck in planar integrated circuits. One of the salient features of 3D-ICs is their ability to integrate heterogeneous technologies such as emerging non-volatile memories (NVMs) in a single chip. However, thermal management in 3D-ICs is a significant challenge, owing to the high heat flux (~ 250 W/cm2). Several research groups have focused either on run-time or design-time mechanisms to reduce the heat flux and did not consider 3D-ICs with heterogeneous stacks. The goal of this work is to achieve a balanced thermal gradient in 3D-ICs, while reducing the peak temperatures. In this research, placement algorithms for design-time optimization and choice of appropriate cooling mechanisms for run-time modulation of temperature are proposed. Specifically, an architectural framework which introduce weight-based simulated annealing (WSA) algorithm for thermal-aware placement of through silicon vias (TSVs) with inter-tier liquid cooling is proposed for design-time. In addition, integrating a dedicated stack of emerging NVMs such as RRAM, PCRAM and STTRAM, a run-time simulation framework is developed to analyze the thermal and performance impact of these NVMs in 3D-MPSoCs with inter-tier liquid cooling. Experimental results of WSA algorithm implemented on MCNC91 and GSRC benchmarks demonstrate up to 11 K reduction in the average temperature across the 3D-IC chip. In addition, power density arrangement in WSA improved the uniformity by 5%. Furthermore, simulation results of PARSEC benchmarks with NVM L2 cache demonstrates a temperature reduction of 12.5 K (RRAM) compared to SRAM in 3D-ICs. Especially, RRAM has proved to be thermally efficient replacement for SRAM with 34% lower energy delay product (EDP) and 9.7 K average temperature reduction

    Accuracy Improvement of VLSI Floorplanning Based on Fuzzy Inference and GA/SA

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    Rapid increase of the scale of integration requires higher knowledge and well trained skills of experienced design engineers. However it is usually difficult for novice engineers to perform optimized design of initial and macroscopic placement in floorplanning. This paper proposes to apply the soft computing technology mostly fuzzy inference and genetic algorithms to automate the floorplanning design which decides a macroscopic placement of the top layer of LSI physical implementation. ISPD98 benchmark data is used for evaluation. The relation among several parameters of fuzzy inference and genetic algorithms and placement cost is discussed. The relation between I/O pins and the cost is also discussed. Simulated annealing is employed after genetic algorithms to avoid local optimization
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