Clock Generator Circuits for Low-Power Heterogeneous Multiprocessor Systems-on-Chip

In this work concepts and circuits for local clock generation in low-power heterogeneous multiprocessor systems-on-chip (MPSoCs) are researched and developed. The targeted systems feature a globally asynchronous locally synchronous (GALS) clocking architecture and advanced power management functionality, as for example fine-grained ultra-fast dynamic voltage and frequency scaling (DVFS). To enable this functionality compact clock generators with low chip area, low power consumption, wide output frequency range and the capability for ultra-fast frequency changes are required. They are to be instantiated individually per core. For this purpose compact all digital phase-locked loop (ADPLL) frequency synthesizers are developed. The bang-bang ADPLL architecture is analyzed using a numerical system model and optimized for low jitter accumulation. A 65nm CMOS ADPLL is implemented, featuring a novel active current bias circuit which compensates the supply voltage and temperature sensitivity of the digitally controlled oscillator (DCO) for reduced digital tuning effort. Additionally, a 28nm ADPLL with a new ultra-fast lock-in scheme based on single-shot phase synchronization is proposed. The core clock is generated by an open-loop method using phase-switching between multi-phase DCO clocks at a fixed frequency. This allows instantaneous core frequency changes for ultra-fast DVFS without re-locking the closed loop ADPLL. The sensitivity of the open-loop clock generator with respect to phase mismatch is analyzed analytically and a compensation technique by cross-coupled inverter buffers is proposed. The clock generators show small area (0.0097mm2 (65nm), 0.00234mm2 (28nm)), low power consumption (2.7mW (65nm), 0.64mW (28nm)) and they provide core clock frequencies from 83MHz to 666MHz which can be changed instantaneously. The jitter performance is compliant to DDR2/DDR3 memory interface specifications. Additionally, high-speed clocks for novel serial on-chip data transceivers are generated. The ADPLL circuits have been verified successfully by 3 testchip implementations. They enable efficient realization of future low-power MPSoCs with advanced power management functionality in deep-submicron CMOS technologies.In dieser Arbeit werden Konzepte und Schaltungen zur lokalen Takterzeugung in heterogenen Multiprozessorsystemen (MPSoCs) mit geringer Verlustleistung erforscht und entwickelt. Diese Systeme besitzen eine global-asynchrone lokal-synchrone Architektur sowie Funktionalität zum Power Management, wie z.B. das feingranulare, schnelle Skalieren von Spannung und Taktfrequenz (DVFS). Um diese Funktionalität zu realisieren werden kompakte Taktgeneratoren benötigt, welche eine kleine Chipfläche einnehmen, wenig Verlustleitung aufnehmen, einen weiten Bereich an Ausgangsfrequenzen erzeugen und diese sehr schnell ändern können. Sie sollen individuell pro Prozessorkern integriert werden. Dazu werden kompakte volldigitale Phasenregelkreise (ADPLLs) entwickelt, wobei eine bang-bang ADPLL Architektur numerisch modelliert und für kleine Jitterakkumulation optimiert wird. Es wird eine 65nm CMOS ADPLL implementiert, welche eine neuartige Kompensationsschlatung für den digital gesteuerten Oszillator (DCO) zur Verringerung der Sensitivität bezüglich Versorgungsspannung und Temperatur beinhaltet. Zusätzlich wird eine 28nm CMOS ADPLL mit einer neuen Technik zum schnellen Einschwingen unter Nutzung eines Phasensynchronisierers realisiert. Der Prozessortakt wird durch ein neuartiges Phasenmultiplex- und Frequenzteilerverfahren erzeugt, welches es ermöglicht die Taktfrequenz sofort zu ändern um schnelles DVFS zu realisieren. Die Sensitivität dieses Frequenzgenerators bezüglich Phasen-Mismatch wird theoretisch analysiert und durch Verwendung von kreuzgekoppelten Taktverstärkern kompensiert. Die hier entwickelten Taktgeneratoren haben eine kleine Chipfläche (0.0097mm2 (65nm), 0.00234mm2 (28nm)) und Leistungsaufnahme (2.7mW (65nm), 0.64mW (28nm)). Sie stellen Frequenzen von 83MHz bis 666MHz bereit, welche sofort geändert werden können. Die Schaltungen erfüllen die Jitterspezifikationen von DDR2/DDR3 Speicherinterfaces. Zusätzliche können schnelle Takte für neuartige serielle on-Chip Verbindungen erzeugt werden. Die ADPLL Schaltungen wurden erfolgreich in 3 Testchips erprobt. Sie ermöglichen die effiziente Realisierung von zukünftigen MPSoCs mit Power Management in modernsten CMOS Technologien

Exploring Adaptive Implementation of On-Chip Networks

As technology geometries have shrunk to the deep submicron regime, the communication delay and power consumption of global interconnections in high performance Multi- Processor Systems-on-Chip (MPSoCs) are becoming a major bottleneck. The Network-on- Chip (NoC) architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication issues such as performance limitations of long interconnects and integration of large number of Processing Elements (PEs) on a chip. The choice of routing protocol and NoC structure can have a significant impact on performance and power consumption in on-chip networks. In addition, building a high performance, area and energy efficient on-chip network for multicore architectures requires a novel on-chip router allowing a larger network to be integrated on a single die with reduced power consumption. On top of that, network interfaces are employed to decouple computation resources from communication resources, to provide the synchronization between them, and to achieve backward compatibility with existing IP cores. Three adaptive routing algorithms are presented as a part of this thesis. The first presented routing protocol is a congestion-aware adaptive routing algorithm for 2D mesh NoCs which does not support multicast (one-to-many) traffic while the other two protocols are adaptive routing models supporting both unicast (one-to-one) and multicast traffic. A streamlined on-chip router architecture is also presented for avoiding congested areas in 2D mesh NoCs via employing efficient input and output selection. The output selection utilizes an adaptive routing algorithm based on the congestion condition of neighboring routers while the input selection allows packets to be serviced from each input port according to its congestion level. Moreover, in order to increase memory parallelism and bring compatibility with existing IP cores in network-based multiprocessor architectures, adaptive network interface architectures are presented to use multiple SDRAMs which can be accessed simultaneously. In addition, a smart memory controller is integrated in the adaptive network interface to improve the memory utilization and reduce both memory and network latencies. Three Dimensional Integrated Circuits (3D ICs) have been emerging as a viable candidate to achieve better performance and package density as compared to traditional 2D ICs. In addition, combining the benefits of 3D IC and NoC schemes provides a significant performance gain for 3D architectures. In recent years, inter-layer communication across multiple stacked layers (vertical channel) has attracted a lot of interest. In this thesis, a novel adaptive pipeline bus structure is proposed for inter-layer communication to improve the performance by reducing the delay and complexity of traditional bus arbitration. In addition, two mesh-based topologies for 3D architectures are also introduced to mitigate the inter-layer footprint and power dissipation on each layer with a small performance penalty.Siirretty Doriast

Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Fuse-N: Framework for unified simulation environment for network-on-chip

Steady advancements in semiconductor technology over the past few decades have marked incipience of Multi-Processor System-on-Chip (MPSoCs). Owing to the inability of traditional bus-based communication system to scale well with improving microchip technologies, researchers have proposed Network-on-Chip (NoC) as the on-chip communication model. Current uni-processor centric modeling methodology does not address the new design challenges introduced by MPSoCs, thus calling for efficient simulation frameworks capable of capturing the interplay between the application, the architecture, and the network. Addressing these new challenges requires a framework that assists the designer at different abstraction levels of system design; This thesis concentrates on developing a framework for unified simulation environment for NoCs (fuse-N) which simplifies the design space exploration for NoCs by offering a comprehensive simulation support. The framework synthesizes the network infrastructure and the communication model and optimizes application mapping for design constraints. The proposed framework is a hardware-software co-design implementation using SystemC 2.1 and C++. Simulation results show the architectural, network and resource allocation behavior and highlight the quantitative relationships between various design choices; Also, a novel off-line non-preemptive static Traffic Aware Scheduling (TAS) policy is proposed for hard NoC platforms. The proposed scheduling policy maps the application onto the NoC architecture keeping track of the network traffic, which is generated with every resource and communication path allocation. TAS has been evaluated for various design metrics such as application completion time, resource utilization and task throughput. Simulation results show significant improvements over traditional approaches

Proceedings of the 5th International Workshop on Reconfigurable Communication-centric Systems on Chip 2010 - ReCoSoC\u2710 - May 17-19, 2010 Karlsruhe, Germany. (KIT Scientific Reports ; 7551)

ReCoSoC is intended to be a periodic annual meeting to expose and discuss gathered expertise as well as state of the art research around SoC related topics through plenary invited papers and posters. The workshop aims to provide a prospective view of tomorrow\u27s challenges in the multibillion transistor era, taking into account the emerging techniques and architectures exploring the synergy between flexible on-chip communication and system reconfigurability

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this monograph, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-ar

Low-Power Embedded Design Solutions and Low-Latency On-Chip Interconnect Architecture for System-On-Chip Design

This dissertation presents three design solutions to support several key system-on-chip (SoC) issues to achieve low-power and high performance. These are: 1) joint source and channel decoding (JSCD) schemes for low-power SoCs used in portable multimedia systems, 2) efficient on-chip interconnect architecture for massive multimedia data streaming on multiprocessor SoCs (MPSoCs), and 3) data processing architecture for low-power SoCs in distributed sensor network (DSS) systems and its implementation. The first part includes a low-power embedded low density parity check code (LDPC) - H.264 joint decoding architecture to lower the baseband energy consumption of a channel decoder using joint source decoding and dynamic voltage and frequency scaling (DVFS). A low-power multiple-input multiple-output (MIMO) and H.264 video joint detector/decoder design that minimizes energy for portable, wireless embedded systems is also designed. In the second part, a link-level quality of service (QoS) scheme using unequal error protection (UEP) for low-power network-on-chip (NoC) and low latency on-chip network designs for MPSoCs is proposed. This part contains WaveSync, a low-latency focused network-on-chip architecture for globally-asynchronous locally-synchronous (GALS) designs and a simultaneous dual-path routing (SDPR) scheme utilizing path diversity present in typical mesh topology network-on-chips. SDPR is akin to having a higher link width but without the significant hardware overhead associated with simple bus width scaling. The last part shows data processing unit designs for embedded SoCs. We propose a data processing and control logic design for a new radiation detection sensor system generating data at or above Peta-bits-per-second level. Implementation results show that the intended clock rate is achieved within the power target of less than 200mW. We also present a digital signal processing (DSP) accelerator supporting configurable MAC, FFT, FIR, and 3-D cross product operations for embedded SoCs. It consumes 12.35mW along with 0.167mm2 area at 333MHz

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu