Baseband analog front-end and digital back-end for reconfigurable multi-standard terminals

Multimedia applications are driving wireless network operators to add high-speed data services such as Edge (E-GPRS), WCDMA (UMTS) and WLAN (IEEE 802.11a,b,g) to the existing GSM network. This creates the need for multi-mode cellular handsets that support a wide range of communication standards, each with a different RF frequency, signal bandwidth, modulation scheme etc. This in turn generates several design challenges for the analog and digital building blocks of the physical layer. In addition to the above-mentioned protocols, mobile devices often include Bluetooth, GPS, FM-radio and TV services that can work concurrently with data and voice communication. Multi-mode, multi-band, and multi-standard mobile terminals must satisfy all these different requirements. Sharing and/or switching transceiver building blocks in these handsets is mandatory in order to extend battery life and/or reduce cost. Only adaptive circuits that are able to reconfigure themselves within the handover time can meet the design requirements of a single receiver or transmitter covering all the different standards while ensuring seamless inter-interoperability. This paper presents analog and digital base-band circuits that are able to support GSM (with Edge), WCDMA (UMTS), WLAN and Bluetooth using reconfigurable building blocks. The blocks can trade off power consumption for performance on the fly, depending on the standard to be supported and the required QoS (Quality of Service) leve

Exploring Adaptive Implementation of On-Chip Networks

As technology geometries have shrunk to the deep submicron regime, the communication delay and power consumption of global interconnections in high performance Multi- Processor Systems-on-Chip (MPSoCs) are becoming a major bottleneck. The Network-on- Chip (NoC) architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication issues such as performance limitations of long interconnects and integration of large number of Processing Elements (PEs) on a chip. The choice of routing protocol and NoC structure can have a significant impact on performance and power consumption in on-chip networks. In addition, building a high performance, area and energy efficient on-chip network for multicore architectures requires a novel on-chip router allowing a larger network to be integrated on a single die with reduced power consumption. On top of that, network interfaces are employed to decouple computation resources from communication resources, to provide the synchronization between them, and to achieve backward compatibility with existing IP cores. Three adaptive routing algorithms are presented as a part of this thesis. The first presented routing protocol is a congestion-aware adaptive routing algorithm for 2D mesh NoCs which does not support multicast (one-to-many) traffic while the other two protocols are adaptive routing models supporting both unicast (one-to-one) and multicast traffic. A streamlined on-chip router architecture is also presented for avoiding congested areas in 2D mesh NoCs via employing efficient input and output selection. The output selection utilizes an adaptive routing algorithm based on the congestion condition of neighboring routers while the input selection allows packets to be serviced from each input port according to its congestion level. Moreover, in order to increase memory parallelism and bring compatibility with existing IP cores in network-based multiprocessor architectures, adaptive network interface architectures are presented to use multiple SDRAMs which can be accessed simultaneously. In addition, a smart memory controller is integrated in the adaptive network interface to improve the memory utilization and reduce both memory and network latencies. Three Dimensional Integrated Circuits (3D ICs) have been emerging as a viable candidate to achieve better performance and package density as compared to traditional 2D ICs. In addition, combining the benefits of 3D IC and NoC schemes provides a significant performance gain for 3D architectures. In recent years, inter-layer communication across multiple stacked layers (vertical channel) has attracted a lot of interest. In this thesis, a novel adaptive pipeline bus structure is proposed for inter-layer communication to improve the performance by reducing the delay and complexity of traditional bus arbitration. In addition, two mesh-based topologies for 3D architectures are also introduced to mitigate the inter-layer footprint and power dissipation on each layer with a small performance penalty.Siirretty Doriast

Balancing reliability, cost, and performance tradeoffs with FreeFault

Abstract—Memory errors have been a major source of system failures and fault rates may rise even further as memory continues to scale. This increasing fault rate, especially when combined with advent of integrated on-package memories, may exceed the capabilities of traditional fault tolerance mecha-nisms or significantly increase their overhead. In this paper, we present FreeFault as a hardware-only, transparent, and nearly-free resilience mechanism that is implemented entirely within a processor and can tolerate the majority of DRAM faults. FreeFault repurposes portions of the last-level cache for storing retired memory regions and augments a hardware memory scrubber to monitor memory health and aid retirement decisions. Because it relies on existing structures (cache associativity) for retirement/remapping type repair, FreeFault has essentially no hardware overhead. Because it requires a very modest portion of the cache (as small as 8KB) to cover a large fraction of DRAM faults, FreeFault has almost no impact on performance. We explain how FreeFault adds an attractive layer in an overall resilience scheme of highly-reliable and highly-available systems by delaying, and even entirely avoiding, calling upon software to make tradeoff decisions between memory capacity, performance, and reliability. I

Implementation and Evaluation of an NoC Architecture for FPGAs

The Networks-on-Chip (NoC) approach for designing Systems-on-Chip (SoC) is currently emerging as an advanced concept for overcoming the scalability and efficiency problems of traditional bus-based systems. A great deal of theoretical research has been done in this area that provides good insight and shows promising results. There is a great need for research in hardware implementation of NoC-based systems to determine the feasibility of implementing various topologies and protocols, and also to accurately determine what design tradeoffs are involved in NoC implementation. This thesis addresses the challenges of implementing an NoC-based system on FPGAs for running real benchmark applications. The NoC used a mesh topology and circuit-switched communication protocol. An experimental framework was developed that allowed implementation of NoC-based system from a high level specification, using the Celoxica Handel-C hardware description language. Two test applications: charged couple device (CCD) and JPEG were developed in Handel-C to be used as our benchmark applications. Both benchmarks are computational expensive and require large quantities of data transfer that will test the NoC system. Implementation results show that the NoC-based system gives superior area utilization and speed performance compared to the bus-based system, running the same benchmarks

Doctor of Philosophy

dissertationIn recent years, a number of trends have started to emerge, both in microprocessor and application characteristics. As per Moore's law, the number of cores on chip will keep doubling every 18-24 months. International Technology Roadmap for Semiconductors (ITRS) reports that wires will continue to scale poorly, exacerbating the cost of on-chip communication. Cores will have to navigate an on-chip network to access data that may be scattered across many cache banks. The number of pins on the package, and hence available off-chip bandwidth, will at best increase at sublinear rate and at worst, stagnate. A number of disruptive memory technologies, e.g., phase change memory (PCM) have begun to emerge and will be integrated into the memory hierarchy sooner than later, leading to non-uniform memory access (NUMA) hierarchies. This will make the cost of accessing main memory even higher. In previous years, most of the focus has been on deciding the memory hierarchy level where data must be placed (L1 or L2 caches, main memory, disk, etc.). However, in modern and future generations, each level is getting bigger and its design is being subjected to a number of constraints (wire delays, power budget, etc.). It is becoming very important to make an intelligent decision about where data must be placed within a level. For example, in a large non-uniform access cache (NUCA), we must figure out the optimal bank. Similarly, in a multi-dual inline memory module (DIMM) non uniform memory access (NUMA) main memory, we must figure out the DIMM that is the optimal home for every data page. Studies have indicated that heterogeneous main memory hierarchies that incorporate multiple memory technologies are on the horizon. We must develop solutions for data management that take heterogeneity into account. For these memory organizations, we must again identify the appropriate home for data. In this dissertation, we attempt to verify the following thesis statement: "Can low-complexity hardware and OS mechanisms manage data placement within each memory hierarchy level to optimize metrics such as performance and/or throughput?" In this dissertation we argue for a hardware-software codesign approach to tackle the above mentioned problems at different levels of the memory hierarchy. The proposed methods utilize techniques like page coloring and shadow addresses and are able to handle a large number of problems ranging from managing wire-delays in large, shared NUCA caches to distributing shared capacity among different cores. We then examine data-placement issues in NUMA main memory for a many-core processor with a moderate number of on-chip memory controllers. Using codesign approaches, we achieve efficient data placement by modifying the operating system's (OS) page allocation algorithm for a wide variety of main memory architectures

Fault- and Yield-Aware On-Chip Memory Design and Management

Ever decreasing device size causes more frequent hard faults, which becomes a serious burden to processor design and yield management. This problem is particularly pronounced in the on-chip memory which consumes up to 70% of a processor' s total chip area. Traditional circuit-level techniques, such as redundancy and error correction code, become less effective in error-prevalent environments because of their large area overhead. In this work, we suggest an architectural solution to building reliable on-chip memory in the future processor environment. Our approaches have two parts, a design framework and architectural techniques for on-chip memory structures. Our design framework provides important architectural evaluation metrics such as yield, area, and performance based on low level defects and process variations parameters. Processor architects can quickly evaluate their designs' characteristics in terms of yield, area, and performance. With the framework, we develop architectural yield enhancement solutions for on-chip memory structures including L1 cache, L2 cache and directory memory. Our proposed solutions greatly improve yield with negligible area and performance overhead. Furthermore, we develop a decoupled yield model of compute cores and L2 caches in CMPs, which show that there will be many more L2 caches than compute cores in a chip. We propose efficient utilization techniques for excess caches. Evaluation results show that excess caches significantly improve overall performance of CMPs

Enabling a reliable STT-MRAM main memory simulation

STT-MRAM is a promising new memory technology with very desirable set of properties such as non-volatility, byte-addressability and high endurance. It has the potential to become the universal memory that could be incorporated to all levels of memory hierarchy. Although STT-MRAM technology got significant attention of various major memory manufacturers, to this day, academic research of STT-MRAM main memory remains marginal. This is mainly due to the unavailability of publicly available detailed timing parameters which are required to perform a cycle accurate main memory simulation. Our study presents a detailed analysis of STT-MRAM main memory timing and propose an approach to perform a reliable system level simulation of the memory technology. We seamlessly incorporate STT-MRAM timing parameters into DRAMSim2 memory simulator and use it as a part of the simulation infrastructure of the high-performance computing (HPC) systems. Our results suggests that, STT-MRAM main memory would provide performance comparable to DRAM, while opening up various opportunities for HPC system improvements. Most importantly, our study enables researchers to conduct reliable system level research on STT-MRAM main memory, and to explore the opportunities that this technology has to offer.This work was supported by BSC, Spanish Government through Programa Severo Ochoa (SEV-2015-0493), by the Spanish Ministry of Science and Technology through TIN2015-65316-P project and by the Generalitat de Catalunya (contracts 2014-SGR-1051 and 2014-SGR-1272). This work has also received funding from the European Union's Horizon 2020 research and innovation programme under ExaNoDe project (grant agreement No 671578). The authors wish to thank Terry Hulett, Duncan Bennett and Ben Cooke from Everspin Technologies Inc., for their technical support.Peer ReviewedPostprint (author's final draft

Parallel and Distributed Computing

The 14 chapters presented in this book cover a wide variety of representative works ranging from hardware design to application development. Particularly, the topics that are addressed are programmable and reconfigurable devices and systems, dependability of GPUs (General Purpose Units), network topologies, cache coherence protocols, resource allocation, scheduling algorithms, peertopeer networks, largescale network simulation, and parallel routines and algorithms. In this way, the articles included in this book constitute an excellent reference for engineers and researchers who have particular interests in each of these topics in parallel and distributed computing